Cooling device and electronic equipment
A technology for heat dissipation devices and electronic components, applied in the direction of circuit heating devices, electrical equipment structural parts, electrical components, etc., can solve problems such as application restrictions, and achieve the effect of reducing the overall thickness
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[0033] It should be noted that when a component is said to be "set on" another component, it can be directly on the other component or there can be a centered component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a centered component at the same time.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of this application. The terminology used in the specification of the application herein is only for the purpose of describing specific embodiments, and is not intended to limit the application.
[0035] Please refer to Figure 1 to Figure 4 The heat dissipation device 100 provided in the present application can be used to be installed on a printed circuit board to dissipate the electronic components on the printed circuit board. The heat dissipating device 100 may include: a s...
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