Semiconductor component with double-sided heat conduction and heat dissipation structure

Abstract

The present invention is applicable to the technical field of electronic equipment, and provides a semiconductor element with a double-sided heat-conducting and heat-dissipating structure, including a substrate, a chip, a conductor connected to the chip at one end, a pin connected to the other end of the conductor, a glue seat and a heat-conducting and heat-dissipating plate; a window is provided on the glue seat, one end of the heat-conducting and heat-dissipating plate is attached to the chip, and the other end extends out of the chip. The present invention provides a window on the glue seat corresponding to the position of the chip, and a heat-conducting and heat-dissipating plate attached to the chip is arranged in the window, and one side of the chip can be attached to the heat-conducting and heat-dissipating plate, and the other side can be attached to the substrate, so that the heat of the chip can be transferred to the substrate and the heat-conducting and heat-dissipating plate respectively and diffused, that is, the semiconductor element can diffuse the heat of the chip on both sides, thereby improving the heat dissipation effect of the semiconductor element; the chip is connected to the pin by a conductor, and the conductor can also transfer part of the heat of the chip to the pin and diffuse it, further improving the heat dissipation effect.

Description

Technical Field

[0001] The present invention is applicable to the technical field of electronic equipment, and more specifically, relates to a semiconductor element with a double-sided heat conduction and heat dissipation structure. Background Art

[0002] Semiconductor devices refer to objects whose electrical conductivity at room temperature is between that of conductors and insulators. Since their conductivity can be controlled, ranging from insulators to conductors, they are widely used in the field of electronic equipment technology.

[0003] Existing semiconductor devices mainly transfer heat to the PCB (Printed Circuit Board) attached to it through the metal sheet of the chip itself, and then transfer the heat to the surrounding components to achieve heat dissipation. Since semiconductor devices can only achieve one-sided heat dissipation, the heat dissipation effect of semiconductor devices is poor, which will affect the working performance and efficiency of semiconductor devices. Excessive temperature may even burn the chip, seriously affecting the service life of semiconductor devices. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor element with a double-sided heat conduction and heat dissipation structure to solve the problem of poor heat conduction and heat dissipation effect of semiconductor devices in the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a semiconductor element with a double-sided heat-conducting and heat-dissipating structure, including a substrate, a chip arranged on the substrate, pins electrically connected to the chip, a glue seat and a heat-conducting and heat-dissipating plate that are solidified and formed on the substrate and seal and fix the chip and the pins; a window is opened on the glue seat corresponding to the position of the chip, one end of the heat-conducting and heat-dissipating plate is attached to the chip through the window, and the other end of the heat-conducting and heat-dissipating plate extends out of the chip, and the glue seat seals and wraps the periphery of the heat-conducting and heat-dissipating plate.

[0006] Furthermore, the thermally conductive heat sink includes a first sheet, a second sheet bent at one end of the first sheet toward the chip, and a third sheet parallel to the first sheet and bent toward away from the first sheet at the free end of the second sheet, the second sheet is perpendicular to the first sheet, the third sheet is perpendicular to the second sheet, the first sheet is flush with the top surface of the glue seat, and the third sheet is bonded to the chip.

[0007] Furthermore, the pin includes a first connection pin fixed on the adhesive seat, and the semiconductor element with a double-sided heat conduction and heat dissipation structure also includes a conductive wire electrically connecting the first connection pin to the chip.

[0008] Furthermore, the pin further includes a second connection pin fixed on the adhesive seat, and the semiconductor element with a double-sided heat conduction and heat dissipation structure further includes a conductive sheet electrically connecting the second connection pin to the chip.

[0009] Furthermore, the conductive sheet includes a first section, a second section bent at one end of the first section toward the chip, and a third section parallel to the first section and bent toward away from the first section at the free end of the second section, the second section is perpendicular to the first section, the third section is perpendicular to the second section, one end of the second connecting pin is bonded to the first section, the other end of the second connecting pin extends out of the glue seat, and the third section is bonded to the chip.

[0010] Furthermore, the length of the second connecting pin is greater than the length of the first connecting pin.

[0011] Furthermore, the thickness of the heat-conducting heat sink is greater than the thickness of the conductive sheet.

[0012] Furthermore, there are several substrates, each of which includes a base plate and connecting plates arranged at two ends of the base plate, and the chip is arranged on the base plate.

