Cutting device and cutting method using same
By designing a movable carrier base and cut assembly in the half-rod processing equipment and adjusting the cutting clearance, the crystal rod edge and scratching problems during the manipulator clamping and cutting wire saw are solved, and the equipment size is achieved Shorten and improve processing efficiency.
Patent Information
- Application Number
- CN202411288497.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2024-12-06
AI Technical Summary
During the half-rod processing process, the robot grasps and cuts the wire saw and easily leads to edge-blocking or scratches when the crystal rod is pulled and cuts, and the equipment is long, making it difficult to quickly and safely withdraw the wire.
Design a cut-off device, which includes a movable carrier base and a cut-off assembly, by adjusting the cutting gap size, ensures that the robot is not moved slightly during clamping, and the cutting wire saw is not affected by lateral collision during spraying. Provides large cutting clearance for quick and safe retardation.
It effectively avoids edge and scratches during the clamping and retraction of crystal rods, shortens the equipment size, improves processing efficiency, and ensures fast and safe retraction of cutting wire saws.
Smart Images
Figure CN119077988A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of crystal rod processing, and in particular to a cutting device and a cutting method using the device. Background Art
[0002] Equipment for processing silicon rods usually includes cutters, squarers and slicers, which are used for cutting, squaring and slicing of silicon rods. Among them, the cutter is mainly used to cut longer silicon rods into shorter silicon rods (usually round rods). The squarer is mainly used to cut the truncated round rods into square rods along the length direction. The slicer is mainly used to slice the square rods after cutting, and finally obtain thin silicon wafers to be used. With the development of the photovoltaic industry, there is currently a demand for silicon wafer products corresponding to half rods (usually the crystal rods formed by cutting the above-mentioned square rods in half along the length direction).
[0003] In the processing of the above-mentioned half-rod products, the cutting component and the cutting and grinding machine, taking the Chinese new patent with publication number CN220840966U as an example, are relatively common half-rod processing equipment. When in use, the crystal rod to be processed (usually a square rod) needs to be placed flat on the loading platform base, the crystal rod is fixed by the loading platform base and a cutting gap is reserved on the loading platform, wherein the reserved cutting gap remains fixed, and the cutting component (usually two guide wheels correspondingly arranged up and down and a cutting wire saw is wound on the guide wheels, wherein the two guide wheels are respectively the driving wheel and the driven wheel driven by a motor) moves along the cutting gap from one end of the loading platform base, cuts the crystal rod into half rods along the length direction of the crystal rod and stops at the other end of the loading platform base, finally completing the half-rod processing, and is directly grasped by the robot after processing.
[0004] Regarding the above-mentioned half-rod processing equipment, it was found during use that since the half-rod cutting method is that the cutting wheel group moves from one end of the carrying platform along the cutting gap to cut the crystal rod into half rods and then stops at the other end of the carrying platform, the length of the equipment is designed to be relatively long. After the above-mentioned half-rod processing equipment cuts the half-rod, the robot directly grabs the two half-rods separately. At this time, the two half-rods are only separated by a cutting gap after cutting. During the spraying process, a water film is generated between the half-rods, causing the robot to grab one of the crystal rods. The other crystal rod will move slightly, affecting the subsequent grabbing of the robot, and it is possible that the edge will be knocked between the half-rods, affecting the quality of the half-rods. During the wire withdrawal process of the cutting wire saw, the cutting gap is too small, and it will bounce due to the spraying process, causing scratches on the crystal rod. Summary of the invention
[0005] The technical problem to be solved by the present invention is to provide a cutting device and a cutting method using the device for avoiding knocking and scratching of the crystal rod during the process of mechanical gripper grasping and wire saw rewinding.
[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: a cutting device, comprising a frame, a cutting assembly and a loading base, loading bases are provided on both sides of the length direction of the frame, a cutting gap is provided between the two loading bases, and the two loading bases can move toward or away from each other to adjust the size of the cutting gap; the two loading bases are combined to form a placement platform for placing crystal rods; the cutting assembly is moved along the length direction of the frame and passes through the cutting gap.
