System for testing physical properties of copper-clad plate after manufacturing and forming
A technology of physical performance and testing system, which is applied in the direction of measuring devices, instruments, and mechanical devices, etc., can solve problems affecting the strength test structure, separation, and unraveling of copper foil, etc., to achieve simple operation and strong practicability Effect
Inactive Publication Date: 2020-12-04
张小闯
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Problems solved by technology
[0003] 1. Since the surface of the copper foil usually changes from a flat surface to an arc-shaped surface gradually when it is uncovered, and most of the existing bonding heads have a fixed structure, it is difficult to change with the deformation of the copper foil when the copper foil is uncovered, which may easily cause the copper foil to be damaged. The separation between the bonding head and the copper foil when it is uncovered affects the strength test structure; 2. The traditional detection method is mostly one-way pulling detection, which does not take into account the situation of uncovering the copper foil from different angles
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[0026] Embodiments of the present invention will be described below with reference to the drawings. In the process, in order to ensure the clarity and convenience of illustration, we may exaggerate the width of the lines or the size of the constituent elements in the diagram.
[0027] In addition, the following terms are defined based on the functions in the present invention, and may be different according to the user's or operator's intention or practice. Therefore, these terms are defined based on the entire content of this specification.
[0028] Such as Figure 1 to Figure 3 As shown, a physical performance test system after copper clad laminate manufacturing and forming includes a base 1, a positioning device 2, a U-shaped frame 3, a fixed pulley block 4, a connecting rope 5, an uncovering device 6 and a load-bearing block 7. The base 1 A positioning device 2 is installed on the base 1, and a U-shaped frame 3 is installed on the base 1. The positioning device 2 is loca...
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The invention relates to a system for testing physical properties of a copper-clad plate after manufacturing and molding, which comprises a base, a positioning device, a U-shaped frame, a fixed pulleyblock, a connecting rope, an uncovering device and a bearing block, wherein the positioning device is arranged on the base, the U-shaped frame is arranged on the base, the positioning device is positioned inside the U-shaped frame, the U-shaped frame is provided with the fixed pulley block, and the fixed pulley block is provided with the connecting rope; the left end of the connecting rope is connected with the bearing block, and the right end of the connecting rope is connected with the uncovering device. The problems that the strength test structure is influenced due to the separation of the bonding head and the copper foil when the copper foil is uncovered because the copper foil surface is mostly gradually changed from a plane to an arc surface and most of the existing bonding heads are fixed in structure and are difficult to change along with the deformation of the copper foil when the copper foil is uncovered can be solved; and most of traditional detection modes are single-direction pulling detection, and the situation that the copper foil is uncovered from different angles is not considered can be solved.
Description
technical field [0001] The invention relates to the technical field of copper-clad laminate detection, in particular to a physical performance test system for copper-clad laminates after they are manufactured and formed. Background technique [0002] Copper-clad laminate, a plate-shaped material formed by impregnating the reinforcing material with resin, covered with copper foil on one or both sides, and hot-pressed, is called a copper-clad laminate. It is the basic material for PCB, often called substrate. When it is used in multi-layer board production, it is also called core board. After the copper clad laminate is formed, it needs to be tested for bond strength, that is, the bond strength between the copper foil and the base board. The head sticks the copper foil and pulls it up until the copper foil is uncovered, so as to test the bonding strength between the copper foil and the base board, but the traditional detection method may have some defects: [0003] 1. Since ...
Claims
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IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor张小闯李海波李梦然
Owner张小闯