Power module heat dissipation path aging failure diagnosis method

A technology of a power module and a diagnosis method, applied in the field of power electronics, can solve the problems of difficult diagnosis method, aging and failure of the heat dissipation path of the online diagnosis module, etc., and achieve the effect of accurate diagnosis

Active Publication Date: 2020-08-11
SHANGHAI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the diagnosis method for the aging failure of the heat dissipation path of the power module is difficult to carry out online diagnosis of the aging failure state of the heat dissipation path of the power module in the actual application of the power module

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  • Power module heat dissipation path aging failure diagnosis method
  • Power module heat dissipation path aging failure diagnosis method
  • Power module heat dissipation path aging failure diagnosis method

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] like figure 1 Shown is a method for diagnosing aging failure of a heat dissipation path of a power module according to an embodiment of the present invention, including the following steps:

[0032] A. Record the data of the conduction voltage drop, collector current, and module junction temperature of the reference power module, and construct a mathematical model characterizing the relationship between the conduction voltage drop, collecto...

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Abstract

The invention discloses a power module heat dissipation path aging failure diagnosis method, which comprises the following steps: A, recording data of conduction voltage drop, collector current and module junction temperature of a reference power module, and constructing a mathematical model representing a relationship among the conduction voltage drop, the collector current and the module junction temperature of the module; B, recording the ambient temperature around the module and the shell temperature at the module substrate when the power module works; C, recording data of the module conduction voltage drop and the collector current when the power module works, and obtaining the average junction temperature of the power module by utilizing a mathematical model representing the relationship among the module conduction voltage drop, the junction temperature and the collector current; and D, carrying out heat dissipation path aging failure diagnosis by utilizing a ratio factor method.According to the embodiment of the invention, the aging failure of the heat dissipation path of the module can be accurately diagnosed on line on the premise of not influencing the service life and the working state of the power module.

Description

technical field [0001] The invention belongs to the technical field of power electronics, and in particular relates to a method for diagnosing the aging failure of a heat dissipation path of a power module. Background technique [0002] Power modules have been widely used in rail traction, aerospace, electric vehicles, power systems, new energy power generation, energy storage systems and other fields. With the application of power modules, accidents caused by power module failures occur frequently, bringing a series of economic losses and threatening the safety of personnel. Therefore, it is particularly important to diagnose the aging failure of the heat dissipation path of the power module. [0003] At present, it is difficult to diagnose the aging failure state of the heat dissipation path of the power module online in the actual power module application occasion. Because there is an urgent need for a diagnostic method that can accurately diagnose the aging failure of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/40G01R31/28
CPCG01R31/40G01R31/2849
Inventor 汪飞任林涛罗雨施天灵郭慧
Owner SHANGHAI UNIV
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