[0007] The present invention also provides a cutting method, which is applied to the cutting device described above, and includes the following steps: after the crystal rod is cut on the loading base, the cutting gap between the two loading bases at this time is a first gap; then the two loading bases move away from each other, and the cutting gap formed between the two loading bases is a second gap, and the size of the second gap is larger than the first gap, and the cutting assembly moves along the length direction of the frame and returns to the initial position through the second gap.
[0008] The beneficial effects of the present invention are as follows: through the movable and adjustable design of the cutting gap of the two loading bases, the crystal rod edge will not be knocked when the cutting gap is too small and micro-movement occurs during the clamping process of the manipulator on the cut crystal rod; in addition, the adjustable design of the cutting gap during the process of taking and placing the crystal rod can also provide design space for shortening the size of the equipment. For example, in the use of the cutting wire saw, if it stays at the cutting position of the crystal rod after cutting, the cutting wire saw will bounce and scratch the crystal rod during the spraying process, and the cutting wire saw needs to be moved forward or backward along the cutting direction as a whole to exit the cutting position of the crystal rod. The former will cause the size of the equipment to be lengthened, and the latter will also bounce and scratch the crystal rod when spraying is performed when passing through the conventional fixed smaller cutting gap. The adjustable cutting gap design provided by the present application can provide a larger cutting gap for the latter without increasing the size of the equipment to meet the needs of fast and safe wire withdrawal of the cutting wire saw;
[0009] The method adjusts the cutting gap from the size of the first gap that originally matches the cutting of the cutting wire saw to the size of the second gap that is larger and convenient for the cutting wire saw to pass through by adjusting the movement of the loading base after the crystal ingot is cut. With the size of the second gap, it can effectively avoid scratches on the cut crystal ingot due to the too small cutting gap during the spraying process or other processes in which the cutting wire saw may have a lateral collision and cause it to bounce. In the process of withdrawing the wire, the cutting component can also be quickly withdrawn with the larger second gap, without worrying about the cutting wire saw scratching the crystal ingot and resetting at a low speed, thereby improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a schematic structural diagram of a cutting device according to a specific embodiment of the present invention when it is combined with processing components of other processes;
[0011] Figure 2 It is a structural schematic diagram of a cutting assembly and a material loading base of a cutting device according to a specific embodiment of the present invention;
[0012] Figure 3 It is a structural schematic diagram of a material loading base of a cutting device according to a specific embodiment of the present invention;
[0013] Figure 4 It is a front view of a material carrying base of a cutting device according to a specific embodiment of the present invention.
[0014] Description of labels:
[0015] 1. Cutting device; 11. Frame; 12. Cutting assembly; 121. Mounting frame; 122. Cutting wheel train; 123. Cutting wire saw;
[0016] 13. Material loading base; 131. Positioning structure; 1311. Placement part; 1312. Positioning part; 132. Reinforcement structure; 133. Mounting seat; 134. Positioning cylinder; 135. Pad; 136. Placement groove;
[0017] 14. Adjustment assembly; 15. Clamping assembly; 151. Connecting plate; 152. Clamping head;
[0018] 16. Mechanical gripper; 2. Crystal rod. DETAILED DESCRIPTION
[0019] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.
[0020] Please refer to Figures 1 to 4 A cutting device 1 includes a frame 11, a cutting assembly 12 and a loading base 13. The loading bases 13 are provided on both sides of the frame 11 in the length direction, and a cutting gap is provided between the two loading bases 13. The two loading bases 13 can move toward or away from each other to adjust the size of the cutting gap; the two loading bases 13 are combined to form a placement platform for placing a crystal rod 2; the cutting assembly 12 is moved along the length direction of the frame 11 and passes through the cutting gap.
[0021] From the above description, it can be seen that the beneficial effects of the present invention are: through the movable and adjustable design of the cutting gap of the two loading bases 13, the cutting gap is too small during the clamping process of the manipulator on the cut crystal rod 2, which will not cause the edge of the crystal rod 2 to be knocked when micro-movement occurs; in addition, the adjustable design of the cutting gap during the process of taking and placing the crystal rod 2 can also provide design space for shortening the equipment size. For example, in the use of the cutting wire saw 123, if it stays at the cutting position of the crystal rod 2 after cutting, the cutting wire saw 123 will bounce and scratch the crystal rod 2 during the spraying process, and the cutting wire saw 123 needs to be moved forward or backward along the cutting direction as a whole to exit the cutting position of the crystal rod 2. The former will cause the equipment size to be lengthened, and the latter will also bounce and scratch the crystal rod 2 when spraying through a conventional fixed smaller cutting gap. The adjustable cutting gap design provided in the present application can provide a larger cutting gap for the latter without increasing the equipment size to meet the quick and safe withdrawal of the cutting wire saw 123.
