A backlight module, manufacturing method and display device

A technology of backlight module and light-concentrating structure, which is applied in optics, nonlinear optics, character and pattern recognition, etc., can solve the problem of inability to make through holes, etc., and achieve the effect of making up for the problem and having a wide application prospect

Active Publication Date: 2022-07-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, Mini LEDs are mostly driven by PCB substrates, and it is impossible to make through holes to continue integrating devices under Mini LEDs.

Method used

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  • A backlight module, manufacturing method and display device
  • A backlight module, manufacturing method and display device
  • A backlight module, manufacturing method and display device

Examples

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Embodiment Construction

[0062] In order to illustrate the present invention more clearly, the present invention will be further described below with reference to the preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0063]It should be noted that "on", "formed on" and "disposed on" described herein may mean that one layer is directly formed or disposed on another layer, or may mean that a layer is formed directly on or disposed on another layer. A layer is formed or disposed indirectly on another layer, ie there are other layers in between. As used herein, unless otherwise stated, the term "on the same layer" means that two layers, parts, members, elements or sections may be formed by the same patterning process, and that the two lay...

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Abstract

The invention discloses a backlight module, a manufacturing method and a display device. The backlight module includes a fingerprint collection area and a non-fingerprint collection area, wherein the non-fingerprint collection area is provided with a first Mini LED array; the fingerprint collection area is provided with a first Mini LED array. Two Mini LED arrays and collection holes around the Mini LED lamp beads in the second Mini LED array, the collection holes are used to transmit the light emitted by the backlight module and reflected by the fingerprint to be tested to the fingerprint collection device. In the embodiment of the present invention, the light reflected by the fingerprint to be tested is transmitted through the collection hole arranged in the fingerprint collection area of ​​the backlight module, so that the fingerprint collector arranged at the rear end of the backlight module can perform fingerprint identification according to the reflected light, so as to realize The fingerprint recognition under the screen of the liquid crystal display device based on the backlight module of Mini LED has a wide application prospect.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a backlight module, a manufacturing method and a display device. Background technique [0002] In order to improve the screen ratio of the display screen of the mobile phone panel, an under-screen fingerprint recognition technology is proposed. At present, under-screen fingerprints are mostly used in AMOLED display panels. Traditional LCDs cannot use the corresponding technology of AMOLED display panels because the backlight source is the whole surface. However, with the increasing market demand for high dynamic range image (HDR) display, liquid crystal LCD display panels can achieve HDR display by using MiniLED backlight modules instead of traditional backlight modules. However, at present, Mini LEDs are mostly driven by PCB substrates, and through holes cannot be made to continue to integrate devices under Mini LEDs. SUMMARY OF THE INVENTION [0003] In order to so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357G02F1/1333G06V40/12
CPCG02F1/133603G02F1/133605G02F1/13338G02F1/133612G06V40/1318
Inventor 方浩博张勇王建华刚林坚张丽敏杨智超秦相磊孙泽鹏
Owner BOE TECH GRP CO LTD
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