Semiconductor lead frame stacking device

A lead frame and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve the problems of low production efficiency and manpower consumption, and achieve the effects of reducing production costs, saving labor, and avoiding artificial addition
CN112802786AActive Publication Date: 2021-05-14四川旭茂微科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
四川旭茂微科技有限公司
Publication Date
2021-05-14

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Abstract

The invention provides a semiconductor lead frame stacking device, which comprises: a first linear mechanism, which is provided with a stacking mechanism at one end and a bonding pad caching mechanism at the other end, and is provided with a bonding pad mounting station, a first assembling station, a second assembling station and a finished product stacking station, and is slidably equipped with a transfer plate; the stacking mechanism, which is provided with four groups of rotating stop blocks for supporting bonding pads, and is also provided with a pair of lifting plates; a second linear mechanism, which is provided with a first discharging station corresponding to the first assembling station and is provided with a second discharging station corresponding to the second assembling station; a third linear mechanism, which is provided with a bottom frame suction disc and is used for transferring a bottom lead frame; a rotating mechanism, which is provided with a rotating suction disc for bearing a top lead frame; and a fourth linear mechanism, which is provided with a top frame suction disc for transferring the top lead frame from the second discharging station to the rotating suction disc and enabling the top lead frame to coincide with the bottom lead frame. Manpower is saved, and production efficiency is improved.
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Description

technical field

[0001] The invention belongs to the field of semiconductor lead frame assembly, in particular to a semiconductor lead frame stacking device. Background technique

[0002] Most semiconductors use two lead frame models to overlap to form a package structure. Most of the existing lead frame stacking devices use an assembly line structure, using pads to transfer the bottom lead frame along the conveying line, then bonding the chip, and then stacking The top-layer lead frame, this method needs to be manually put into the pads with the lead frame one by one, and then the stacked lead frames and pads are taken out one by one, the production efficiency is low, and it is very labor-intensive. Contents of the invention

[0003] In order to solve the deficiencies in the prior art, the present invention provides a stacking device for semiconductor lead frames. The pad buffer mechanism can place multiple empty pads at one time, avoiding placing one by one. The bottom le...

Claims

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