Electronic component mounting device and electronic component mounting method
A technology for electronic component installation and components, applied in the direction of electrical components, electrical components, circuits, etc., can solve the problems of stop position error, long moving time, chip components and substrates cannot be aligned with high precision, and achieve high-precision position alignment , the effect of short takt times
Active Publication Date: 2021-01-01
ATHLETE FA KK
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[0009] However, in the electronic component mounting apparatus described in Patent Document 1, since the position of the chip component is confirmed by the camera for confirmation and the chip component is moved to the position of the substrate recognition camera, the chip component is recognized by the camera for recognition and Substrate, so there is a problem that it takes time for the chip parts to move and the takt time will become longer
In addition, when there is only one camera for recognition, since it is necessary to move the camera for recognition and the chip part to the substrate recognition operation position, this requires more moving time and the cycle time will become longer, which will become a problem for position recognition. The standard recognition camera and the chip part move to the bonding position, so there is a problem that it is difficult to obtain positional accuracy
[0010] In the electronic component mounting apparatus described in Patent Document 2, when the chip component and the substrate are aligned, the chip component is moved to the bonding position by the movable table, and the substrate is moved to the bonding position by the movable table, so Due to the error caused by each movement and the error of the stop position, the required recognition accuracy cannot be obtained, which will lead to the problem that high-precision alignment between the chip component and the substrate cannot be achieved.
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[0033] Hereinafter, for the electronic component mounting apparatus 1 and the electronic component mounting method in the embodiment of the present invention, reference will be made to Figure 1-Figure 5 Be explained.
[0034] [Structure of Electronic Component Mounting Device 1 ]
[0035] figure 1 It is a plan view showing a rough structure of the electronic component mounting apparatus 1 in the embodiment,
[0036] figure 2 is displayed from figure 1 A front view of the electronic component mounting apparatus 1 seen from the lower side of the figure. The figure described below, will figure 1 The left-right direction in the diagram is referred to as the Y direction or the Y axis, and the up-down direction in the diagram is referred to as the X direction or the X-axis. Alternatively, the vertical direction with respect to the X-Y plane will be described as the Z direction or the vertical direction.
[0037] refer to figure 1 , figure 2 Next, the structure of the ele...
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The present invention is to provide an electronic component mounting apparatus (1) and an electronic component mounting method capable of aligning the position of a chip component and the position of a substrate with high precision in a short tact time. The electronic component mounting apparatus comprises: a bonding head having a collet (28) formed of a transparent material and capable of sucking, holding and supporting a chip component (13); a first mirror (35) disposed on a side of the chip component (13) opposite to the collet (28) and projecting an image of the chip component (13); a chip component recognition camera (34) recognizing the chip component (13); a second mirror (38) disposed between a substrate (11) and the collet (28) and projecting an image of the substrate (11); and a substrate recognition camera (37) for recognizing the substrate (11). The first mirror (35) and the second mirror (37) move integrally to recognition operation positions (A, B) of the chip component (13) and the substrate (11) such that respective positions of the chip component (13) and the substrate (11) can be recognized. The positional deviation between the chip component (13) and the substrate (11) is corrected based on the recognition information.
Description
technical field [0001] The present invention relates to an electronic component mounting device and an electronic component mounting method. Background technique [0002] When mounting an electronic component (called a chip component) like a semiconductor chip on a substrate, the chip component and the substrate must be aligned with high precision and then bonded together. This alignment usually involves identifying the chip component identification mark provided on the chip component and the substrate identification mark provided on the substrate with a camera or the like, and controlling the relative positional relationship between the two identification marks to a specified value. accuracy. A device that mounts chip components on a substrate is called an electronic component mounting device, a die bonder, or a bonding device. [0003] As an alignment means between a chip component and a substrate, there is an electronic component mounting apparatus including: a camera f...
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IPC IPC(8): H05K13/04H05K13/08
CPCH01L21/52H01L21/67092H01L21/67121H01L21/67144H01L21/67259H01L21/682
Inventor山岸昭隆宫坂研吾上岛直人本藤弘敏
OwnerATHLETE FA KK