[0022] Furthermore, the loading base 13 includes a placement portion 1311 , and the bottom of the crystal rod 2 abuts against the placement portion 1311 ; the two opposite sides of the placement portions 1311 are flat surfaces, and a cutting gap extending along the length direction of the frame 11 is formed between the two flat surfaces.
[0023] From the above description, it can be seen that the placement portion 1311 of the loading base 13 is used to place the crystal rod 2, and a straight cutting gap is formed between the flat surfaces on the opposite sides of the two placement portions 1311 for the cutting component 12 to pass through and cut the crystal rod 2; the size of the cutting gap can be adjusted by moving the two loading bases 13 toward or away from each other.
[0024] Furthermore, a clamping assembly 15 is disposed on the loading base 13 , and the clamping assembly 15 abuts against the top of the crystal rod 2 .
[0025] It can be seen from the above description that, by setting the clamping assembly 15 , it is ensured that the crystal rod 2 remains fixed during the cutting process, thereby ensuring accurate cutting.
[0026] Furthermore, the clamping assembly 15 includes a driving cylinder, a connecting plate 151 and a clamping head 152. The driving cylinder is arranged on the loading base 13. The driving end of the driving cylinder is movable along the height direction of the loading base 13 and is connected to the connecting plate 151 parallel to the top of the crystal rod 2. The part of the connecting plate 151 opposite to the top of the crystal rod 2 is provided with a clamping head 152.
[0027] It can be known from the above description that, by moving the driving end of the driving cylinder, the top of the crystal rod 2 placed on the loading base 13 can be pressed by the clamping head 152 and then fixed up and down.
[0028] Furthermore, an adjustment assembly 14 is provided between the two loading bases 13, and the adjustment assembly 14 includes a driving motor, a screw rod and a slide rail, and the length directions of the screw rod and the slide rail are perpendicular to the length direction of the frame 11; the two ends of the screw rod are respectively provided with a first thread and a second thread with opposite rotation directions, and the lower ends of the two loading bases 13 are respectively threadedly connected to the two ends of the screw rod; the lower ends of the two loading bases 13 are both movably connected to the slide rail; the driving motor is transmission-connected to the screw rod.
[0029] It can be seen from the above description that under the transmission of the lead screw with the first thread and the second thread by the driving motor, the two loading bases 13 can move towards or away from each other, and the slide rail as a guiding structure ensures the accurate movement of the two loading bases 13.
[0030] Furthermore, the clamping assembly 15 also includes a mounting seat 133, the driving cylinder is arranged in the mounting seat 133, and the mounting seat 133 is arranged on the loading base 13; the mounting seat 133 is provided with a positioning surface perpendicular to the placement portion 1311 on the side close to the cutting gap, and the positioning surface is against the side of the crystal rod 2.
[0031] As can be seen from the above description, the mounting seat 133 serves as a mounting space for the driving cylinder on one hand, and can use its positioning surface to abut against the side of the crystal rod 2 on the other hand, so as to clamp and fix the crystal rod 2 when the two loading bases 13 move toward each other.
[0032] Furthermore, the carrier base 13 includes a positioning portion 1312 , and the side surface of the crystal rod 2 abuts against the positioning portion 1312 .
[0033] It can be seen from the above description that the positioning portions 1312 of the carrier base 13 can cooperate with the side surfaces of the clamped crystal ingot 2 to fix the crystal ingot 2 on the left and right when the two carrier bases 13 move toward each other.
[0034] Furthermore, the cutting assembly 12 includes a mounting frame 121, a cutting wheel train 122 and a cutting wire saw 123, the cutting wheel train 122 is installed on the mounting frame 121, the cutting wire saw 123 is wound on the cutting wheel train 122, and the distance between two adjacent sections of the cutting wire saw 123 along the cutting direction is greater than the length of the crystal rod 2; during cutting, only a section of the cutting wire saw 123 partially enters the cutting gap.
