Ultrathin heat dissipation device and heat dissipation method

A heat dissipation device and ultra-thin technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. The effect of cooling efficiency

Inactive Publication Date: 2021-09-24
YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problem of difficult heat dissipation of small and medium-sized electronic products in the prior art, and provide an ultra-thin heat dissipation device and heat dissipation method with small volume and high heat dissipation efficiency

Method used

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  • Ultrathin heat dissipation device and heat dissipation method
  • Ultrathin heat dissipation device and heat dissipation method
  • Ultrathin heat dissipation device and heat dissipation method

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Embodiment Construction

[0025] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0026] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations thereof such as "includes" or "includes" and the like will be understood to include the stated elements or constituents, and not Other elements or other components are not excluded.

[0027] Such as Figure 1 to Figure 5 As shown, an ultra-thin heat dissipation device includes a heat collector 1 and an electromagnetic pump 2, and the heat collector 1 and the electromagnetic pump 2 are connected end to end through a heat dissipation flow channel 3 to form a closed loop. Specifically, the heat collector 1 is made of copper and has a liquid metal flow channel inside. The size of the internal flow channel o...

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Abstract

The invention discloses an ultrathin heat dissipation device and a heat dissipation method, and belongs to the technical field of electronic product heat dissipation. The ultrathin heat dissipation device comprises a heat collector and an electromagnetic pump, the heat collector and the electromagnetic pump are connected end to end through a heat dissipation flow channel to form a closed loop, and the heat collector, the electromagnetic pump and the heat dissipation flow channel are all installed on a bottom plate. And the bottom plate is a first electrode plate of the electromagnetic pump. The heat collector is in direct contact with a heating part to absorb heat of the heating part, and the electromagnetic pump drives the liquid metal to flow through the heat collector to take away the heat absorbed by the heat collector. The bottom plate has multiple purposes, besides the heat dissipation function, the functions of the electromagnetic pump electrode, the heat dissipation flow channel wall and the component supporting plate are further achieved, the system is ultrathin, the liquid metal fluid heat dissipation device is particularly suitable for heat dissipation of narrow spaces such as mobile phones, tablet personal computers and ultrathin laptops, and the liquid metal fluid heat dissipation method is high in heat dissipation efficiency. Compared with a common ultrathin heat pipe, the heat dissipation efficiency is improved by more than 73%.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to an ultra-thin heat dissipation device and a heat dissipation method, which are mainly applied to the heat dissipation of small-volume electronic products including but not limited to mobile phones, tablet computers, and ultra-thin notebook computers. Background technique [0002] At present, the most basic heat dissipation methods include air cooling, water cooling, and passive radiation heat dissipation. Other heat dissipation methods are nested or combined on this basis. Water cooling cannot be used in a small space due to its large volume; air cooling requires air inlet / outlet, which is easy to bring external dust into the system and affect the normal operation of the system, and the heat dissipation capacity is limited due to its small size. At present, the mainstream heat dissipation method in small spaces such as mobile phones and tablets is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272H05K7/20281
Inventor 董楠何霄刘静
Owner YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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