Heat radiation structure of LED lamp

A technology of LED lamp and heat dissipation structure, which is applied in lighting and heating equipment, cooling/heating device of lighting device, lighting device, etc., can solve problems such as affecting LED operation, incapable of significantly reducing thermal resistance, increasing volume and area, etc.

Inactive Publication Date: 2013-09-04
SHANXI SENPU LIGHTING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The higher the power of the LED, the greater the heat generation, and the heat generated by a single high-power LED and an integrated high-power LED is very concentrated. At present, the heat sink made of metal materials with good heat dissipation performance such as aluminum and copper is generally used. Its heat dissipation capacity is obviously insufficient, and increasing the volume and area can no longer significantly reduce the thermal resistance, which makes the heat energy emitted by the LED unable to be conducted and released in time, which seriously affects the work of the LED.

Method used

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  • Heat radiation structure of LED lamp
  • Heat radiation structure of LED lamp
  • Heat radiation structure of LED lamp

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Embodiment Construction

[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] as attached figure 1 , figure 2 As shown, the present invention provides an LED lamp, including a lamp housing 104, a heat sink 101, a heat absorption tube 108, and a circuit board substrate 102. The heat sink 101 is fixed on the lamp housing 104, and the heat sink 101 and the lamp The shell 104 is provided in one piece, for example cast in one piece. The circuit board substrate 102 is fixed inside the lamp housing 104 ; the bottom of the lamp housing 104 may be provided with a U-shaped slot, and the circuit board 102 is directly fixed in the U-shaped slot of the lamp housing 104 . The lamp housing 104 , the heat sink 101 and the circuit board substrate 102 are integrally formed of the same material; the heat absorbing tube 108 is mounted on the heat sink 101 . The lamp housing 104, the heat sink 101 and the circuit board substrate...

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Abstract

The invention discloses an LED lamp radiator structure, which comprises radiating fins and a heat-absorbing pipe, wherein, the heat-absorbing pipe is arranged on the radiating fins for rapid absorption of the heat from the radiating fins. The heat-absorbing pipe is provided with at least one open end. A lamp shell, the radiating fins and a circuit board base plate are integrated by the same material, therefore, the amount of thermal resistance is reduced; at the same time an insulating oxide layer is connected with the radiating fins through seamless connectivity, thus greatly reducing the thermal resistance. As the heat-absorbing pipe and the radiating fins are adopted for heat radiation, the thermal conductivity and thermal dissipation performance is greatly improved, and the LED lamp radiator structure is especially applicable to be used for heat radiation of a high-power LED lamphouse.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of an LED lamp. Background technique [0002] With the development of semiconductor lighting technology, LED has gradually developed from traditional low power to single high power and integrated high power. However, LED can only work normally under a certain temperature. The higher the power of the LED, the greater the heat generation, and the heat generated by a single high-power LED and an integrated high-power LED is very concentrated. At present, the heat sink made of metal materials with good heat dissipation performance such as aluminum and copper is generally used. Its heat dissipation capacity is obviously insufficient, and increasing the volume and area can no longer significantly reduce the thermal resistance, which makes the heat energy emitted by the LED unable to be conducted and released in time, which seriously affects the work of the LE...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/67F21V29/76F21V29/83F21Y115/10
CPCH01L2924/0002
Inventor 商松
Owner SHANXI SENPU LIGHTING TECH
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