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Novel Mini LED packaging process

A packaging process, a new type of technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high mold cost, large thickness tolerance of finished products, and low uniformity of glue spraying on the glue surface, so as to reduce production time and reduce production costs. The effect of low efficiency and high cost of glue waste

Pending Publication Date: 2021-06-01
YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing Mini LED packaging process includes molding and glue spraying. The molding process is molding on the Mini LED substrate. Because the thermal expansion of the substrate after heating is relatively large, the dead light rate is high after the board is formed, and the glue is added in the same batch. Poor performance, thermal curing is required after packaging to cause plate deformation, high mold cost, large thickness tolerance of finished product after mechanical mold compression molding, complex packaging process
The glue spraying process is to put the glue into the needle tube of the glue spraying machine after the glue is well proportioned, and spray the glue onto the MiniLED substrate with a high-speed jet valve. After the glue is sprayed, it is baked at high temperature. During the process, the rubber surface will flow and the consistency will be poor, and there will be glue pulling around it, causing the rubber stem to bulge

Method used

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  • Novel Mini LED packaging process
  • Novel Mini LED packaging process
  • Novel Mini LED packaging process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] see figure 1 , figure 2 As shown, a new Mini LED packaging process includes the following steps:

[0029] Step 1): After mounting the chip 2 on the Mini substrate 1, the carrier board is formed, and the high transmittance adhesive product 3 is cut to the size of the corresponding Mini substrate 1. The high transmittance adhesive product 3 cannot overload the shape of the board, and the high transmittance The adhesive product 3 includes a side B provided with an optical PET film 6 and a side A provided with a first protective film 4;

[0030] Step 2): After tearing off the first protective film 4 on the 3A side of the high-transmittance adhesive product, attach the A-side of the high-transmittance adhesive product 3 to the front of the carrier board, and the lamination accuracy of up, down, left, and right is 0.8±0.2mm , 30pcs CPK ≥ 1.33, no large air bubbles should be attached;

[0031] Step 3): Carry out vacuum degassing on the bonded carrier board, so that the bon...

Embodiment 2

[0034] see figure 1 , image 3 As shown, a new Mini LED packaging process includes the following steps:

[0035] Step 1): After mounting the chip 2 on the Mini substrate 1, the carrier board is formed, and the high transmittance adhesive product 3 is cut to the size of the corresponding Mini substrate 1. The high transmittance adhesive product 3 cannot overload the shape of the board, and the high transmittance The glue product 3 includes a B side provided with a second protective film 5 and an A side provided with a first protective film 4;

[0036] Step 2): After tearing off the first protective film 4 on the 3A side of the high-transmittance adhesive product, attach the A-side of the high-transmittance adhesive product 3 to the front of the carrier board, and the lamination accuracy of up, down, left, and right is 0.8±0.2mm , 30pcs CPK ≥ 1.33, no large air bubbles should be attached;

[0037] Tear off the second protective film 5 on the B side of the high-transmittance a...

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Abstract

The invention discloses a novel Mini LED packaging process. The process comprises the following steps that a support plate is formed after a chip is mounted on a Mini substrate, a high-light-transmittance adhesive product is cut to the size of the corresponding Mini substrate, and the high-light-transmittance adhesive product includes a surface B and a surface A provided with a first protective film; after the first protective film on the surface A of the high-light-transmittance adhesive product is torn off, the surface A of the high-light-transmittance adhesive product is attached to the front surface of the support plate; vacuum defoaming is performed on the laminated support plate to extract bubbles in the laminated adhesive surface and the support plate; and the support plate is subjected to UV curing, and the attached adhesive surface and the support plate are cured and combined. Vacuum defoaming and UV curing are carried out after the high-light-transmittance adhesive product is attached to the support plate, the production time of the whole Mini lamp panel is shortened, a problem that a yield is low due to a complex technology is solved, the problems that adhesive is wasted and cost is high in the packaging process are solved, mold opening is not needed, and the consistency of the surface thickness can be within 0.01 mm.

Description

technical field [0001] The invention relates to a packaging process, in particular to a new packaging process for Mini LEDs. Background technique [0002] The existing Mini LED packaging process includes molding and glue spraying. The molding process is molding on the Mini LED substrate. Because the thermal expansion of the substrate after heating is relatively large, the dead light rate is high after the board is formed, and the glue is added in the same batch. The performance is poor, after encapsulation, thermosetting is required to cause deformation of the plate, the cost of the mold is high, the thickness tolerance of the finished product after mechanical mold compression molding is large, and the encapsulation process is complicated. The glue spraying process is to put the glue into the needle tube of the glue spraying machine after the glue is well proportioned, and spray the glue onto the MiniLED substrate with a high-speed jet valve. After the glue is sprayed, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54
CPCH01L25/0753H01L33/54H01L2933/005
Inventor 唐加良牛艳玲
Owner YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD