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Cooling device and electronic equipment

A technology for heat dissipation devices and electronic components, applied in the direction of circuit heating devices, electrical equipment structural parts, electrical components, etc., can solve problems such as application restrictions, and achieve the effect of reducing the overall thickness

Pending Publication Date: 2017-09-05
TIANJIN LAIRD TECH LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the application of the above scheme in electronic equipment requiring thinner and lighter is limited

Method used

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  • Cooling device and electronic equipment
  • Cooling device and electronic equipment
  • Cooling device and electronic equipment

Examples

Experimental program
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Embodiment Construction

[0033] To clarify, when a component is said to be "set on" another component, it can be directly on the other component or there can be an intervening component as well. When a component is said to be "connected" to another component, it can be directly connected to the other component or there may be a centered component at the same time.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0035] Please also refer to Figure 1 to Figure 4 , the heat dissipation device 100 provided in the present application can be arranged on a printed circuit board to dissipate heat from electronic components arranged on the printed circuit board. The heat dissipa...

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Abstract

The invention provides a cooling device and electronic equipment. The cooling device is used for being arranged on a printed circuit board so as to cool an electronic component arranged on the printed circuit board, and the cooling device comprises a supporting mechanism, and a first heat transfer part, wherein the supporting mechanism comprises a slablike body and a connecting part arranged at the edge of the body, the body and the connecting part form an internal space for containing the electronic component, the supporting mechanism can be connected with the printed circuit board through the connecting part, the body has a first surface and a second surface, the first surface and the second surface are oppositely arranged, the first surface faces the electronic component when the supporting mechanism is connected to the printed circuit board, the first heat transfer part is arranged on the first surface and is arranged corresponding to the electronic component, the first heat transfer part is in contact with the electronic component when the supporting mechanism is connected to the printed circuit board, and the thickness of the first heat transfer part is 2-15 mils. The cooling device is suitable for cooling the electronic equipment which needs to be light and thin.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation device. [0002] The present application relates to the technical field of electronic products, in particular to an electronic device. Background technique [0003] The descriptions in this section merely provide background information related to the disclosure in this application and may not constitute prior art. [0004] Thinning and high operating speed are becoming the current development trend of electronic products. For this reason, in the design process of electronic equipment, developers always tend to use high-power and high-performance electronic components in a small-sized space, which leads to the thermal management of electronic products becoming more and more important. [0005] For example, mobile intelligent electronic products such as smartphones and tablet computers have developed rapidly in recent years. These electro...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0206H05K1/0209H05K2201/066H05K1/0225H05K2201/0715H05K7/20454H05K9/0026
Inventor 赵敬棋申景博林雪峰周杰
Owner TIANJIN LAIRD TECH LTD
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