Ultrathin digital screen and preparation method thereof

Abstract

The invention discloses an ultrathin digital screen and a preparation method thereof, and relates to the technical field of digital screens, and the preparation method comprises the following steps: S1, fixing a plurality of bearing sheets on the back surface of a flexible circuit jointed board to obtain a first combined circuit jointed board; s2, the first combined circuit jointed board is attached to a tray, soldering paste printing, multiple light-emitting component pasting and reflow soldering are sequentially carried out, and a second combined circuit jointed board is obtained; s3, a plurality of reflection cavities are formed in the face, where the light-emitting components are attached, of the second combined circuit jointed board, and a first assembled jointed board is obtained; s4, pasting a plurality of diaphragms on the surfaces of the plurality of reflection cavities of the first assembled jointed board to obtain a second assembled jointed board; and S5, separating a plurality of ultrathin digital screens from the second group of jointed boards. According to the invention, the ultrathin digital screen is produced and manufactured in a jointed board form, so that the production efficiency can be effectively improved; and the bearing sheet is correspondingly fixed on the back surface of the flexible circuit single board, so that the production quality of the ultrathin digital screen can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of digital screens, and in particular to an ultra-thin digital screen and a preparation method thereof. Background Art

[0002] A digital screen is a screen that can display numbers, letters, symbols and simple images. It can be used in various electronic products. The market demand for digital screens is huge; however, current digital screens are mainly manufactured in the form of single boards, with very low production efficiency, which cannot meet shipment needs.

[0003] In addition, in pursuit of thinness and lightness, digital screens are gradually adopting flexible circuit boards (FPCs) instead of printed circuit boards (PCBs). However, compared with hard printed circuit boards (PCBs), flexible circuit boards (FPCs) are relatively soft, which makes the flexible circuit boards (FPCs) easily displaced by force during the printing of solder paste, causing the solder paste to deviate from the position of the pads, which will affect the placement quality of components. During the production turnover process, since the flexible circuit boards (FPCs) are relatively soft, they are easy to bend or fold, which will affect the stability of components after placement. A reflective cavity needs to be installed on the surface of the flexible circuit board (FPC), but the flexible circuit board (FPC) is relatively soft, and the reflective cavity cannot be directly and effectively fixed, and it is not conducive to the subsequent precise pasting of the diaphragm on the surface of the reflective cavity. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides an ultra-thin digital screen and a preparation method thereof. The ultra-thin digital screen is produced in the form of a puzzle board, which can effectively improve the production efficiency; a corresponding fixed carrier sheet is arranged on the back of the flexible circuit board, which can effectively ensure the printing accuracy of the solder paste, the mounting quality and mounting stability of the light-emitting components, and can also facilitate the fixation of the reflective cavity and the precise pasting of the subsequent diaphragm, thereby helping to ensure the production quality of the ultra-thin digital screen.

[0005] The present invention provides a method for preparing an ultra-thin digital screen, comprising the following steps:

[0006] S1. Fixing a plurality of carrier sheets on the back of the flexible circuit panel, wherein the plurality of carrier sheets correspond to a plurality of flexible circuit boards in the flexible circuit panel one by one, to obtain a first combined circuit panel;

[0007] S2, attaching the first combined circuit panel to a tray, and printing solder paste, mounting a plurality of light-emitting components, and reflow soldering on the front side of the flexible circuit panel in sequence to obtain a second combined circuit panel;

[0008] S3, a plurality of reflective cavities are arranged on the surface of the second combined circuit panel on which the plurality of light-emitting components are mounted, and the plurality of reflective cavities are fixedly connected to the plurality of carrier sheets in a one-to-one correspondence to obtain a first assembled panel;

[0009] S4, pasting a plurality of film sheets on the surfaces of the plurality of reflective cavities of the first assembled panel, wherein the plurality of film sheets correspond to the plurality of reflective cavities one by one, to obtain a second assembled panel;

[0010] S5, separating the panels, and separating a plurality of ultra-thin digital screens from the second assembly panels.

[0011] Specifically, the flexible circuit panel is black.

[0012] Specifically, the flexible circuit panel is provided with a plurality of first positioning holes, and the plurality of first positioning holes are located outside the plurality of flexible circuit boards.

[0013] Specifically, the plurality of flexible circuit boards are formed by laser cutting.

[0014] Specifically, the flexible circuit panel comprises a frame plate, the plurality of flexible circuit boards are located in the frame plate, and each of the plurality of flexible circuit boards is connected to the frame plate based on at least three connecting ribs.

[0015] Specifically, each of the plurality of flexible circuit boards is provided with an exhaust hole.

[0016] Specifically, the thickness of each of the plurality of carrier sheets is in the range of 0.2 mm to 0.3 mm.

[0017] Specifically, the plurality of supporting sheets include one or more of a glass fiber sheet, a metal sheet, a wood sheet, and a thermosetting resin sheet.

[0018] Specifically, step S2 includes:

[0019] S21, attaching the first combined circuit panel with the plurality of carrier sheets fixed thereon on a tray downward, and sending the first combined circuit panel together with the tray into a printing machine; printing solder paste on the front side of the flexible circuit panel through a steel mesh, wherein the solder paste is located on the pads of the corresponding flexible circuit board;

[0020] S22, sending the first combined circuit panel printed with the solder paste together with the tray into a placement machine, and placing a plurality of light-emitting components on the solder paste accordingly;

[0021] S23, sending the first combined circuit panel with the plurality of light-emitting components attached thereto together with the tray into a reflow furnace, curing the solder paste through reflow soldering, and obtaining a second combined circuit panel.

[0022] Specifically, the solder paste is tin paste or silver paste.

[0023] Specifically, the plurality of light-emitting components include one or both of light-emitting elements and light-emitting devices.

[0024] Specifically, a plurality of printing holes are arranged in the steel mesh, and a cross section of any of the printing holes is an isosceles trapezoidal structure.

[0025] Specifically, the hole wall of any of the printing holes is plated with a nano film layer.

[0026] Specifically, the thickness of the steel mesh is 0.03 mm or 0.04 mm.

[0027] Specifically, step S3 includes:

[0028] S31, placing a plurality of reflective cavities on a carrier plate, each of the reflective cavities being provided with a plurality of reflective light exit holes, and at least two positioning posts being provided on the back of each of the reflective cavities, with the positioning posts of each of the reflective cavities being placed upwards;

[0029] S32, assembling the second combined circuit panel with the plurality of light-emitting components mounted thereon with the side facing downwards to the plurality of reflective cavities, wherein the positioning posts of the plurality of reflective cavities are arranged on the corresponding flexible circuit board and the carrier sheet, and the plurality of light-emitting components are located in the reflective light output holes of the corresponding reflective cavities;

[0030] S33, hot-pressing and deforming the positioning posts of the plurality of reflective cavities to fix the corresponding carrier sheets to obtain a first assembly panel.

[0031] Specifically, the color of the reflective cavity is black or white.

[0032] Specifically, the material of the reflective cavity is one of polyethylene terephthalate, polyethylene terephthalate, and polybutylene terephthalate.

[0033] Specifically, the included angle between the inner wall of the reflective light output hole and the front surface of the reflective cavity is 60° to 90°.

[0034] Specifically, step S4 includes:

[0035] S41, feeding the adhesive film into a film laminating machine, wherein the adhesive film comprises a front release paper, a film layer and a back release paper laminated in sequence, wherein the film layer comprises a plurality of film sheets, wherein the plurality of film sheets are distributed according to the layout of the plurality of reflective cavities, wherein the front sides of the plurality of film sheets are provided with an electrostatic coating, and the back sides of the plurality of film sheets are provided with an adhesive layer;

[0036] S42, attaching the first assembled panel with the plurality of carrier sheets fixed thereon onto the pallet with the surface facing downward, and sending the first assembled panel together with the pallet into the laminating machine;

[0037] S43, the film laminating machine tears off the release paper on the back of the film to expose the adhesive layers of the plurality of film sheets;

[0038] S44, the film pasting machine pastes the plurality of film sheets on the surfaces of the plurality of reflective cavities in batches, and the back sides of the plurality of film sheets are bonded to the plurality of reflective cavities in a one-to-one correspondence, to obtain a second assembly panel.

[0039] Specifically, the material of each of the plurality of membranes is one of polyethylene terephthalate, polyethylene terephthalate, and polybutylene terephthalate.

[0040] Specifically, the back side of each of the plurality of membranes is printed with fluorescent powder.

[0041] Specifically, a plurality of second positioning holes are arranged on the front release paper.

[0042] Specifically, the material of the adhesive layer is thermal conductive adhesive or double-sided adhesive.

[0043] Specifically, before step S5, the method further includes:

[0044] The second assembled puzzle panel is subjected to a lighting test.

[0045] Specifically, before step S5, the method further includes:

[0046] A plurality of double-sided films are pasted on the surfaces of the plurality of carrier sheets of the second assembly panel, and the plurality of double-sided films correspond to the plurality of carrier sheets one by one.

[0047] Specifically, step S5 includes:

[0048] The second assembly of panels is placed into a panel separation mold to separate a number of ultra-thin digital screens.

[0049] Specifically, the panel separation mold includes a panel separation base and a panel separation upper mold. The second assembly panel is placed on the panel separation base with one side having the plurality of carrier sheets fixed thereon facing upward. The panel separation mold correspondingly squeezes the plurality of carrier sheets to separate the plurality of ultra-thin digital screens.

[0050] The present invention also provides an ultra-thin digital screen, wherein the ultra-thin digital screen is prepared by the preparation method of the ultra-thin digital screen;

[0051] The ultra-thin digital screen includes a carrier sheet, a flexible circuit board, a plurality of light-emitting components, a reflective cavity and a diaphragm which are arranged in sequence from bottom to top. The carrier sheet and the flexible circuit board are fixedly connected, the flexible circuit board and the plurality of light-emitting components are fixedly connected, the reflective cavity is fixedly connected to the carrier sheet through the flexible circuit board, the diaphragm is adhered to the surface of the reflective cavity, the plurality of light-emitting components are accommodated in the reflective cavity, and the light emitted by the plurality of light-emitting components is emitted from the diaphragm.

[0052] Compared with the prior art, the present invention has the following beneficial effects:

[0053] In the present invention, based on the flexible circuit panel, the ultra-thin digital screen is manufactured in the form of panel, and the fixing of the carrier sheet, the printing of solder paste, the mounting of the light-emitting components, the fixing of the reflective cavity, the pasting of the diaphragm, the separation of the ultra-thin digital screen, etc. can be carried out in batches, thereby significantly improving the production efficiency of the ultra-thin digital screen, which is conducive to meeting the huge shipment demand;

[0054] Moreover, a carrier sheet is fixed on the back side of the flexible circuit board, which can effectively improve its strength while keeping the flexible circuit board light and thin, which is beneficial to reduce the displacement of the flexible circuit board during the printing of solder paste, and avoid bending or folding of the flexible circuit board during turnover, thereby effectively ensuring the printing accuracy of the solder paste, the mounting quality of the light-emitting components and the mounting stability; the reflective cavity can be fixedly connected to the carrier sheet, so that the reflective cavity can be effectively fixed on the surface of the flexible circuit board, and it is also convenient for the subsequent precise pasting of the membrane; this is beneficial to ensuring the production quality of ultra-thin digital screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0056] Figure 1 It is a schematic flow chart of a method for preparing an ultra-thin digital screen in an embodiment of the present invention;

[0057] Figure 2 1 is a front structural diagram of a first combined circuit panel in an embodiment of the present invention;

[0058] Figure 3 is a schematic diagram of the front structure of a flexible circuit board in an embodiment of the present invention;

[0059] Figure 4is a schematic diagram of the back structure of the first combined circuit panel in an embodiment of the present invention;

[0060] Figure 5 1 is a schematic diagram of the back structure of a flexible circuit board with a carrier sheet in an embodiment of the present invention;

[0061] Figure 6 This is a schematic diagram of the structure of a flexible circuit board after light-emitting components are mounted on it in an embodiment of the present invention;

[0062] Figure 7 yes Figure 1 Schematic diagram of the process of step S2;

[0063] Figure 8 is a schematic diagram of the structure of the printing hole in an embodiment of the present invention;

[0064] Fig. 9 2 is a schematic diagram of the structure of the second combined circuit panel after the reflective cavity is fixed in the embodiment of the present invention;

[0065] Fig.10 This is a schematic diagram of the structure of the flexible circuit board after fixing the reflective cavity in an embodiment of the present invention;

[0066] Fig.11 yes Figure 1 Schematic diagram of the process of step S3;

[0067] Fig.12 is a schematic diagram of the front structure of the reflection cavity in an embodiment of the present invention;

[0068] Fig.13 is a schematic diagram of the back structure of the reflection cavity in an embodiment of the present invention;

[0069] Fig.14 is a schematic diagram of the cross-sectional structure of the reflective light output hole in an embodiment of the present invention;

[0070] Fig.15 This is a schematic diagram of the structure of the first assembly of panels after the film is attached in the embodiment of the present invention;

[0071] Fig.16 This is a schematic diagram of the structure of the flexible circuit board after the film is attached to the flexible circuit board in the embodiment of the present invention;

[0072] Fig.17 yes Figure 1 Schematic diagram of the process of step S4 in FIG.

[0073] In the accompanying drawings, 100, flexible circuit panel; 110, frame plate; 111, first positioning hole; 120, flexible circuit board; 121, light-emitting component; 200, carrier sheet; 300, reflective cavity; 310, reflective light output hole; 320, positioning column; 400, diaphragm. DETAILED DESCRIPTION

[0074] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0075] The present invention provides a method for preparing an ultra-thin digital screen. Figure 1 The flowchart of the method for preparing the ultra-thin digital screen in the embodiment of the present invention is shown, which includes the following steps:

[0076] S1. Fixing a plurality of carrier sheets on the back of the flexible circuit panel, wherein the plurality of carrier sheets correspond to a plurality of flexible circuit boards in the flexible circuit panel one by one, to obtain a first combined circuit panel;

[0077] Figure 2 FIG. 2 shows a front structural diagram of a first combined circuit panel in an embodiment of the present invention. Figure 3 FIG. 1 shows a front structural diagram of a flexible circuit board in an embodiment of the present invention. Figure 4 FIG. 2 shows a schematic diagram of the back structure of the first combined circuit panel in an embodiment of the present invention. Figure 5 A schematic diagram of the back structure of a flexible circuit board with a carrier sheet in an embodiment of the present invention is shown.

[0078] Based on the flexible circuit panel 100, the ultra-thin digital screen is produced and manufactured in the form of a panel, and the carrier sheet 200 can be fixed in batches, which is beneficial to improving the production efficiency of the ultra-thin digital screen; the carrier sheet 200 is fixed on the back of the flexible circuit single board 120, which can effectively improve its strength while keeping the flexible circuit single board 120 light and thin, and facilitate subsequent processing and turnover.

[0079] In some specific embodiments, the flexible circuit panel 100 is black, has good light absorption effect, and can prevent light leakage.

[0080] For details, please refer to Figure 2 A plurality of first positioning holes 111 are provided on the flexible circuit panel 100. The plurality of first positioning holes 111 are located outside the plurality of flexible circuit boards 120. The first positioning holes 111 can be used for positioning the flexible circuit panel 100 itself, and can also be used for auxiliary positioning of other accessories, so as to facilitate positioning for subsequent processing.

[0081] In some specific embodiments, the plurality of flexible circuit boards 120 are formed by laser cutting, which can reduce the overall deformation of the flexible circuit panel 100 and facilitate the subsequent precise printing of solder paste.

[0082] For details, please refer to Figure 2 The flexible circuit panel 100 includes a frame plate 110, and the plurality of flexible circuit boards 120 are located in the frame plate 110. Each of the plurality of flexible circuit boards 120 is connected to the frame plate 110 based on at least three connecting ribs, which can reduce the displacement of the flexible circuit board 120 in the subsequent solder paste printing process, and is conducive to the subsequent accurate printing of solder paste. Preferably, each flexible circuit board 120 is connected to the frame plate 110 based on four connecting ribs, so that the stability of the flexible circuit board 120 in the frame plate 110 is higher and it is not easy to deform or displace.

[0083] In some specific embodiments, each of the plurality of flexible circuit boards 120 is provided with an exhaust hole, which can prevent the flexible circuit board 120 from bulging during subsequent reflow soldering.

[0084] In some specific embodiments, the thickness of each carrier sheet 200 in the plurality of carrier sheets 200 is in the range of 0.2 mm to 0.3 mm, which can effectively improve the strength of the flexible circuit board 120 while keeping it light and thin.

[0085] Specifically, the plurality of carrier sheets 200 include one or more of glass fiber sheets, metal sheets, wood sheets, and thermosetting resin sheets; it should be noted that the carrier sheets 200 are insulated from the flexible circuit board 120. The metal sheets include steel sheets, copper sheets, etc.; preferably, the carrier sheets 200 are steel sheets, which have high strength and good heat dissipation, and can stably carry the flexible circuit board 120.

[0086] Furthermore, the carrier sheet 200 is embedded with or doped with magnetic material and can be adsorbed by a magnet, so as to facilitate the bonding of the flexible circuit panel 100 .

[0087] S2, attaching the first combined circuit panel to a tray, and printing solder paste, mounting a plurality of light-emitting components, and reflow soldering on the front side of the flexible circuit panel in sequence to obtain a second combined circuit panel;

[0088] Figure 6 The schematic diagram shows the structure of the flexible circuit board after mounting the light-emitting components in the embodiment of the present invention.

[0089] Under the effect of the carrier sheet 200 , the printing accuracy of the solder paste, the mounting quality and the mounting stability of the light-emitting component 121 are effectively improved.

[0090] Figure 7 Shows Figure 1 Schematic diagram of the process of step S2, step S2 includes:

[0091] S21, attaching the first combined circuit panel with the plurality of carrier sheets fixed thereon on a tray downward, and sending the first combined circuit panel together with the tray into a printing machine; printing solder paste on the front side of the flexible circuit panel through a steel mesh, wherein the solder paste is located on the pads of the corresponding flexible circuit board;

[0092] With the help of the carrier sheet 200, the first combined circuit panel can be flatly attached to the tray, and it is not easy to shift or deform, which is convenient for the subsequent accurate printing of solder paste on the pads of the corresponding flexible circuit single board 120. The solder paste is printed on the flexible circuit panel 100 using the steel screen printing process, with high printing accuracy and good consistency, and can also effectively improve production efficiency.

[0093] Specifically, magnets are embedded in the tray, and the carrier sheet 200 is magnetic, so that the first combination circuit panel can be attached to the tray by magnetic adsorption, and the operation is convenient and quick.

[0094] In some specific embodiments, the solder paste is tin paste or silver paste, which has good conductivity and is beneficial to improving the subsequent mounting quality of the light-emitting component 121.

[0095] In some specific embodiments, the steel mesh is provided with a plurality of printing holes, which are designed according to the distribution of the pads of the flexible circuit board 120 in the flexible circuit panel 100, and are used to accurately print the solder paste in batches onto the pads of the corresponding flexible circuit board 120; Figure 8 A schematic diagram of the structure of the printing hole in an embodiment of the present invention is shown. The cross-section of any of the printing holes is an isosceles trapezoidal structure, and a solder paste in the shape of an isosceles trapezoid can be printed. During the subsequent reflow soldering, the solder paste at the small end of the isosceles trapezoidal solder paste will be automatically pulled by the solder paste at the large end under the action of surface tension, which is conducive to the solder paste converging on the pad and reducing the risk of the solder paste overflowing from the pad to form solder beads.

[0096] Typically, the pads on the flexible circuit board 120 are positive pads and negative pads distributed in pairs, and the corresponding printed holes on the steel mesh are also distributed in pairs; in the two printed holes distributed in pairs (the cross-section is an isosceles trapezoidal structure), the small ends of the two printed holes are arranged opposite to each other, so that the small ends of the two isosceles trapezoidal solder pastes printed out are also opposite to each other; during the subsequent reflow soldering, the solder pastes at the small ends of the two isosceles trapezoidal solder pastes will be automatically pulled by the solder pastes at the large ends under the action of surface tension, thereby avoiding contact and adhesion between the two pieces of solder pastes.

[0097] Specifically, the hole wall of any of the printing holes is plated with a nano-film layer, which can give the hole wall of the printing hole a smooth property, which is conducive to the smooth flow of solder paste and is not easy to adhere to the printing hole.

[0098] In some specific embodiments, the thickness of the steel mesh is 0.03 mm or 0.04 mm, and the paste application efficiency is good.

[0099] S22, sending the first combined circuit panel printed with the solder paste together with the tray into a placement machine, and placing a plurality of light-emitting components on the solder paste accordingly;

[0100] The first combined circuit board printed with solder paste is still flatly attached to the tray, which can meet the flatness requirement when the light-emitting component 121 is mounted.

[0101] In some specific implementations, the plurality of light-emitting components include one or both of a light-emitting element and a light-emitting device, which can be selected for use according to specific needs. Preferably, the light-emitting element is a flip-chip LED chip, which can be directly die-bonded without the need for operations such as gold wire bonding, which is convenient and quick.

[0102] S23, sending the first combined circuit panel with the plurality of light-emitting components attached thereto together with the tray into a reflow furnace, curing the solder paste through reflow soldering, and obtaining a second combined circuit panel.

[0103] The first combined circuit panel with a plurality of light-emitting components 121 is still flatly attached to the tray, which is conducive to its smooth turnover and ensures the fixing effect of the light-emitting components 121.

[0104] S3, a plurality of reflective cavities are arranged on the surface of the second combined circuit panel on which the plurality of light-emitting components are mounted, and the plurality of reflective cavities are fixedly connected to the plurality of carrier sheets in a one-to-one correspondence to obtain a first assembled panel;

[0105] Fig. 9 The schematic diagram of the structure of the second combined circuit panel after fixing the reflective cavity in the embodiment of the present invention is shown. Fig.10 The schematic diagram shows the structure of the flexible circuit board after fixing the reflective cavity in the embodiment of the present invention.

[0106] The reflective cavity 300 can concentrate the light emitted by the light-emitting component 121, which is beneficial to improving the light output effect.

[0107] Fig.11 Shows Figure 1 Schematic diagram of the process of step S3, step S3 includes:

[0108] S31, placing a plurality of reflective cavities on a carrier plate, each of the reflective cavities being provided with a plurality of reflective light exit holes, and at least two positioning posts being provided on the back of each of the reflective cavities, with the positioning posts of each of the reflective cavities being placed upwards;

[0109] A plurality of grooves are provided in the carrier according to the shape of the reflective cavity 300 for stably placing the reflective cavity 300 and facilitating assembly and hot pressing of the reflective cavity 300 and the second combined circuit panel. Fig.12 The front structural diagram of the reflective cavity in the embodiment of the present invention is shown. The reflective light-emitting hole 310 of the reflective cavity 300 is used to accommodate the light-emitting component 121, which is beneficial to improve the light-emitting brightness of the light-emitting component 121; Fig.13 The back structural schematic diagram of the reflective cavity in the embodiment of the present invention is shown. The positioning column 320 of the reflective cavity 300 is used to pass through the corresponding flexible circuit board 120 and the carrier sheet 200, and plays a fixing role after hot pressing.

[0110] In some specific embodiments, the color of the reflective cavity 300 is black or white to prevent light leakage.

[0111] Specifically, the material of the reflective cavity 300 is one of polyethylene terephthalate (PCT), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT), which has high strength, good toughness, and heat resistance. Preferably, the material of the reflective cavity 300 is polyethylene terephthalate (PCT), which has the strength and toughness of PBT, and better heat resistance than PET.

[0112] In some specific embodiments, Fig.14 The cross-sectional structure diagram of the reflective light emitting hole in the embodiment of the present invention is shown. The angle α between the inner wall of the reflective light emitting hole 310 and the front surface of the reflective cavity 300 is 60° to 90°, which is conducive to concentrating the light emitted by the light-emitting component 121.

[0113] S32, assembling the second combined circuit panel with the plurality of light-emitting components mounted thereon with the side facing downwards to the plurality of reflective cavities, wherein the positioning posts of the plurality of reflective cavities are arranged on the corresponding flexible circuit board and the carrier sheet, and the plurality of light-emitting components are located in the reflective light output holes of the corresponding reflective cavities;

[0114] The positioning column 320 can play a fixing role after subsequent hot pressing, so that the carrier sheet 200, the flexible circuit board 120 and the reflective cavity 300 are firmly fixed together; the reflective light hole 310 can reflect light, which is beneficial to improve the light brightness of the light-emitting component 121.

[0115] S33, hot-pressing and deforming the positioning posts of the plurality of reflective cavities to fix the corresponding carrier sheets to obtain a first assembly panel.

[0116] The assembled second combined circuit panel and several reflective cavities 300 are sent into a hot press together with a carrier plate, and the positioning posts 320 are hot-pressed at a certain temperature so that the positioning posts 320 are deformed to clamp the carrier sheet 200, forming a firm connection effect without adding glue for fixing.

[0117] S4, pasting a plurality of film sheets on the surfaces of the plurality of reflective cavities of the first assembled panel, wherein the plurality of film sheets correspond to the plurality of reflective cavities one by one, to obtain a second assembled panel;

[0118] Fig.15 It shows a schematic diagram of the structure after the first assembly of the jigsaw puzzle is attached to the membrane sheet in the embodiment of the present invention, Fig.16 The schematic diagram shows the structure of the flexible circuit board after the film is attached in the embodiment of the present invention.

[0119] The diaphragm 400 can seal the reflective light output hole 310 of the reflective cavity 300, and protect the light-emitting components 121 in the reflective light output hole 310; the diaphragm 400 can also exert a light expansion effect, which is beneficial to improving the display effect.

[0120] In some specific embodiments, phosphor is printed on the back of each of the plurality of diaphragms 400 , and the phosphor cooperates with the light-emitting element 121 to excite the desired light; for example, a blue LED chip excites yellow phosphor to produce white light.

[0121] In some specific embodiments, the material of each of the plurality of diaphragms 400 is one of polyethylene terephthalate (PCT), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT), which has good transparency and impact resistance. Preferably, the material of each of the plurality of diaphragms 400 is polyethylene terephthalate (PET), which has good creep resistance, fatigue resistance, friction resistance, and dimensional stability.