[0013] Furthermore, each of the connecting plates includes a first section bent at the corresponding end of the substrate toward the chip, a second section bent at the free end of the first section toward a direction away from the chip, and a third section bent at the free end of the second section toward the substrate, the first section is perpendicular to the substrate, the second section is perpendicular to the first section, and the third section is perpendicular to the second section.

[0014] Furthermore, each of the substrates further includes a connecting strip extending outward from one end of each of the substrates, each of the connecting strips is fixed on the adhesive seat, and each of the connecting strips and the corresponding substrate are on the same plane.

[0015] The beneficial effects of the semiconductor element with a double-sided heat-conducting and heat-dissipating structure provided by the present invention are as follows: compared with the prior art, the present invention forms and fixes the substrate, chip and pins through a glue seat, so that the chip and the pins are firmly supported and fixed; a window is opened on the glue seat and at a position corresponding to the chip, a heat-conducting and heat-dissipating plate bonded to the chip is provided in the window, the chip is provided between the heat-conducting and heat-dissipating plate and the substrate, and one side of the chip can be bonded to the heat-conducting and heat-dissipating plate, and the other side can be bonded to the substrate, so that the heat of the chip can be transferred to the substrate and the heat-conducting and heat-dissipating plate respectively and diffused, that is, the semiconductor element can diffuse the heat of the chip on both sides, thereby improving the heat dissipation effect of the semiconductor element, improving its use effect and extending its service life; the chip is connected to the pin by a conductor, and the conductor can also transfer part of the heat of the chip to the pin and diffuse it, further improving the heat dissipation effect, thereby improving the use effect of the semiconductor element and extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the front structure of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the back structure of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention;

[0019] Figure 3 A front view of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention;

[0020] Figure 4 An exploded schematic diagram of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention;

[0021] Figure 5 for Figure 3 Sectional view in the AA direction;

[0022] Figure 6 A front view of a heat-conducting heat sink provided in Embodiment 1 of the present invention;

[0023] Figure 7 A front view of a conductive sheet provided in Embodiment 1 of the present invention;

[0024] Figure 8A schematic diagram of the structure of the connection between the first substrate and the chip provided in the first embodiment of the present invention;

[0025] Fig. 9 A schematic diagram of the structure of the connection between the second substrate and the chip provided in the first embodiment of the present invention;

[0026] Fig.10 Schematic diagram of the structure of the adhesive base provided in the first embodiment of the present invention Figure 1 ;

[0027] Fig.11 Schematic diagram of the structure of the adhesive base provided in the first embodiment of the present invention Figure 2 ;

[0028] Fig.12 A schematic diagram of the front structure of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the second embodiment of the present invention;

[0029] Fig.13 A schematic diagram of the back structure of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the second embodiment of the present invention.

[0030] Among them, the main marks of the drawings in the figure are:

[0031] 1- Chip;

[0032] 2-substrate; 21-first substrate; 22-second substrate; 23-base plate; 231-slot; 24-connecting plate; 241-first section; 242-second section; 243-third section; 25-connecting strip;

[0033] 3-pin; 31-first connection pin; 32-second connection pin; 33-third connection pin;

[0034] 4-rubber seat; 40-opening window; 41-support bar; 42-positioning groove; 43-accommodating groove; 44-notch; 45-support block; 46-first groove; 47-second groove; 48-third groove; 49-card hole;

[0035] 51-heat-conducting heat sink; 511-first sheet; 512-second sheet; 513-third sheet; 52-conductive sheet; 521-first section; 522-second section; 523-third section;

[0036] 6- Conductor. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Embodiment 1:

[0043] Please also read Figures 1 to 11 , the semiconductor element with a double-sided heat-conducting and heat-dissipating structure provided in the first embodiment of the present invention is now described. The semiconductor element includes a substrate 2, a chip 1 disposed on the substrate 2, a pin 3 electrically connected to the chip 1 through a conductor 6, and a glue seat 4 fixedly formed on the substrate 2 and sealingly fixing the chip 1 and the pin 3. A window 40 is provided on the glue seat 4 at a position corresponding to the chip 1. The semiconductor element also includes a heat-conducting and heat-dissipating plate 51 disposed in the window 40. The window 40 can wrap and fix the periphery of the heat-conducting and heat-dissipating plate 51. The chip 1 is disposed between the heat-conducting and heat-dissipating plate 51 and the substrate 2. The top surface of the chip 1 is in contact with the bottom surface of the heat-conducting and heat-dissipating plate 51, and the bottom surface of the chip 1 is in contact with the top surface of the substrate 2.

[0044] The substrate 2 may be two pieces, and the two substrates 2 are respectively provided with the chip 1, and the adhesive seat 4 is provided with two openings 40 for accommodating the heat conduction and heat dissipation plates 51. For the convenience of description, the two substrates 2 are respectively named as the first substrate 21 and the second substrate 22, and the first substrate 21 and the second substrate 22 are arranged on the adhesive seat 4 at intervals.

[0045] The conductor 6 may be made of copper material, which has excellent thermal conductivity, heat dissipation and electrical conductivity.

[0046] The conductive sheet 52 may be a metal sheet or metal wire made of a highly conductive metal material for heat and electricity conduction, such as aluminum, copper, gold, silver, nickel, etc. In other embodiments, it may be replaced by a wire to achieve the conductive function, which is not limited here.

[0047] The model of the semiconductor element is TDP1610, where TDP (Thermal Design Power) refers to the package name; 1610 refers to the package size, specifically 10 in width and 16 in length, and the unit value can be adjusted according to actual production, such as mm, cm, dm, etc. In other embodiments, the size of the electronic components and the number of pins 3 can be adjusted according to actual production, and are not limited here.

[0048] The above-mentioned adhesive seat 4 can be formed by curing epoxy resin material, and can also be made of other insulating materials, which is not limited here.

[0049] The steps for assembling the semiconductor component are as follows:

[0050] 1. Place the substrate 2 in the cavity, set the chip 1 on the substrate 2, fix the pin 3 at the corresponding position of the cavity, and electrically connect it to the chip 1 through the conductor 6;

[0051] 2. A glue seat 4 is formed by injecting glue into the cavity and sealing and curing the glue to seal and fix the substrate 2, the chip 1 and each lead 3;

[0052] 3. A window 40 is opened on the adhesive seat 4 at a position corresponding to the chip 1 , and a heat-conducting heat sink 51 is bonded to the adhesive seat 4 . One end of the heat-conducting heat sink 51 is bonded to the support bar 41 , and the other end is in contact with the chip 1 .

[0053] Alternatively, the substrate 2, chip 1, pin 3 and heat-conducting heat sink 51 are fixed at corresponding positions of the cavity respectively, and a glue seat 4 is formed by injecting glue into the cavity for sealing and curing, so as to form a semiconductor element at one time, thereby improving the manufacturing efficiency.

[0054] The serial numbers of the steps in the above-mentioned semiconductor component assembly process do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and can be adjusted according to actual production, but should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0055] Since the semiconductor element can dissipate heat from both sides, the semiconductor element can be used on both sides, and this is not limited here.

[0056] The semiconductor element with a double-sided heat-conducting and heat-dissipating structure provided by the present invention, compared with the prior art, uses a glue seat 4 to seal and fix the substrate 2, chip 1 and pin 3, so that the support, seal and fixation of the chip 1 and the pin 3 are firm; a window 40 is opened on the glue seat 4 and corresponds to the position of the chip 1, and a heat-conducting and heat-dissipating plate 51 that is bonded to the chip 1 is provided in the window 40, and the chip 1 is arranged between the heat-conducting and heat-dissipating plate 51 and the substrate 2, and one side of the chip 1 can be bonded to the heat-conducting and heat-dissipating plate 51, and the other side can be bonded to the substrate 2, so that the heat of the chip 1 can be transferred to the substrate 2 and the heat-conducting and heat-dissipating plate 51 respectively and diffused, that is, the semiconductor element can diffuse the heat of the chip 1 on both sides, thereby improving the heat dissipation effect of the semiconductor element; by providing a support bar 41 in the window 40, it is convenient to support and fix the heat-conducting and heat-dissipating plate 51.

[0057] The present invention can simultaneously reduce electrical internal resistance, increase passing current, improve electrical energy efficiency and power, and reduce the temperature of components and products.

[0058] Compared with conventional device packaging, the semiconductor element of the present invention has the advantages of reducing production materials, simplifying production processes, thereby reducing device costs, and improving production efficiency.

[0059] Compared with traditional device packaging, the semiconductor element of the present invention does not require cumbersome manual processes when producing PCBA (Printed Circuit Board Assembly), and 100% of the work is done by machines, thereby improving production efficiency and reducing production costs.

[0060] For further information, please also refer to Figure 4 and Figure 6As a specific implementation of a semiconductor element with a double-sided heat-conducting and heat-dissipating structure provided in the first embodiment of the present invention, the heat-conducting and heat-dissipating plate 51 includes a first sheet 511, a second sheet 512 bent at one end of the first sheet 511 toward the chip 1, and a third sheet 513 bent at the free end of the second sheet 512 parallel to the first sheet 511 and toward a direction away from the first sheet 511, the second sheet 512 is perpendicular to the first sheet 511, the third sheet 513 is perpendicular to the second sheet 512, the first sheet 511 is flush with the top surface of the adhesive seat 4, and the third sheet 513 is attached to the chip 1. Specifically, the first sheet 511 is flush with the top surface of the adhesive seat 4, the third sheet 513 forms a step surface with the first sheet 511, and the third sheet 513 is spaced apart from the top surface of the adhesive seat 4. In this structure, by bending the heat-conducting and heat-dissipating plate 51 to form the first sheet 511, the second sheet 512 and the third sheet 513, the heat diffusion area can be effectively increased, and the heat dissipation effect of the chip 1 can be effectively improved. In other embodiments, the configuration of the heat-conducting heat dissipation plate 51 may also be adjusted according to actual production, and is not limited thereto herein.

[0061] For further information, please also refer to Figure 4 As a specific implementation of the semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, the pin 3 includes a first connection pin 31 fixed on the glue seat 4, and the conductor 6 includes a conductive wire that electrically connects the first connection pin 31 to the chip 1. Specifically, one end of the first connection pin 31 is electrically connected to the chip 1 through the conductive wire, and the other end extends out of the glue seat 4 to be connected to an external device; the first connection pin 31 is located on one side of the first substrate 21, and the first groove 46 for supporting and fixing the first connection pin 31 is provided on the cured glue seat 4. This structure facilitates the support and fixation of the first connection pin 31, and can effectively realize the electrical connection with the chip 1, and realize electrical connection with different external devices in multiple directions and angles.

[0062] For further information, please also refer to Figure 4As a specific implementation of the semiconductor element with double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, the pin 3 also includes a second connection pin 32 fixed on the glue seat 4, and the conductor 6 also includes a conductive sheet 52 that electrically connects the second connection pin 32 to the chip 1. Specifically, one end of the second connection pin 32 is electrically connected to the chip 1 through the conductive sheet 52, and the other end extends out of the glue seat 4 to connect with an external device; the first connection pin 31 and the second connection pin 32 are arranged on the same side of the first substrate 21 and the second substrate 22 at intervals. The glue seat 4 after curing and forming has a second groove 47 for supporting and fixing the second connection pin 32; a third connection pin 33 is arranged on one side of the second substrate 22, and the third connection pin 33 is also electrically connected to the chip 1 through a conductive wire, one end of the third connection pin 33 is fixed on the glue seat 4, and the other end extends out of the glue seat 4 to connect with an external device; the glue seat 4 after curing and forming has a third groove 48 for supporting and fixing the third connection pin 33. This structure facilitates the support and fixation of the second connection pin 32, and can effectively realize the electrical connection with the chip 1, and realize the electrical connection with different external devices in multiple directions and angles.

[0063] The conductive sheet 52 may be a metal sheet or metal wire made of a highly conductive metal material for heat and electricity conduction, such as aluminum, copper, gold, silver, nickel, etc. In other embodiments, it may be replaced by a wire to achieve the conductive function, which is not limited here.

[0064] For further information, please also refer to Figure 7 As a specific implementation of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, the conductive sheet 52 includes a first section 521, a second section 522 bent at one end of the first section 521 toward the chip 1, and a third section 523 bent at the free end of the second section 522 parallel to the first section 521 and toward a direction away from the first section 521. The second section 522 is perpendicular to the first section 521, and the third section 523 is perpendicular to the second section 522. One end of the second connection pin 32 is attached to the first section 521, and the other end of the second connection pin 32 extends out of the adhesive seat 4, and the third section 523 is attached to the chip 1. Specifically, the cross section of the third section 523 is consistent with the cross section of the chip 1. In this structure, by replacing the traditional wire with the conductive sheet 52, on the one hand, the conductivity between the second connection pin 32 and the chip 1 can be effectively improved; on the other hand, the heat of the chip 1 can be transferred to the conductive sheet 52, and then can be transferred to the heat conduction and heat dissipation plate 51 and the second connection pin 32 respectively and diffused, thereby improving the heat dissipation efficiency of the chip 1.

