A printing machine for through-hole silver paste on pcb board

A technology for PCB boards and printing machines, which is applied in the field of printing machines for silver paste through-holes on PCB boards, to achieve the effect of reducing pollution
CN108770237BActive Publication Date: 2019-08-02HANGZHOU LINAN PENGYU ELECTRONICS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
HANGZHOU LINAN PENGYU ELECTRONICS
Publication Date
2019-08-02

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Abstract

The invention relates to the technical field of circuit board printing, in particular relates to a printing machine for penetrating a hole with silver paste of a PCB. The printing machine comprises aworkbench, a lifting rack, a mesh plate and a controller, wherein the lifting rack is arranged on the workbench, the mesh plate is arranged on the lifting rack, the controller is used for controllingthe lifting rack to ascend and descend, a cushion plate is arranged on the workbench arranged below the mesh plate and is used for placing a circuit board, a cleaning brush is arranged on the workbench and is used for cleaning the cushion plate, a driving device is arranged on the workbench and is used for driving the cleaning brush to move and clean along a surface of the cushion plate in a reciprocating way, the driving device is electrically connected with the controller, the controller is used for controlling the driving device to work, and the lifting rack and the driving device asynchronously work. The printing machine for penetrating the hole with the silver paste of the PCB has the advantage that the pollution of the cushion plate is reduced.
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Description

technical field

[0001] The invention relates to the technical field of circuit board printing, more specifically, it relates to a printing machine for through-hole silver paste on a PCB board. Background technique

[0002] Silver paste through-hole printing is a new technology for making double-sided panels. It uses a physical method to connect through the conductive lines on both sides. Its production technology is to use silver conductive paste to penetrate into the prefabricated holes through the missing printing of the screen screen, and then use the capillary principle to penetrate the silver paste into the through holes of the circuit board, so that the through holes are filled. Silver conductive ink to form interconnection conduction.

[0003] The silver paste through-hole printing commonly used in the industry currently uses the screen, scraper, and backing plate in the printing machine to fix the backing plate on the printing machine table for placing circuit boar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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