[0122] Fig.17 Shows Figure 1 The schematic diagram of the process of step S4 in FIG. 1 , step S4 comprises:

[0123] S41, feeding the adhesive film into a film laminating machine, wherein the adhesive film comprises a front release paper, a film layer and a back release paper laminated in sequence, wherein the film layer comprises a plurality of film sheets, wherein the plurality of film sheets are distributed according to the layout of the plurality of reflective cavities, wherein the front sides of the plurality of film sheets are provided with an electrostatic coating, and the back sides of the plurality of film sheets are provided with an adhesive layer;

[0124] The front side of the film 400 is bonded to the front release paper through an electrostatic coating, so that the front release paper can be easily torn off when in use; the adhesive layer provided on the back side of the film 400 is used to bond the reflective cavity 300, and the firmness of the bonding must be ensured.

[0125] By making a plurality of film sheets 400 into adhesive films according to the layout of a plurality of reflective cavities 300, batch film lamination operations of the panels can be realized, which can significantly improve production efficiency.

[0126] S42, attaching the first assembled panel with the plurality of carrier sheets fixed thereon onto the pallet with the surface facing downward, and sending the first assembled panel together with the pallet into the laminating machine;

[0127] The first assembly panel is flatly attached to the tray, and is not easy to shift or deform, so that the film sheets 400 can be accurately attached to the corresponding reflective cavity 300. Specifically, the tray is inlaid with magnets, and the carrier sheet 200 is magnetic, so that the first assembly panel can be attached to the tray by magnetic adsorption, and the operation is convenient and fast.

[0128] S43, the film laminating machine tears off the release paper on the back of the film to expose the adhesive layers of the plurality of film sheets;

[0129] The laminating machine first uses vacuum to absorb the release paper on the front side of the film, and then tears off the release paper on the back side.

[0130] S44, the film pasting machine pastes the plurality of film sheets on the surfaces of the plurality of reflective cavities in batches, and the back sides of the plurality of film sheets are bonded to the plurality of reflective cavities in a one-to-one correspondence, to obtain a second assembly panel.

[0131] The film laminating machine can identify the distribution of the reflective cavity 300 through a visual detection system, and then laminate the film sheets 400 onto the reflective cavity 300 in batches, with extremely high efficiency and good accuracy.

[0132] In some specific embodiments, a plurality of second positioning holes are provided on the front release paper, and the second positioning holes can be used for positioning the diaphragm 400 , and can also be used for auxiliary positioning of the first assembly panel, which is beneficial to improving the fitting accuracy between the diaphragm 400 and the reflective cavity 300 .

[0133] In some specific embodiments, the material of the adhesive layer is thermal conductive adhesive or double-sided adhesive. Thermal conductive adhesive can diffuse heat to prevent the diaphragm 400 from deforming due to local overheating. Double-sided adhesive is cheap and easy to obtain, which can reduce the cost of use.

[0134] S5, separating the panels, and separating a plurality of ultra-thin digital screens from the second assembly panels.

[0135] In some specific embodiments, before step S5, the step also includes: performing a lighting test on the second assembled panel; this can eliminate defective products with lighting failure and abnormal display effect, which is beneficial to ensuring the shipment quality of ultra-thin digital screens.

[0136] In some specific embodiments, before step S5, the method further includes: pasting a plurality of double-sided films on the surfaces of the plurality of carrier sheets of the second assembled panels, wherein the plurality of double-sided films correspond to the plurality of carrier sheets one by one. Pasting the double-sided films before separating the panels can be done by a machine in batches, which is convenient and quick; the ultra-thin digital screen obtained after separating the panels is pasted with double-sided films, and people only need to tear off the backing paper of the double-sided films to paste the ultra-thin digital screen where they are needed, which is convenient to use.

[0137] Specifically, the double-sided tape needs to avoid the hot pressing part of the positioning pillars 320 to ensure the smoothness of the double-sided tape and better adhesion.

[0138] In some specific embodiments, step S5 includes: placing the second assembled panel into a panel separation mold to separate a plurality of ultra-thin digital screens.

[0139] The panel separation mold can realize the rapid panel separation of the second assembly panel, and all the ultra-thin digital screen monomers in the second assembly panel can be separated at one time, with high panel separation efficiency.

[0140] Specifically, the panel separation mold includes a panel separation base and a panel separation upper mold. The second assembly panel is placed on the panel separation base with one side having the plurality of carrier sheets 200 fixed thereon facing upward. The panel separation upper mold correspondingly squeezes the plurality of carrier sheets 200 to separate the plurality of ultra-thin digital screens.

[0141] During the panel separation process, the panel separation mold separates the ultra-thin digital screen monomer by contacting and squeezing the carrier sheet 200, which will not touch and damage the light-emitting component 121 and can also avoid affecting the connection stability of the light-emitting component 121.

[0142] In the preparation method of the ultra-thin digital screen of the present invention, based on the flexible circuit panel 100, the ultra-thin digital screen is produced and manufactured in the form of a panel, and the fixing of the carrier sheet 200, printing of solder paste, mounting of the light-emitting components 121, hot pressing and fixing of the reflective cavity 300, pasting of the diaphragm 400, lighting test, pasting of double-sided film, separation of the ultra-thin digital screen, etc. can be carried out in batches, thereby significantly improving the production efficiency of the ultra-thin digital screen and being conducive to meeting the huge shipment demand.

