Chip burning state detection circuit and method

Abstract

The invention discloses a chip burning state detection circuit and method. The circuit comprises a burning module, a switch module, a voltage comparison module and a state judgment module, wherein a first end of the burning module is connected with a power supply, a second end of the burning module is connected with an inverted input end of the voltage comparison module, a normal phase input end of the voltage comparison module is connected with a reference power supply, a signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module. When the power supply is powered on, the switch module switches on the branch circuit where the burning module is located and carries out burning on the burning module. The voltage comparison module compares the reference voltage with the detection voltage in the burning process of the burning module, and outputs a detection level to the state judgment module according to a comparison result; and the state judgment module judges the burning state of the burning module according to the detection level, and determines the chip burning result according to the burning state of the burning module, so that the accuracy of chip burning detection is improved.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a chip programming state detection circuit and method. Background technique [0002] At present, sensor chips (MEMS ASIC) are widely used in consumer markets such as modern smartphones and smart homes, so the demand for sensor chips has increased relatively significantly. With the improvement of people's consumption capacity, the performance requirements for smart products are also higher, so sensor chips are needed The range of sensitivity change is relatively small to improve product performance. Most of the existing sensor chips are used to calibrate the sensitivity of the sensor chip through the built-in calibrated fuse (FUSE) control module, but the existing method of using FUSE to calibrate is susceptible to Influenced by factors such as process error and system PCB reflow soldering, the detection of chip programming status is inaccurate, which leads to abnormal calibration. ...

Images