Heat radiation structure of LED lamp

A technology of LED lamp and heat dissipation structure, which is applied in lighting and heating equipment, cooling/heating device of lighting device, lighting device, etc., can solve problems such as affecting LED operation, incapable of significantly reducing thermal resistance, increasing volume and area, etc.
CN101377294BInactive Publication Date: 2013-09-04SHANXI SENPU LIGHTING TECH

Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
SHANXI SENPU LIGHTING TECH
Publication Date
2013-09-04
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses an LED lamp radiator structure, which comprises radiating fins and a heat-absorbing pipe, wherein, the heat-absorbing pipe is arranged on the radiating fins for rapid absorption of the heat from the radiating fins. The heat-absorbing pipe is provided with at least one open end. A lamp shell, the radiating fins and a circuit board base plate are integrated by the same material, therefore, the amount of thermal resistance is reduced; at the same time an insulating oxide layer is connected with the radiating fins through seamless connectivity, thus greatly reducing the thermal resistance. As the heat-absorbing pipe and the radiating fins are adopted for heat radiation, the thermal conductivity and thermal dissipation performance is greatly improved, and the LED lamp radiator structure is especially applicable to be used for heat radiation of a high-power LED lamphouse.
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Description

technical field

[0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of an LED lamp. Background technique

[0002] With the development of semiconductor lighting technology, LED has gradually developed from traditional low power to single high power and integrated high power. However, LED can only work normally under a certain temperature. The higher the power of the LED, the greater the heat generation, and the heat generated by a single high-power LED and an integrated high-power LED is very concentrated. At present, the heat sink made of metal materials with good heat dissipation performance such as aluminum and copper is generally used. Its heat dissipation capacity is obviously insufficient, and increasing the volume and area can no longer significantly reduce the thermal resistance, which makes the heat energy emitted by the LED unable to be conducted and released in time, which seriously affects the work of the LE...

Claims

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