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Flexible-rigid circuit board and manufacturing method

A circuit board production, soft and hard combination technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, printed circuit structure connection, etc. Plate thickness and other issues, to achieve the effect of reducing the overall thickness

Active Publication Date: 2016-03-30
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are two problems in this manufacturing method: on the one hand, the thickness of the soft board is difficult to compress, resulting in a thicker overall rigid-flex circuit board; on the other hand, when pressing the hard board on the soft board, the It is difficult to control the expansion and contraction

Method used

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  • Flexible-rigid circuit board and manufacturing method
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  • Flexible-rigid circuit board and manufacturing method

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Embodiment Construction

[0022] The rigid-flex circuit board and the manufacturing method of the rigid-flex circuit board provided by the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0023] The manufacturing method of the rigid-flex circuit board 100 provided by the embodiment of the present invention includes the steps of:

[0024] For the first step, see figure 1 , providing a first rigid substrate 11.

[0025] The first rigid substrate 11 can be a multi-layer board, a double-sided board or a single-sided board. In this embodiment, the first rigid substrate 11 is a double-sided copper-clad substrate. The first rigid substrate 11 includes a first dielectric layer 111 , a first copper foil layer 112 and a second copper foil layer 113 . The first dielectric layer 111 can be made of epoxy glass fiber cloth, phenolic resin or the like. The first copper foil layer 112 and the second copper foil layer 113 are located on oppos...

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Abstract

The invention relates to a flexible-rigid circuit board comprising first and second rigid circuit boards and a flexible circuit board. The first rigid circuit board comprises a first adhesive layer, and a first outer line layer and a first dielectric layer which are on the two sides of the first adhesive layer. The flexible circuit board comprises a third adhesive layer, first and second inner line layers adhered to the two sides of the third adhesive layer respectively, and second and fourth dielectric layers covering the first and second inner line layers respectively. The first adhesive layer glues the first and second adhesive layers. The first rigid circuit board has a first open area provided with a first groove. The second dielectric layer is exposed from the first groove. The second rigid circuit board comprises a second adhesive layer, and a second outer line layer and a third dielectric layer which are on the two sides of the second adhesive layer. The second adhesive layer glues the third and fourth dielectric layers. The second rigid circuit board has a second open area which corresponds to the first open area and is provided with a second groove. The fourth dielectric layer is exposed from the second groove. All the line layers are electrically connected through conductive via holes. The invention further relates to a flexible-rigid circuit board manufacturing method.

Description

technical field [0001] The invention relates to a soft and hard combined circuit board and a manufacturing method. Background technique [0002] Rigid-flex circuit boards have the advantages of thinness, lightness, easy assembly, stable electrical signal transmission, and good product reliability. As consumer electronic products become thinner, thinner and smaller, the application of rigid-flex circuit boards is more extensive. The manufacturing process of the traditional rigid-flex circuit board is usually to make the soft board first, and then press the hard board on the soft board. However, there are two problems in this manufacturing method: on the one hand, the thickness of the soft board is difficult to compress, resulting in a thicker overall rigid-flex circuit board; on the other hand, when pressing the hard board on the soft board, the It is difficult to control the expansion and contraction. Contents of the invention [0003] In view of this, it is necessary t...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K3/46
Inventor 李卫祥
Owner AVARY HLDG (SHENZHEN) CO LTD
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