[0065] For further information, please also refer to Figure 4As a specific implementation of the semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, the length of the second connection pin 32 is greater than the length of the first connection pin 31. In this structure, the second connection pin 32 has better heat conduction and electrical conductivity than the first connection pin 31. The first connection pin 31 and the second connection pin 32 are bent multiple times to effectively extend the heat transfer path, thereby improving the heat transfer effect.

[0066] For further information, please also refer to Figure 6 and Figure 7 As a specific implementation of the semiconductor element with a double-sided heat-conducting and heat-dissipating structure provided in the first embodiment of the present invention, the thickness of the heat-conducting and heat-dissipating plate 51 is greater than the thickness of the conductive sheet 52. This structure can effectively increase the heat dissipation area and improve the heat dissipation efficiency of the chip 1. In other embodiments, the thickness of the heat-conducting and heat-dissipating plate 51 and the conductive sheet 52 can be adjusted according to actual production, and is not limited here.

[0067] For further information, please also refer to Figure 4 , Figure 8 and Fig. 9 As a specific implementation of a semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, there are several substrates 2, each of which includes a base plate 23 and a connecting plate 24 provided at both ends of each base plate 23, and a chip 1 is provided on each base plate 23. Specifically, the base plate 23 of the first substrate 21 is provided with connecting plates 24 at both ends, and the base plate 23 of the second substrate 22 is provided with connecting plates 24 at both ends. In this structure, by providing connecting plates 24 at both ends of the base plate 23, after the heat of the chip 1 is transferred to the base plate 23, the base plate 23 can transfer the heat to each connecting plate 24 for diffusion, thereby increasing the heat transfer area and thus improving the heat dissipation effect of the chip 1.

[0068] Optionally, the connecting plate 24 may be a hollow structure. Of course, in other embodiments, the connecting plate 24 may be a solid structure, the connecting plate 24 may be flush with the top or bottom surface of the rubber seat 4, and the connecting plate 24 is not limited in length, width, thickness, shape, etc., and is not limited here.

[0069] For further information, please also refer to Figure 4 , Figure 8 and Fig. 9As a specific implementation of the semiconductor element with a double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, each connecting plate 24 includes a first section 241 bent at the corresponding end of the substrate 23 toward the chip 1, a second section 242 bent at the free end of the first section 241 toward the direction away from the chip 1, and a third section bent at the free end of the second section 242 toward the substrate 23. The first section 241 is perpendicular to the substrate 23, the second section 242 is perpendicular to the first section 241, and the third section is perpendicular to the second section 242. Specifically, each connecting plate 24 is arranged in an inverted U shape. This structure, by bending the connecting plate 24 into the first section 241, the second section 242 and the third section 243, on the one hand, facilitates the support and fixation of the substrate 2; on the other hand, it can extend the heat transfer path and improve the heat diffusion efficiency.

[0070] The cured rubber seat 4 has a notch 44 for supporting each connecting plate 24, and each end of each notch 44 is provided with a support block 45 for supporting the second section 242 of the corresponding connecting plate 24. In this structure, the two support blocks 45 in each notch 44 can support the two ends of the second section 242 of the corresponding connecting plate 24, and the two support blocks 45 are respectively spaced apart from the inner side wall of the notch 44, so that the first section 241 of each connecting plate 24 can pass through.

[0071] For further information, please also refer to Figure 4 , Figure 8 and Fig. 9 As a specific implementation of the semiconductor element with double-sided heat conduction and heat dissipation structure provided in the first embodiment of the present invention, each substrate 2 also includes a connecting strip 25 extending outward from one end of each substrate 23, each connecting strip 25 is fixed on the adhesive seat 4, and each connecting strip 25 and the corresponding substrate 23 are on the same plane. Specifically, the two ends of the first substrate 21 close to the second substrate 22 are respectively provided with connecting strips 25; the end of the second substrate 22 away from the first substrate 21 is provided with a connecting strip 25; the adhesive seat 4 after curing and forming has a clamping hole 49 for supporting and fixing the connecting strips 25 respectively. This structure can effectively support and fix the first substrate 21 and the second substrate 22 by providing the connecting strip 25, so as to realize the curing and forming of the double chip 1. Two windows 40 are provided on the adhesive seat 4, and each window 40 is provided with a heat conduction and heat dissipation plate 51 and a conductive sheet 52, so as to realize the heat dissipation of the double chip 1 on both sides, thereby improving the heat dissipation efficiency of the chip 1.