[0035] As can be seen from the above description, during the cutting operation, the cutting wire saw 123 is driven to move by the rotation of the cutting wheel train 122, and the crystal rod 2 is cut during the movement of the mounting frame 121. By designing the lengths of the two adjacent wire saw sections of the cutting wire saw 123 and the length of the crystal rod 2, it can be avoided that during the cutting operation, a section of the adjacent wire saw cuts through the crystal rod 2 first and leaves the crystal rod 2 while the other section of the wire saw is still between the two half rods. When the other section of the wire saw leaves the crystal rod 2, due to the cutting process of the crystal rod 2, the spacing between the two half rods is very small, and the cutting position will be continuously sprayed during the cutting process, and a layer of water film will be formed between the two half rods, which will eventually cause a section of the wire saw still in the crystal rod 2 to bounce after leaving the crystal rod 2, thereby scratching the cut crystal rod 2.
[0036] Furthermore, it also includes a mechanical gripper 16 , and the mechanical gripper 16 is provided with gripping parts at both ends of the length direction of the crystal rod 2 ; the mechanical gripper 16 is movable along the moving direction of the loading base 13 .
[0037] As can be seen from the above description, the mechanical gripper 16 can be used to load and grasp the crystal ingot 2 on the material loading base 13 and to transfer and grasp the half ingots formed after the crystal ingot 2 is cut one by one.
[0038] A cutting method, which is applied to any of the cutting devices 1 described above, comprises the following steps: after the crystal rod 2 is cut on the loading base 13, the cutting gap between the two loading bases 13 at this time is a first gap; then the two loading bases 13 move away from each other, and the cutting gap formed between the two loading bases 13 is a second gap, the second gap size is larger than the first gap, and the cutting component 12 moves along the length direction of the frame 11 and returns to the initial position through the second gap.
[0039] As can be seen from the above description, the method adjusts the cutting gap from the size of the first gap that originally matches the cutting of the cutting wire saw 123 to the size of the second gap that is larger and convenient for the cutting wire saw 123 to pass through by moving the carrier base 13 after the crystal ingot 2 is cut. With the size of the second gap, it can effectively avoid scratches on the cut crystal ingot 2 due to the too small cutting gap during the spraying process or other possible side collisions with the cutting wire saw 123 that cause it to bounce. In the process of withdrawing the wire, the cutting assembly 12 can also be quickly withdrawn with the larger second gap, without worrying about the cutting wire saw 123 scratching the crystal ingot 2 and resetting at a low speed, thereby improving the processing efficiency.
[0040] Embodiment 1:
[0041] like Figures 1 to 4As shown, the cutting device 1 of this embodiment includes a frame 11, a cutting component 12, a loading base 13, an adjustment component 14, a pressing component 15 and a mechanical gripper 16. The loading bases 13 are arranged on both sides of the length direction of the frame 11, and the adjustment component 14 is arranged between the two loading bases 13. The adjustment component 14 drives the loading bases 13 to move toward or away from each other; the loading base 13 is provided with a placing portion 1311 and a positioning portion 1312, and the placing portion 1311 is aligned with the crystal The bottom of the crystal rod 2 is abutted against each other, and the positioning part 1312 is abutted against the side of the crystal rod 2; the opposite side of the two placement parts 1311 is a flat surface, and a cutting gap extending along the length direction of the frame 11 is formed between the two flat surfaces; the cutting component 12 is movably arranged along the length direction of the frame 11 and cuts the crystal rod 2 through the cutting gap; the clamping component 15 is arranged above the loading base 13, and the clamping component 15 is pressed toward the placement part 1311 to press the crystal rod 2 against the placement part 1311.
[0042] In this embodiment, the adjustment assembly 14 includes a screw, a slider and a slide rail. The two ends of the screw are respectively provided with a first thread of a first rotation direction and a second thread opposite to the first rotation direction. The two ends of the screw are respectively threadedly connected with sliders; the bottoms of the two loading bases 13 are respectively connected with a slider. The rotation of the screw is controlled by a driving device so that the sliders matched with the corresponding first thread and second thread move toward or away from each other, and the slider drives the corresponding loading base 13 to move at the same time; at the same time, the lower end of the loading base 13 cooperates with the movement of the slide rail to guide the movement.
[0043] Optionally, the adjustment component 14 may also be driven by a cylinder to adjust the distance between the two loading bases 13 .
[0044] In this embodiment, the clamping assembly 15 is fixedly arranged on the carrier base 13. Specifically, a mounting seat 133 is provided on the carrier base 13, and a mounting space for lifting and lowering the clamping assembly 15 is provided in the mounting seat 133. The clamping assembly 15 includes a driving cylinder, a connecting plate and a clamping head. The driving end of the driving cylinder drives the connecting plate to move up and down, and the connecting plate protrudes toward the carrier base 13 on the other side, and the crystal rod 2 on the placement part 1311 of the carrier base 13 is clamped and fixed by the clamping head. One side of the mounting seat 133 and the positioning part 1312 of the carrier base 13 are against the side of the placed crystal rod 2.
[0045] The clamping assembly 15 presses and fixes the top of the crystal ingot 2 after the crystal ingot 2 is placed on the carrier base 13 and clamped and fixed by the adjustment assembly 14 .
[0046] Optionally, the clamping assembly 15 may also be disposed on the frame 11, and a support may be extended from the bottom of the frame 11 toward the height of the loading base 13, or a support may be extended from the top of the frame 11 toward the height of the loading base 13 to clamp the crystal rod 2 on the loading base 13 up and down.
[0047] A positioning cylinder 134 that can move toward the positioning portion 1312 of another loading base 13 can be added to the loading base 13 as an auxiliary positioning structure, and cooperate with the adjustment component 14 to respectively realize the coarse adjustment and fine adjustment of the distance between the two loading bases 13.
[0048] A plurality of pads 135 are arranged at intervals on the placement portion 1311 and the positioning portion 1312; a plurality of placement grooves 136 are arranged at intervals along the length direction of the placement portion 1311, and the length direction of the placement grooves 136 is parallel to the moving direction of the carrier base 13; the pads 135 are movable and adjustable along the placement grooves 136. The pads 135 used can buffer the placement of the crystal rod 2, and at the same time prevent the crystal rod 2 from directly contacting and rubbing with the carrier base 13 to produce scratches, etc.; in the design of matching the size of the crystal rod 2, by moving and adjusting the pads 135 in the placement grooves 136, the appropriate position of the pads 135 can be adjusted according to the size of the crystal rod 2 to ensure stable force during placement.
[0049] The material loading base 13 includes a positioning structure 131 and a reinforcing structure 132. The positioning structure 131 faces the frame 11 and is L-shaped. The horizontal portion of the positioning structure 131 is a placement portion 1311, and the vertical portion of the positioning structure 131 is a positioning portion 1312. The reinforcing structure 132 is connected to the side of the positioning portion 131 away from the frame 11. The reinforcing structure 132 includes a plurality of reinforcing ribs connected to the vertical portion of the positioning structure 131. The horizontal portion and the vertical portion of the L-shaped positioning structure 131 are used as tooling structures for receiving the bottom of the crystal rod 2 and clamping the side thereof, respectively. The design of the reinforcing ribs of the reinforcing structure 132 on the side of the positioning structure 131 away from the frame 11 can reduce consumables while ensuring structural strength.
[0050] The mechanical gripper 16 is provided with grasping parts at both ends of the length direction of the crystal rod 2, and the mechanical gripper 16 is movable along the moving direction of the loading base 13; the adjustment component 14 cooperates with the mechanical gripper 16 to separate the cut crystal rod 2 and grasp them one by one by the mechanical gripper 16; the mechanical gripper 16 serves as a structure for grasping and transferring the crystal rod 2, and it cooperates with the adjustment component 14 to separate the crystal rod 2 on the loading base 13 after being cut to facilitate the grasping of the mechanical gripper 16.
