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Array substrate, display panel and wiring structure thereof

A technology for array substrates and display areas, applied to electrical components, electrical solid devices, circuits, etc., can solve problems such as signal loss, increased risk of disconnection, and broken signal lines, and achieve the effect of improving bending resistance

Pending Publication Date: 2020-12-15
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, a large number of signal traces will be integrated to the lower edge of the display panel, which will be bent and fixed to the back of the display panel during the back-end module manufacturing process, which will bring a serious risk, that is, long-term bending The stress generated during the folding process makes the signal traces in this area often break, resulting in signal loss
[0007] To sum up, in the OLED display panel of the prior art, the signal traces located in the bending area remain bent for a long time, which will increase the risk of disconnection due to the influence of stress, thereby reducing the service life of the OLED display panel.

Method used

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  • Array substrate, display panel and wiring structure thereof
  • Array substrate, display panel and wiring structure thereof
  • Array substrate, display panel and wiring structure thereof

Examples

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Embodiment 1

[0035] figure 1 A plan view of an array substrate according to an embodiment of the present invention is shown. figure 2 show figure 1 A schematic diagram of the electrical connection of the signal traces in the bending region 130 of the array substrate shown. image 3 A schematic structural diagram of a signal routing in this embodiment is shown. Figure 5 A schematic structural diagram of a display panel according to an embodiment of the present invention is shown. Figure 6 A cross-sectional view of a display area of ​​a display panel according to an embodiment of the present invention is shown.

[0036] According to an aspect of the present invention, an array substrate is provided. Such as Figures 1 to 3 As shown, the array substrate includes a display area 110 , a bending area 130 and a driving chip 140 . The bending region 130 includes: a first metal layer, a second metal layer, and an insulating layer 440; the second metal layer is located on the first metal la...

Embodiment 2

[0055] The difference between this embodiment and Embodiment 1 mainly lies in the structure of the signal routing. Figure 4 A schematic structural diagram of signal wiring in this embodiment is shown.

[0056] Such as Figure 4 As shown, in this embodiment, the routing structure includes a plurality of signal routings, and there is no overlapping area between two adjacent signal routings; each signal routing includes a plurality of diamond-shaped routing areas 1 connected in series, Each of the diamond-shaped routing areas 1 includes a first hollow portion 11, a second hollow portion 12 and a third hollow portion 13; the second hollow portion 12 and the third hollow portion 13 are smaller than the The first hollow part 11 ; the second hollow part 12 , the first hollow part 11 and the third hollow part 13 are sequentially arranged along the extending direction of the signal traces. In this embodiment, the first hollow part 11 is located at the center of the diamond-shaped wi...

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Abstract

The invention provides an array substrate, a display panel and a wiring structure of the display panel. The array substrate comprises a display area, a bending area and a driving chip, wherein the bending area comprises a first metal layer, a second metal layer and a wiring structure; the second metal layer is positioned on the first metal layer; the insulating layer is formed between the first metal layer and the second metal layer; wherein a plurality of first signal wires electrically connected to the display area are formed on the first metal layer, a plurality of second signal wires electrically connected to the driving chip are formed on the second metal layer, and each first signal wire penetrates through the insulating layer to be electrically connected with one second signal wire;and the signal wires form a plurality of diamond-shaped wire areas which are connected in series in the extending direction of the signal wires. According to the array substrate, the signal wire forms a plurality of diamond-shaped wiring areas which are connected in series in the extending direction, and each diamond-shaped wiring area at least comprises the first hollow part, so bending resistance of the signal wire can be remarkably improved.

Description

[0001] This application requires application number 2019105138203 (application date: June 14, 2019) [0002] Priority right for Chinese invention patent application. technical field [0003] The present invention relates to the field of display technology, in particular to an array substrate, a display panel and a wiring structure thereof. Background technique [0004] In recent years, OLED (Organic Light-Emitting Diode, organic light-emitting diode) technology has developed rapidly, and has become the most likely prospect technology to replace LCD (Liquid Crystal Display, liquid crystal display). [0005] OLED display panels can be divided into rigid panels and flexible panels. Compared with traditional display panels, OLED flexible panels have obvious advantages. Not only are they lighter and thinner in size, but they also consume less power than the original devices, which helps to improve the battery life of the device. At the same time, based on its bendable and flexib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32
CPCH10K59/1315H10K59/1213
Inventor 杨茜茜
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD