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36results about How to "Implement over-temperature protection" patented technology

High-frequency low-loss planar transformer core structure

ActiveCN122177638Breduce vibrationReduce eddy current lossThermal dilatationMagnetic composite
This invention discloses a high-frequency, low-loss planar transformer core structure, relating to the field of planar transformer technology. It includes a multi-layered outer shell; a core support component is adjustable on the top of the multi-layered shell; modular core components are mounted and fixed on the core support component; magnetic flux at the air gap edge is eliminated through a composite magnetic circuit of ferrite and soft magnetic composite materials, reducing eddy current losses; and elastically pre-tightened core columns ensure magnetic circuit stability. A three-stage heat dissipation system is employed, consisting of heat pipe equalization, microchannel liquid cooling, and shell radiation, reducing the hot spot temperature difference to within 5°C and achieving a thermal resistance of only 0.05 K / W. Elastic gaps compensate for assembly tolerances and thermal expansion, guide locking enables precise positioning, and shock absorbers attenuate vibration by more than 80%. Integrated temperature, pressure, and strain sensors provide over-temperature protection, dynamic heat dissipation, and stress warning.
Owner:福建鸿泰达科技有限责任公司

Plastic package device with NTC (Negative Temperature Coefficient)

The name of the utility model is a plastic package device with NTC. Belongs to the technical field of plastic package device manufacturing. The plastic package device mainly solves the problem that the existing plastic package device is not provided with temperature protection and is easy to damage due to overheating in the use process. The utility model is mainly characterized by comprising a frame, frame pins connected with the frame, a chip and an NTC (Negative Temperature Coefficient) resistor which are arranged on the frame, and a plastic package body for packaging the frame, the chip, the NTC resistor and part of the frame pins, wherein the chip is electrically connected with the frame pins through metal wires; the NTC resistor is arranged on the frame, the frame pins comprise resistor frame pins corresponding to the NTC resistor, and the NTC resistor is electrically connected with the resistor frame pins through metal wires. The over-temperature protection circuit has the characteristics of carrying out temperature detection and over-temperature control on a device in real time and realizing over-temperature protection on a product and a used circuit, and is mainly used for plastic package devices.
Owner:HUBEI TECH SEMICON