[0051] The cutting assembly 12 includes a mounting frame 121, a cutting wheel train 122 and a cutting wire saw 123. The cutting wheel train 122 is mounted on the mounting frame 121. The cutting wire saw 123 is wound around the cutting wheel train 122. The distance between two adjacent sections of the cutting wire saw 123 along the cutting direction is greater than the length of the crystal rod 2. The mounting frame 121 of the cutting assembly 12 is coordinated with the frame 11 for movement. During the cutting operation, the mounting frame 121 is moved along the length direction of the frame 11 by a driving device to approach the crystal rod 2 fixed on the loading base 13, and the crystal rod 2 is cut by the cooperation of the cutting wheel train 122 and the cutting wire saw 123. Under the coordinated design of the length of the wire saw parts at both ends of the adjacent cutting wire saw 123 and the length of the crystal rod 2, the cutting wire saw 123 can only keep one section of the cutting wire saw 123 during operation and then cut the cutting gap to avoid multiple sections of the cutting wire saw 123 entering the cutting gap at the same time and causing the cutting wire saw 123 to bounce and scratch the crystal rod due to spraying during the subsequent wire withdrawal process.
[0052] In this embodiment, the cutting wheel train 122 adopts a four-wheel train structure, and the wound cutting wire saw 123 forms a rectangular structure. The cutting wheel train 122 is provided with two groups of cutting wheels spaced up and down at the part close to the front side of the mounting frame 121, and two groups of cutting wheels spaced up and down at the part close to the rear side of the mounting frame 121; the interval between the part of the wound cutting wire saw 123 at the front side of the mounting frame 121 and the part at the rear side of the mounting frame is greater than the length of the crystal rod 2. The four-wheel train structure can adjust the distance between two adjacent sections of the cutting wire saw 123 by adjusting the cutting wheels close to the front side of the mounting frame 121 and the rear side of the mounting frame 121, and then use the design of the cutting wire saw 123 for different crystal rod cutting processes to avoid the situation where multiple sections of the cutting wire saw 123 need to pass through the cutting gap and bounce under the spraying process and other processes to scratch the crystal rod. If the conventional four-wheel cutting gear train 122 is directly applied to the traditional cutting assembly 12, multiple cutting wire saws 123 will appear during the cutting process, and the cutting gap will bounce under the influence of external factors and scratch the crystal rod. It is often necessary to withdraw the cutting wire saw 123 as a whole from the cutting gap and spray to remove chips, resulting in an overly long design in terms of equipment size.
[0053] Embodiment 2:
[0054] A cutting method, which is applied to the cutting device 1 described in the first embodiment, comprises the following steps: the mechanical gripper 16 grabs the crystal rod 2 and transfers it to the carrier base 13, and the two carrier bases 13 are driven by the adjustment component 14 to move toward each other so that the positioning surface of the positioning portion 1312 and the mounting seat 133 clamps the two sides of the crystal rod 2; then the clamping head 152 of the clamping component 15 presses the top of the crystal rod 2 to complete the fixation of the crystal rod 2; at the same time, the cutting gap between the two carrier bases 13 at this time is a first gap, and the first gap is adapted to the size of the cutting wire saw 123 of the cutting component 12;
[0055] The cutting wheel train 122 of the cutting assembly 12 drives the cutting wire saw 123 to move, and the mounting frame 121 of the cutting assembly 12 moves along the length direction of the frame 11 to enable the cutting wire saw 123 to enter the cutting gap to cut the crystal rod 2;
[0056] After the crystal rod 2 is cut on the loading base 13, the cutting gap between the two loading bases 13 is the first gap; then the two loading bases 13 move away from each other under the drive of the adjustment component 14, and the cutting gap formed between the two loading bases 13 is the second gap, and the size of the second gap is larger than the first gap. The cutting component 12 moves along the length direction of the frame 11 and returns to the initial position through the second gap.