[0143] Moreover, a carrier sheet 200 is fixed to the back side of the flexible circuit board 120, which can effectively improve the strength of the flexible circuit board 120 while keeping it light and thin, which is beneficial to reduce the displacement of the flexible circuit board 120 during the printing of solder paste, and avoid bending or folding of the flexible circuit board 120 during the turnover process, thereby effectively ensuring the printing accuracy of the solder paste, the mounting quality of the light-emitting components 121, and the mounting stability; the carrier sheet 200 and the reflective cavity 300 can be firmly combined by hot pressing, so that the reflective cavity 300 can be effectively fixed on the surface of the flexible circuit board 120, and it is also convenient for the subsequent precise pasting of the membrane 400; this is beneficial to ensuring the production quality of the ultra-thin digital screen.

[0144] The carrier sheet 200 is of great significance to the overall stability of the flexible circuit panel 100, and is convenient for stably fitting on the pallet, so that the entire panel can maintain a good shape and good flatness during printing solder paste, mounting light-emitting components 121, reflow soldering, film 400 pasting and lighting testing, and is not easy to deform or displace, which is not only beneficial to improving the production efficiency of ultra-thin digital screens, but also beneficial to ensuring the production quality of ultra-thin digital screens; with the cooperation of the carrier plate, the carrier sheet 200 and the positioning column 320 of the reflective cavity 300 are hot-pressed and fixed to form a firm connection effect without the need to add glue for fixing; the preparation method of the present invention realizes a one-time hot pressing operation and film pasting operation of the entire panel.

[0145] In addition, the assembled panels are tested for lighting before being separated, which facilitates the removal of abnormal monomers and ensures the quality of the ultra-thin digital screen. During the separation process, the separation mold can realize the rapid separation of the second assembled panels, and all the ultra-thin digital screen monomers in the second assembled panels can be separated at one time, and the separation efficiency is high. The separation mold separates the ultra-thin digital screen monomers by contacting and squeezing the carrier sheet 200, which will not touch and damage the light-emitting component 121, and can also avoid affecting the connection stability of the light-emitting component 121.

[0146] The present invention also provides an ultra-thin digital screen, which is made by the method for preparing an ultra-thin digital screen; the ultra-thin digital screen includes a carrier sheet 200, a flexible circuit board 120, a plurality of light-emitting components 121, a reflective cavity 300 and a diaphragm 400 which are arranged in sequence from bottom to top, the carrier sheet 200 and the flexible circuit board 120 are fixedly connected, the flexible circuit board 120 and the plurality of light-emitting components 121 are fixedly connected, the reflective cavity 300 passes through the flexible circuit board 120 and is fixedly connected to the carrier sheet 200, the diaphragm 400 is adhered to the surface of the reflective cavity 300, the plurality of light-emitting components 121 are accommodated in the reflective cavity 300, and the light emitted by the plurality of light-emitting components 121 is emitted from the diaphragm 400.

[0147] The ultra-thin digital screen of the present invention has a simple structure and excellent quality. It is easy to be mass-produced in the form of panels with high production efficiency. Moreover, compared with the existing digital screen (thickness ≥ 5mm), the ultra-thin digital screen of the present invention is much thinner, with an overall thickness of ≤2.4mm.

[0148] The above is a detailed introduction to an ultra-thin digital screen and a preparation method thereof provided by an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in the field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for preparing an ultra-thin digital screen, characterized in that: The following steps are involved: S1. Fixing a plurality of carrier sheets on the back of the flexible circuit panel, wherein the plurality of carrier sheets correspond to a plurality of flexible circuit boards in the flexible circuit panel one by one, to obtain a first combined circuit panel; S2, attaching the first combined circuit panel to a tray, and printing solder paste, mounting a plurality of light-emitting components, and reflow soldering on the front side of the flexible circuit panel in sequence to obtain a second combined circuit panel; S3, a plurality of reflective cavities are arranged on the surface of the second combined circuit panel on which the plurality of light-emitting components are mounted, and the plurality of reflective cavities are fixedly connected to the plurality of carrier sheets in a one-to-one correspondence to obtain a first assembled panel; S4, pasting a plurality of film sheets on the surfaces of the plurality of reflective cavities of the first assembled panel, wherein the plurality of film sheets correspond to the plurality of reflective cavities one by one, to obtain a second assembled panel; S5, separating the panels, and separating a plurality of ultra-thin digital screens from the second assembled panels.

2. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The flexible circuit panel is black.

3. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The flexible circuit panel is provided with a plurality of first positioning holes, and the plurality of first positioning holes are located outside the plurality of flexible circuit boards.

4. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The plurality of flexible circuit boards are formed by laser cutting.

5. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The flexible circuit panel comprises a frame plate, the plurality of flexible circuit boards are located in the frame plate, and each of the plurality of flexible circuit boards is connected to the frame plate based on at least three connecting ribs.

6. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Each of the plurality of flexible circuit boards is provided with an exhaust hole.

7. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The thickness of each of the plurality of carrier sheets is in the range of 0.2 mm to 0.3 mm.

8. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: The plurality of supporting sheets include one or more of a glass fiber sheet, a metal sheet, a wood sheet, and a thermosetting resin sheet.

9. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Step S2 includes: S21, attaching the first combined circuit panel with the plurality of carrier sheets fixed thereon on a tray downward, and sending the first combined circuit panel together with the tray into a printing machine; printing solder paste on the front side of the flexible circuit panel through a steel mesh, wherein the solder paste is located on the pads of the corresponding flexible circuit board; S22, sending the first combined circuit panel printed with the solder paste together with the tray into a placement machine, and placing a plurality of light-emitting components on the solder paste accordingly; S23, sending the first combined circuit panel with the plurality of light-emitting components attached thereto together with the tray into a reflow furnace, curing the solder paste through reflow soldering, and obtaining a second combined circuit panel.

