Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Main control board over-temperature protection method and communication equipment

A technology for communication equipment and over-temperature protection, which is applied to the structural parts of electrical equipment, temperature control, non-electric variable control, etc., which can solve problems such as equipment fire, damage to the main control board, and impact on equipment business processing, so as to prolong the service life , to avoid fire, to achieve the effect of over-temperature protection

Inactive Publication Date: 2018-10-09
NEW H3C TECH CO LTD
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing solution, although the over-temperature protection of the service board and the SFU can be realized through the main control board, the main control board itself has no over-temperature protection function, and the main control board will be damaged if it is overheated for a long time. Even cause the equipment to catch fire, thereby affecting the business processing of the entire equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Main control board over-temperature protection method and communication equipment
  • Main control board over-temperature protection method and communication equipment
  • Main control board over-temperature protection method and communication equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0020] It should be noted that like numerals and let...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides a main control board over-temperature protection method and communication equipment and relates to the heat dissipation technology field. The method comprisesthe following steps of acquiring the temperature information of the main control board of communication equipment; when the temperature information of the main control board exceeds a preset first over-temperature turn-off threshold, if the communication equipment has no standby board, carrying out power off processing by the main control board; and if the communication equipment has the standby board, after the standby board and the main control board carry out main / standby switching, carrying out power off processing by the main control board. A problem that the main control board is under an over-temperature state for a long time so that the equipment is on fire is avoided, the over-temperature protection of the main control board is realized, the service life of the main control boardis prolonged to some extent and user investment cost is saved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a method for over-temperature protection of a main control board and a communication device. Background technique [0002] With the gradual increase of power consumption of communication equipment, over-temperature protection of communication equipment is particularly important. When a communication device is running, if a fan fails, the temperature of each board inside the device will rise. If the fan fails for a long time, chips on the board may be damaged, and in extreme cases, the device may even catch fire. To reduce the impact of fan failures on communication devices, the main control board usually monitors the temperatures of service boards and SFUs at regular intervals, and controls the service boards or SFUs to power off when the service boards or SFUs are overheated. [0003] In the existing solution, although the over-temperature protection of the service boa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/20H05K7/20
CPCG05D23/20H05K7/20136H05K7/20209
Inventor 曹晓波
Owner NEW H3C TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com