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Heat dissipation structure of LED lamp

A technology of heat dissipation structure and LED lamp, which is applied in cooling/heating devices of lighting devices, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., and can solve the problem of increasing volume and area, inability to conduct and release heat energy in time, and heat dissipation Insufficient capacity and other problems, to achieve the effect of improving thermal conductivity and heat dissipation performance

Inactive Publication Date: 2014-07-02
KUNSHAN DONGDA ZHIHUI TECH CONSULTANT
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The higher the power of the LED, the greater the heat generation, and the heat generated by a single high-power LED and an integrated high-power LED is very concentrated. At present, the heat sink made of metal materials with good heat dissipation performance such as aluminum and copper is generally used. Its heat dissipation capacity is obviously insufficient, and increasing the volume and area can no longer significantly reduce the thermal resistance, which makes the heat energy emitted by the LED unable to be conducted and released in time, which seriously affects the work of the LED.

Method used

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  • Heat dissipation structure of LED lamp
  • Heat dissipation structure of LED lamp

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Embodiment Construction

[0010] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0011] as attached figure 1 , figure 2 As shown, the present invention provides an LED lamp, which includes a lamp housing 104, a heat sink 101, and a circuit board substrate 102. The heat sink 101 is fixed on the lamp housing 104, and the heat sink 101 and the lamp housing 104 are integrated. , such as one-piece casting. The circuit board substrate 102 is fixed inside the lamp housing 104 ; the bottom of the lamp housing 104 may be provided with a U-shaped slot, and the circuit board 102 is directly fixed in the U-shaped slot of the lamp housing 104 . The lamp housing 104, the heat sink 101 and the circuit board substrate 102 are integrally formed of the same material, and the lamp housing 104, the heat sink 101 and the circuit board substrate 102 are integrated, which is very beneficial Dissipation of heat: LED light-emitting diodes are...

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Abstract

A heat dissipation structure of an LED lamp comprises a lamp shell, a circuit board substrate, a heat dissipation piece and an air guiding pipe. The lamp shell, the heat dissipation piece and the circuit board substrate are integrally formed by the same materials, and are hollow and communicated. The end portion of a heat dissipation piece body of the heat dissipation piece is provided with an air inlet, the end portion of a heat dissipation piece body of the heat dissipation piece is provided with an air outlet, and a fan is arranged at an air inlet of an air inlet pipe.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of an LED lamp. Background technique [0002] With the development of semiconductor lighting technology, LED has gradually developed from traditional low power to single high power and integrated high power. However, LED can only work normally under a certain temperature. The higher the power of the LED, the greater the heat generation, and the heat generated by a single high-power LED and an integrated high-power LED is very concentrated. At present, the heat sink made of metal materials with good heat dissipation performance such as aluminum and copper is generally used. Its heat dissipation capacity is obviously insufficient, and increasing the volume and area can no longer significantly reduce the thermal resistance, which makes the heat energy emitted by the LED unable to be conducted and released in time, which seriously affects the work of the LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/02F21Y101/02F21V29/67F21V29/76F21Y115/10
Inventor 不公告发明人
Owner KUNSHAN DONGDA ZHIHUI TECH CONSULTANT
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