10. The method for preparing an ultra-thin digital screen according to claim 1 or 9, characterized in that: The solder paste is tin paste or silver paste.

11. The method for preparing an ultra-thin digital screen according to claim 1 or 9, characterized in that: The plurality of light-emitting components include one or both of light-emitting elements and light-emitting devices.

12. The method for preparing an ultra-thin digital screen according to claim 9, characterized in that: A plurality of printing holes are arranged in the steel mesh, and the cross section of any of the printing holes is an isosceles trapezoidal structure.

13. The method for preparing an ultra-thin digital screen according to claim 12, characterized in that: The hole wall of any of the printing holes is plated with a nano film layer.

14. The method for preparing an ultra-thin digital screen according to claim 9, characterized in that: The thickness of the steel mesh is 0.03 mm or 0.04 mm.

15. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Step S3 includes: S31, placing a plurality of reflective cavities on a carrier plate, each of the reflective cavities being provided with a plurality of reflective light exit holes, and at least two positioning posts being provided on the back of each of the reflective cavities, with the positioning posts of each of the reflective cavities being placed upwards; S32, assembling the second combined circuit panel with the plurality of light-emitting components mounted thereon with the side facing downwards to the plurality of reflective cavities, wherein the positioning posts of the plurality of reflective cavities are arranged on the corresponding flexible circuit board and the carrier sheet, and the plurality of light-emitting components are located in the reflective light output holes of the corresponding reflective cavities; S33, hot-pressing and deforming the positioning posts of the plurality of reflective cavities to fix the corresponding carrier sheets to obtain a first assembly panel.

16. The method for preparing an ultra-thin digital screen according to claim 1 or 15, characterized in that: The color of the reflection cavity is black or white.

17. The method for preparing an ultra-thin digital screen according to claim 1 or 15, characterized in that: The material of the reflection cavity is one of polyethylene terephthalate, polyethylene terephthalate and polybutylene terephthalate.

18. The method for preparing an ultra-thin digital screen according to claim 15, characterized in that: The included angle between the inner wall of the reflective light exit hole and the front surface of the reflective cavity is 60° to 90°.

19. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Step S4 includes: S41, feeding the adhesive film into a film laminating machine, wherein the adhesive film comprises a front release paper, a film layer and a back release paper laminated in sequence, wherein the film layer comprises a plurality of film sheets, wherein the plurality of film sheets are distributed according to the layout of the plurality of reflective cavities, wherein the front sides of the plurality of film sheets are provided with an electrostatic coating, and the back sides of the plurality of film sheets are provided with an adhesive layer; S42, attaching the first assembled panel with the plurality of carrier sheets fixed thereon onto the pallet with the surface facing downward, and sending the first assembled panel together with the pallet into the laminating machine; S43, the film laminating machine tears off the release paper on the back of the film to expose the adhesive layers of the plurality of film sheets; S44, the film pasting machine pastes the plurality of film sheets on the surfaces of the plurality of reflective cavities in batches, and the back sides of the plurality of film sheets are bonded to the plurality of reflective cavities in a one-to-one correspondence, to obtain a second assembly panel.

20. The method for preparing an ultra-thin digital screen according to claim 1 or 19, characterized in that: The material of each of the plurality of diaphragms is one of polyethylene terephthalate, polyethylene glycol terephthalate and polybutylene terephthalate.

21. The method for preparing an ultra-thin digital screen according to claim 1 or 19, characterized in that: The back side of each of the plurality of diaphragms is printed with fluorescent powder.

22. The method for preparing an ultra-thin digital screen according to claim 19, characterized in that: A plurality of second positioning holes are arranged on the front release paper.

23. The method for preparing an ultra-thin digital screen according to claim 19, characterized in that: The material of the adhesive layer is thermal conductive adhesive or double-sided adhesive.

24. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Before step S5, the method further includes: The second assembled panel is subjected to a lighting test.

25. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Before step S5, the method further includes: A plurality of double-sided films are pasted on the surfaces of the plurality of carrier sheets of the second assembly panel, and the plurality of double-sided films correspond to the plurality of carrier sheets one by one.

26. The method for preparing an ultra-thin digital screen according to claim 1, characterized in that: Step S5 includes: The second assembly panel is placed into a panel separation mold to separate a number of ultra-thin digital screens.

27. The method for preparing an ultra-thin digital screen according to claim 26, characterized in that: The panel separation mold includes a panel separation base and a panel separation upper mold. The second assembly panel is placed on the panel separation base with one side of the plurality of carrier sheets fixed thereon facing upward. The panel separation mold correspondingly squeezes the plurality of carrier sheets to separate the plurality of ultra-thin digital screens.

28. An ultra-thin digital screen, characterized in that: The ultra-thin digital screen is prepared by the method for preparing an ultra-thin digital screen according to any one of claims 1 to 27; The ultra-thin digital screen includes a carrier sheet, a flexible circuit board, a plurality of light-emitting components, a reflective cavity and a diaphragm which are arranged in sequence from bottom to top. The carrier sheet and the flexible circuit board are fixedly connected, the flexible circuit board and the plurality of light-emitting components are fixedly connected, the reflective cavity is fixedly connected to the carrier sheet through the flexible circuit board, the diaphragm is adhered to the surface of the reflective cavity, the plurality of light-emitting components are accommodated in the reflective cavity, and the light emitted by the plurality of light-emitting components is emitted from the diaphragm.

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