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Substrate and preparation method thereof and display panel

A substrate and metal technology, applied in the field of display panels, substrates and their preparation, can solve problems such as side etching of the front layer metal

Inactive Publication Date: 2020-09-29
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a substrate and its preparation method, and a display panel, so as to improve the problem of side etching of the front layer metal during the back layer metal etching process in the prior art

Method used

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  • Substrate and preparation method thereof and display panel
  • Substrate and preparation method thereof and display panel
  • Substrate and preparation method thereof and display panel

Examples

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Embodiment Construction

[0041] The technical solutions in the embodiments and / or examples of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the embodiments and / or examples described below are only part of the implementation of the present invention. schemes and / or examples, rather than all implementations and / or examples. Based on the implementations and / or examples in the present invention, all other implementations and / or examples obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0042] The directional terms mentioned in the present invention, such as [top], [bottom], [left], [right], [front], [back], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the pre...

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Abstract

The invention provides a substrate and a preparation method thereof, and a display panel. The substrate comprises: a substrate; a first conducting layer which is formed on the substrate and patternedto form a first metal wire, wherein the first conducting layer is of a multi-film-layer structure composed of first metal and second metal, and the surface, away from the substrate, of the first conducting layer is a first metal film layer, wherein the first metal is not easy to etch, and the second metal is easy to etch; an insulating layer formed on the first conducting layer; and a second conducting layer which is formed on the insulating layer and is patterned to form a second metal wire and a first metal protection wire, and the first metal protection wire covers the side edge, which is not covered by the insulating layer, of the first metal wire. The first metal protection line is arranged on the side edge, which is not covered by the insulating layer, of the first metal line, so that the side edge, which is not covered by the insulating layer, of the first metal line is protected, the first metal line is prevented from being laterally etched in the etching process of the secondconducting layer, and the product reliability and the manufacturing yield are improved.

Description

technical field [0001] The present application relates to the display field, and in particular to a substrate, a preparation method thereof, and a display panel. Background technique [0002] In the manufacturing process of the display panel, a metal etching process (wet etching or dry etching) is often used to form metal patterning and functionalization. On the same substrate, it generally includes at least two metal film layers, and the adjacent two metal film layers are isolated by an insulating layer to prevent short circuits and protect the front metal from the impact of the back metal etching process. [0003] Although in the design of the display panel, the side of the front layer metal is usually protected by an insulating layer, due to the complexity of the display panel circuit and the function of the protective layer, there will also be exposed metal on the side without the protection of the insulating layer, such as chip bonding. Terminals, flexible AMOLED (Acti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/00H01L27/32H10K99/00
CPCH10K71/00H10K59/12H10K59/131H10K77/10H10K59/1201H10K50/844
Inventor 胡宏波
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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