LED lamp

A technology for LED lamps and lamp housings, which can be applied to the loss prevention measures of lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., and can solve the problems of high cost, difficult heat dissipation characteristics, and high energy consumption.

Inactive Publication Date: 2010-02-17
BEIJING ZHONGQING MICRO ELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its shortcomings: first, the preparation process is complicated, energy consumption is large, and the cost is high; second, due to its processing technology requirements and material characteristics, it is not easy to make a structure with heat dissipation characteristics

Method used

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  • LED lamp
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Experimental program
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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as figure 1 , figure 2 As shown, the present invention provides an LED lamp, which includes a lamp housing 104, a heat sink 101, a circuit board substrate 102, and an LED light-emitting diode 103. The heat sink 101 is fixed outside the lamp housing 104, and the circuit board substrate 102 It is fixed inside the lamp housing 104; the lamp housing 104, the heat sink 101 and the circuit board substrate 102 are integrally formed of the same material.

[0023] For example, copper composite materials, silver composite materials, aluminum composite materials or other alloy composite materials are used. The above various composite materials are formed by adding other different metal materials according to the properties of different metals and according to the needs of the design. They have very good heat dissipation and ductility.

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PUM

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Abstract

The invention discloses an LED lamp, which comprises a lamp housing, a radiating fin, a circuit board substrate and a light-emitting diode (LED), wherein the radiating fin is fixed outside the lamp housing, and the circuit board substrate is fixed inside the lamp housing; and the lamp housing, the radiating fin and the circuit board substrate are integrally made from the same material. The lamp housing, the radiating fin and the circuit board substrate are made of ceramics; or the lamp housing, the radiating fin and the circuit board substrate are made of aluminum composite panels. The radiating fin and the circuit board substrate are integrally made from the same material, so the amount of formed thermal resistance is reduced; and simultaneously, the seamless connection of an insulating oxide layer and the radiating fin greatly reduces thermal resistance values, so the radiating effect is improved.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp with a cooling device. Background technique [0002] With the rapid development of electronic technology, electronic components are increasingly miniaturized, especially the development of high-power LEDs, which makes the heat generation per unit volume of components rise step by step, which will seriously affect the performance improvement and work of components. reliability. There is an urgent need for a semiconductor packaging substrate with low cost, high heat dissipation, and compliance with international environmental protection trends. In addition to conventional heat dissipation technologies, such as heat sinks of various shapes and materials, aluminum-based copper-clad laminates, etc., some novel heat dissipation technologies have also been invented. US5000662 and US5408575 describe adopting ceramics or coating ceramics on the outside of a metal plate as a substrate, then usi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21V15/02H01L23/373F21Y101/02F21V29/76F21V29/85F21V29/89
Inventor 商松
Owner BEIJING ZHONGQING MICRO ELECTRIC TECH
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