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Wafer box cleaning device and method

A technology for cleaning devices and cassettes, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of low economic benefits and large floor space, and achieve high economic benefits, saving floor space, and saving drying the effect of time

Active Publication Date: 2019-10-15
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides a film cassette cleaning device and method, which are used to solve the problems that the existing film cassette cleaning machines occupy a large area and have low economic benefits

Method used

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  • Wafer box cleaning device and method
  • Wafer box cleaning device and method
  • Wafer box cleaning device and method

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0039] The cleaning of wafer cassettes is an important part of the semiconductor process. At present, the commonly used cassette cleaning machines are mainly orbital cleaning machines and box cleaning machines. Please refer to figure 1 , figure 1 It is a structural schematic diagram of a cassette cleaning machine in the prior art. The orbital cleaning machine occupies a large area, has a c...

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Abstract

The invention provides a wafer box cleaning device and method, which relate to the field of semiconductor wafers. The wafer box cleaning device includes a cavity, a separation plate, a wafer box holder and a driving mechanism. The cavity includes a cleaning chamber and a drying chamber. The separation plate is located inside the cavity, and has a closed state and an open state. The separation plate is used to separate the cleaning chamber from the drying chamber when in the closed state. When the separation plate is in the open state, the cleaning chamber and the drying chamber are communicated. The wafer box holder is located inside the cavity and used for carrying a wafer box. The wafer box holder is arranged on the driving mechanism, and the driving mechanism can drive the wafer box holder to move between the cleaning chamber and the drying chamber and can drive the wafer box holder to rotate. The embodiment of the invention solves the problems of large floor area, high cost and lowdrying efficiency of the existing wafer box cleaning machine.

Description

technical field [0001] The invention relates to the field of semiconductor wafers, in particular to a chip box cleaning device and method. Background technique [0002] Wafers are the basic material for manufacturing semiconductor chips. Since the electrical properties of semiconductor materials are very important to the concentration of impurities, the cleanliness of wafers is very important for semiconductor chips. The wafer cassette mainly plays the role of placing and transporting wafers. Since the wafers need to be strictly kept clean, the wafer cassette needs to be cleaned before placing the wafers to maintain a clean environment and avoid contamination of the wafers. At present, in the commonly used cassette cleaning machines, each cleaning tank is independent, occupies a large area, and has high manufacturing and maintenance costs. Contents of the invention [0003] In view of this, the present invention provides a film cassette cleaning device and method, which a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/673
CPCH01L21/67333H01L21/67057H01L21/67034
Inventor 史进李在桓
Owner XIAN ESWIN MATERIAL TECH CO LTD
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