Ultra-thin reticular self-vibration heat pipe heat dissipation film and processing method thereof

Abstract

An ultra-thin reticular self-vibration heat pipe heat dissipation film is formed by stacking a reticular groove base and a copper piece layer. The reticular groove base is provided with a bottom face and a groove face, and a reticular groove is formed in the groove face. The copper piece layer is stacked on the groove face on the reticular groove base, the reticular groove base is made of 0.1-0.2 mm metal or non-metal, the depth of the reticular groove is 0.05mm to 0.09 mm, and the thickness of a copper piece is 0.03mm to 0.1 mm. The invention further provides a method for processing the heat dissipation film with an ultra-thin structure. By means of the processing method, the ultra-thin structure difficultly formed by means of an existing press forming or casting forming technology and the like can be obtained, the ultra-thin heat dissipation film with large area can be manufactured, and the ultra-thin reticular self-vibration heat pipe heat dissipation film is especially suitable for heat dissipation of small devices, such as mobile phones.

Description

technical field [0001] The invention relates to an ultra-thin heat dissipation device and a processing method thereof, in particular to an ultra-thin mesh self-oscillating heat pipe heat dissipation film and a processing method thereof. Background technique [0002] At present, the heat dissipation of mobile phones mainly uses heat-conducting sheets such as thermal-conducting glue, graphite, and copper-carbon bodies. The thermal conductivity of these heat-conducting sheets in the plane direction is at most within 1500W / (m·k), and the heat-conducting effect has reached a limit. [0003] CN 102759291A discloses a self-excited oscillating flow heat pipe with mesh pipes. The heat pipe is composed of two layers of metal plates. At least one layer of metal plates is integrally formed with a groove. The spliced ​​surface constitutes a pipeline for sealing the working fluid. Viewed from a direction perpendicular to the plane of the metal plate, the grooves are arranged in a criss-cr...

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned heat pipes are mostly used for heat conduction of relatively large / large heat sources, such as street lamps, liquid crystal backplanes, etc. This is because the metal plates constituting the heat pipes are mostly formed by stamping process to form mesh grooves. Due to the limitation of the process, the metal plates should not be too thin , otherwise it is easy to be stamped and damaged, so that the overall thickness of the heat pipe cannot be made very thin, which limits its use in heat conduction of small devices such as mobile phones

Images