[0072] Please also read Fig.10 and Fig.11The cured and formed plastic seat 4 has a positioning groove 42 for supporting the chip 1 and a receiving groove 43 for supporting the substrate 23. The window 40 is connected to the positioning groove 42, and the positioning groove 42 is connected to the receiving groove 43. The chip 1 is set in the positioning hole, and the substrate 23 is set in the receiving groove 43. In this structure, the cross-sectional shape of the positioning groove 42 is consistent with that of the chip 1, and the cross-sectional shape of the substrate 23 is consistent with that of the receiving groove 43, which facilitates the accurate disassembly and maintenance of the chip 1 and the substrate 23.

[0073] Grooves 231 are provided on the substrate 23 and around the chip 1 to prevent moisture and air leakage, increase the contact area, and facilitate the sealing and fixing of the semiconductor element.

[0074] Embodiment 2:

[0075] Please also read Fig.12 and Fig.13 The semiconductor element with double-sided heat conduction and heat dissipation structure provided by the second embodiment of the present invention is now described. The difference between the second embodiment and the first embodiment is that:

[0076] 1. Eliminate the heat conduction and heat dissipation plate 51, simplify the production process and reduce costs;

[0077] 2. The front side of the semiconductor element of the first embodiment is used as the back side of the semiconductor element of the second embodiment, and the back side of the semiconductor element of the first embodiment is used as the front side of the semiconductor element of the second embodiment;

[0078] 3. The connecting plate 24 and each pin 3 are on the same plane.

[0079] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Semiconductor components with double-sided heat conduction and heat dissipation structure, Features: The invention comprises a substrate, a chip arranged on the substrate, pins electrically connected to the chip, a glue seat which is solidified and formed on the substrate and seals and fixes the chip and the pins, and a heat-conducting heat sink; a window is opened on the glue seat at a position corresponding to the chip, one end of the heat-conducting heat sink is attached to the chip through the window, the other end of the heat-conducting heat sink extends out of the chip, and the glue seat seals and wraps the periphery of the heat-conducting heat sink; There are several substrates, each of which comprises a base plate and connecting plates arranged at two ends of the base plate, and the chip is arranged on the base plate; Each of the substrates further includes a connecting strip extending outwardly from one end of each of the substrates, each of the connecting strips is fixed on the adhesive seat, and each of the connecting strips and the corresponding substrate are on the same plane; The heat-conducting heat sink includes a first sheet, a second sheet bent at one end of the first sheet toward the chip, and a third sheet bent at a free end of the second sheet parallel to the first sheet and away from the first sheet, the second sheet is perpendicular to the first sheet, the third sheet is perpendicular to the second sheet, the first sheet is flush with the top surface of the adhesive seat, and the third sheet is bonded to the chip; The pin further includes a second connection pin fixed on the adhesive seat, and the semiconductor element with a double-sided heat conduction and heat dissipation structure further includes a conductive sheet electrically connecting the second connection pin to the chip; The conductive sheet includes a first section, a second section bent at one end of the first section toward the chip, and a third section parallel to the first section and bent toward a direction away from the first section at a free end of the second section, the second section is perpendicular to the first section, the third section is perpendicular to the second section, one end of the second connection pin is attached to the first section, the other end of the second connection pin extends out of the adhesive seat, and the third section is attached to the chip; The cross section of the third section is consistent with the cross section of the chip; the heat of the chip is transferred to the conductive sheet, and then respectively transferred to the heat-conducting heat sink and the second connection pin and diffused.

2. The semiconductor device with double-sided heat conduction and heat dissipation structure as claimed in claim 1, Features: The pin includes a first connection pin fixed on the adhesive seat, and the semiconductor element with a double-sided heat conduction and heat dissipation structure also includes a conductive wire electrically connecting the first connection pin with the chip.

3. The semiconductor element with double-sided heat conduction and heat dissipation structure as claimed in claim 2, Features: The length of the second connecting pin is greater than the length of the first connecting pin.

4. The semiconductor element with double-sided heat conduction and heat dissipation structure as claimed in claim 1, Features: The thickness of the heat-conducting heat dissipation plate is greater than the thickness of the conductive sheet.

5. The semiconductor device with double-sided heat conduction and heat dissipation structure as claimed in claim 1, Features: Each of the connecting plates includes a first section bent at the corresponding end of the substrate toward the chip, a second section bent at the free end of the first section toward a direction away from the chip, and a third section bent at the free end of the second section toward the substrate. The first section is perpendicular to the substrate, the second section is perpendicular to the first section, and the third section is perpendicular to the second section.

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