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A aging failure diagnosis method for heat dissipation path of power module

A power module and diagnostic method technology, applied in the field of power electronics, can solve problems such as difficult diagnostic methods, aging and failure of the cooling path of online diagnostic modules, etc., and achieve the effect of accurate diagnosis

Active Publication Date: 2022-03-18
SHANGHAI UNIV
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Problems solved by technology

[0003] At present, the diagnosis method for the aging failure of the heat dissipation path of the power module is difficult to carry out online diagnosis of the aging failure state of the heat dissipation path of the power module in the actual application of the power module

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  • A aging failure diagnosis method for heat dissipation path of power module
  • A aging failure diagnosis method for heat dissipation path of power module
  • A aging failure diagnosis method for heat dissipation path of power module

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Such as figure 1 Shown is a method for diagnosing aging failure of a heat dissipation path of a power module according to an embodiment of the present invention, including the following steps:

[0032] A. Record the data of the conduction voltage drop, collector current, and module junction temperature of the reference power module, and construct a mathematical model characterizing the relationship between the conduction voltage drop, colle...

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Abstract

The invention discloses a method for diagnosing the aging failure of the heat dissipation path of a power module. The mathematical model of the relationship between current and module junction temperature; B. Record the ambient temperature around the module and the shell temperature at the module substrate when the power module is working; C. Record the data of the conduction voltage drop and collector current of the module when the power module is working, and use The mathematical model characterizing the relationship between the conduction voltage drop of the module, the junction temperature and the collector current obtains the average junction temperature of the power module; D. Use the ratio factor method to diagnose the aging failure of the heat dissipation path. The embodiment of the present invention can realize the online and accurate diagnosis of the aging failure of the heat dissipation path of the power module without affecting the service life and working state of the power module.

Description

technical field [0001] The invention belongs to the technical field of power electronics, and in particular relates to a method for diagnosing the aging failure of a heat dissipation path of a power module. Background technique [0002] Power modules have been widely used in rail traction, aerospace, electric vehicles, power systems, new energy power generation, energy storage systems and other fields. With the application of power modules, accidents caused by power module failures occur frequently, bringing a series of economic losses and threatening the safety of personnel. Therefore, it is particularly important to diagnose the aging failure of the heat dissipation path of the power module. [0003] At present, it is difficult to diagnose the aging failure state of the heat dissipation path of the power module online in the actual power module application occasion. Because there is an urgent need for a diagnostic method that can accurately diagnose the aging failure of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/40G01R31/28
CPCG01R31/40G01R31/2849
Inventor 汪飞任林涛罗雨施天灵郭慧
Owner SHANGHAI UNIV
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