[0057] In summary, the cutting device and the cutting method using the same provided by the present invention, through the design of movable adjustment of the cutting gap of the two loading bases, can prevent the edge of the crystal rod from being knocked when the cutting gap is too small during the clamping process of the manipulator for the cut crystal rod; in addition, the adjustable design of the cutting gap during the process of taking and placing the crystal rod can also provide design space for shortening the size of the equipment. For example, in the use of the cutting wire saw, if it stays at the cutting position of the crystal rod after cutting, the cutting wire saw will bounce during the spraying process and scratch the crystal rod, and then the cutting wire saw needs to be moved forward along the cutting direction as a whole. The cutting position of the crystal rod can be withdrawn forward or backward. The former will cause the size of the equipment to be lengthened, and the latter will also cause the crystal rod to be scratched if spraying is performed when passing through the conventional fixed smaller cutting gap. The adjustable cutting gap design provided in the present application can provide a larger cutting gap for the latter without increasing the size of the equipment to meet the needs of the cutting wire saw for rapid and safe wire withdrawal. The method adjusts the cutting gap from the size of the first gap that originally matches the cutting of the cutting wire saw to the size of the larger second gap that is convenient for the cutting wire saw to pass through by adjusting the movement of the loading base after the crystal rod is cut. Under the size of the second gap, it can effectively avoid the spraying process or other processes that may cause the cutting wire saw to have a lateral collision and cause it to bounce, resulting in scratches on the cut crystal rod due to the too small cutting gap. During the wire withdrawal process, the cut assembly can also be quickly withdrawn under the larger second gap, without worrying about the cutting wire saw scratching the crystal rod and resetting at a low speed, thereby speeding up the processing efficiency.
[0058] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A cutting device, characterized in that: It includes a frame, a cutting assembly and a loading base. The loading bases are arranged on both sides of the length direction of the frame, a cutting gap is arranged between the two loading bases, and the two loading bases can be moved toward or away from each other to adjust the size of the cutting gap; the two loading bases are combined to form a placement platform for placing crystal rods; the cutting assembly is moved along the length direction of the frame and passes through the cutting gap.
2. The cutting device according to claim 1, characterized in that: The material loading base comprises a placing portion, and the bottom of the crystal rod abuts against the placing portion; the opposite sides of the two placing portions are flat surfaces, and a cutting gap extending along the length direction of the frame is formed between the two flat surfaces.
3. The cutting device according to claim 2, characterized in that: A clamping assembly is disposed on the carrier base, and the clamping assembly abuts against the top of the crystal rod.
4. The cutting device according to claim 3, characterized in that: The clamping assembly includes a driving cylinder, a connecting plate and a clamping head. The driving cylinder is arranged on a loading base. The driving end of the driving cylinder is movable along the height direction of the loading base and is connected to a connecting plate parallel to the top of the crystal rod. The part of the connecting plate opposite to the top of the crystal rod is provided with a clamping head.
5. The cutting device according to claim 1, characterized in that: An adjustment assembly is provided between the two loading bases, and the adjustment assembly includes a driving motor, a screw rod and a slide rail, and the length directions of the screw rod and the slide rail are perpendicular to the length direction of the frame; the two ends of the screw rod are respectively provided with a first thread and a second thread with opposite rotation directions, and the lower ends of the two loading bases are respectively threadedly connected to the two ends of the screw rod; the lower ends of the two loading bases are both movably connected to the slide rail; the driving motor is transmission-connected to the screw rod.
6. The cutting device according to claim 4, characterized in that: The clamping assembly also includes a mounting seat, the driving cylinder is arranged in the mounting seat, and the mounting seat is arranged on a loading base; a positioning surface perpendicular to the placement portion is provided on the side of the mounting seat close to the cutting gap, and the positioning surface is against the side of the crystal rod.
7. The cutting device according to claim 1, characterized in that: The carrier base includes a positioning portion, and the side surface of the crystal rod abuts against the positioning portion.
8. The cutting device according to claim 1, characterized in that: The cutting assembly includes a mounting frame, a cutting wheel train and a cutting wire saw, wherein the cutting wheel train is mounted on the mounting frame, the cutting wire saw is wound around the cutting wheel train, and the distance between two adjacent sections of the cutting wire saw along the cutting direction is greater than the length of the crystal rod; during cutting, only a section of the cutting wire saw enters the cutting gap.
9. The cutting device according to claim 1, characterized in that: It also includes a mechanical gripper, which is provided with gripping parts at both ends of the mechanical gripper corresponding to the length direction of the crystal rod; the mechanical gripper is movable along the moving direction of the loading base.
10. A cutting method, characterized in that: It is applied to the cutting device described in any one of claims 1 to 9 above, and includes the following steps: after the crystal rod is cut on the loading base, the cutting gap between the two loading bases at this time is the first gap; then the two loading bases move away from each other, and the cutting gap formed between the two loading bases is the second gap, the second gap size is larger than the first gap, and the cutting assembly moves along the length direction of the frame and returns to the initial position through the second gap.