Corrugated board processing and bonding device

A bonding device and technology for corrugated cardboard, applied in the field of corrugated paper, can solve the problems of bonding firmness, uneven application of glue, and uneven corrugated cardboard, so as to avoid colloid accumulation, increase solidification time, and reduce labor intensity. Effect
CN112356515AInactive Publication Date: 2021-02-12黄丹
1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
黄丹
Publication Date
2021-02-12
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a corrugated board processing and bonding device. The corrugated board processing and bonding device comprises a working table, wherein two side plates are fixedly mounted on one side of the working table; a conveying mechanism is fixedly mounted on one side of the two side plates; the conveying mechanism comprises six guide rollers; a box paper board, a wave sandwich boardand a box paper board are sequentially embedded between every two adjacent guide rollers from top to bottom; and one end of each of the six guide rollers is connected with a third circular tooth in asleeving manner. According to the corrugated board processing and bonding device, a gluing device is mounted, a glue pump is used for pumping glue in a glue storage box into a discharging groove in afixing block, the glue is uniformly sprayed on two surfaces of the wave sandwich board through a spray head at the bottom end of the fixing block, and in the spraying process, glue liquid is heated through electric heating wires mounted in cavities on two sides of the discharging groove, so that the solidification time of the glue is prolonged, manual gluing is replaced, the labor intensity is effectively reduced, and meanwhile, the influence on the firmness of bonding between the box paper boards and the wave sandwich boards due to premature solidification of the glue in the bonding processis avoided.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a bonding device, in particular to a corrugated cardboard processing bonding device, which belongs to the technical field of corrugated paper. Background technique

[0002] Corrugated cardboard is a multi-layer adhesive body, which consists of at least one layer of corrugated core paper interlayer and one layer of cardboard (also known as "boxboard paper", "boxboard"). It has high mechanical strength and can withstand The actual performance of corrugated cardboard depends on three factors: the characteristics of the core paper and cardboard and the structure of the carton itself.

[0003] According to the patent No. "CN210679901U", a corrugated cardboard processing and bonding device is disclosed. By providing a device that processes the raw material into a wave-shaped core paper, the core paper is self-dipped and self-smeared. The device is simple to operate and solves the problem. The traditional manual operation wastes glue...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More