Link and server

A link and impedance value technology, applied in the server field, to achieve the effect of improving impedance continuity, improving signal transmission quality, and optimizing impedance value

Active Publication Date: 2018-10-19
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a link and server to solve the problem of how to optimize the impedance at the via hole

Method used

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] The embodiment of the present invention discloses a link and a server to solve the problem of how to optimize the impedance at the via hole.

[0042] see figure 1 , a link provided by an embodiment of the present invention, specifically includes:

[0043] The first trace 1; the second trace 2; the via 3 provided between the first trace 1 and the second trace 2; connected to both the first trace 1 and the via 3 The first transition area routing 4; the secon...

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Abstract

The present application discloses a link including a first wire; a second wire; a via hole disposed between the first wire and the second wire; a first transition zone wire connected to the first wireand the via hole; a second transition zone wire connected to the second wire and the via hole. The first transition zone wire and the second transition zone wire are provided in advance with preset impedance values to improve link impedance continuity. It can be seen that by arranging the first transition zone wire and the second transition zone wire between the via hole and the first wire and between the via hole the second wire respectively, providing the first transition zone wire and the second transition zone wire with the preset impedance values, and setting the optimal impedance valuesfor the transition zones, the impedance characteristic at the via hole can be changed so as to further optimize the impedance value of the entire link. Thus, it is convenient to improve link impedance continuity and improve signal transmission quality without adjust an anti-pad. The application also provides a server which can also solve the above technical problem.

Description

technical field [0001] The present invention relates to the technical field of servers, and more specifically, to a link and a server. Background technique [0002] With the continuous development of computer technology, among many factors that determine system performance, the phenomenon of high-speed interconnection is playing a leading role. In high-speed link design, in order to avoid some unforeseen problems, it is necessary to optimize each module as much as possible. [0003] In the design process of high-speed signal links in server systems, the optimal design of link impedance is particularly important. If the link impedances cross continuously, it will cause signal reflection, increase link loss, and then affect the quality of signal transmission, and even lead to design failure. [0004] In link design, vias are an important factor affecting the continuity of link impedance. Under high frequency conditions, vias will show parasitic capacitance and parasitic induc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/115
Inventor 荣世立
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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