Heat dissipation and vibration reduction device for airborne electronic equipment

Abstract

The invention relates to the technical field of heat dissipation and vibration reduction of airborne electronic equipment, and particularly discloses a heat dissipation and vibration reduction device for airborne electronic equipment, which comprises a vibration pump and a liquid cooling plate, the vibration pump comprises a shell internally provided with a cavity, an additional acoustic black hole vibration reduction structure which is installed in the shell and has a heat conduction function, and an elastic film connected with the additional acoustic black hole vibration reduction structure. The elastic film is arranged between the outer side face of the additional acoustic black hole vibration reduction structure and the shell and divides the cavity into an upper pump cavity and a lower pump cavity which communicate with each other. The liquid cooling plate communicates with the upper pump cavity and the lower pump cavity. Through a dynamic vibration absorption effect triggered by coupling of multiple modes of an additional acoustic black hole vibration reduction and heat conduction structure and a cover plate of the electronic equipment and a damping enhancement effect caused by acoustic black hole energy accumulation, vibration reduction of the airborne electronic equipment in a simple and compact structure form in a narrow space of an aircraft is realized; and internal liquid is driven to circulate, so that the airborne electronic equipment is cooled.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation and vibration reduction of airborne electronic equipment, and more particularly to a device for heat dissipation and vibration reduction of airborne electronic equipment. Background Art

[0002] The narrow space brought about by the lightweight and streamlined design of aircraft brings many inconveniences to the installation of airborne electronic equipment with high local heat flux density such as phased array antennas, which requires traditional forced air cooling or liquid cooling devices with external power supply and complex structure. The aerodynamic loads generated in the complex flow field environment at high altitudes can easily cause harmonic response vibrations of airborne electronic equipment, which is not conducive to the long-term stable operation of electronic equipment and reduces the service life of the equipment.

[0003] There are two main control methods for vibration control: active and passive. Although the active method that requires external energy can cope with complex vibration modes, it is not widely used due to its cumbersome system design. The vibration reduction effect of filling high-damping vibration isolation materials is often unsatisfactory, especially under the conditions of severe mass and volume constraints, and the low-frequency vibration reduction effect is often unsatisfactory. Conventional dynamic vibration absorbers are limited by a single modal control and cannot cope with the vibration caused by complex aerodynamic loads. Their large size makes it difficult to install in the narrow space of the aircraft.

[0004] Therefore, achieving simple and compact broadband multi-modal vibration reduction and heat dissipation on airborne electronic equipment is an urgent problem to be solved. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a device for heat dissipation and vibration reduction of airborne electronic equipment;

[0006] The solution adopted by the present invention to solve the technical problem is:

[0007] A device for heat dissipation and vibration reduction of airborne electronic equipment, comprising a vibration pump and a liquid cooling plate connected to the vibration pump;

[0008] The vibration pump comprises a shell with a chamber disposed therein, an additional acoustic black hole vibration reduction structure installed in the shell and having a heat conduction function, and an elastic film installed in the shell and connected to the additional acoustic black hole vibration reduction structure;

[0009] The elastic film is arranged between the outer side of the attached acoustic black hole vibration reduction structure and the shell and divides the chamber into an upper pump chamber and a lower pump chamber which are connected to each other; the liquid cooling plate is connected to the upper pump chamber and the lower pump chamber respectively;

[0010] The side of the additional acoustic black hole vibration reduction structure away from the upper pump chamber is located outside the shell.

[0011] In some possible embodiments, the additional acoustic black hole vibration reduction structure includes a central body located on the outside of the bottom of the shell, an acoustic black hole whose thickness decreases exponentially with increasing distance from the center plane or center line of the central body, and an extended platform for connecting the elastic film and the acoustic black hole.

[0012] In some possible implementations, the thickness of the central body is h0, the thickness of the extended platform is h1, and h0>h1;

[0013] The exponential expression of the acoustic black hole whose thickness decreases exponentially as the distance from the central plane of the central body increases is: h(x)=a(x-x2) m +h1,(x1<x<x2);

[0014] Among them, x represents the shortest distance from the central plane or center line of the central body to any point on the acoustic black hole;

[0015] x1 represents half the width of the central body;

[0016] x2 represents the shortest distance from the extended platform to the center plane or center line of the central body;

[0017] a is the coefficient;

[0018] m≥2.

[0019] In some possible embodiments, the projection of the additional acoustic black hole vibration reduction structure on the cover plate is a circular ring structure, and the central body is a cylindrical structure of constant thickness; the acoustic black hole is a circular ring body, and its thickness decreases exponentially with increasing distance from the center line of the central body; the extended platform is a circular ring body of constant thickness.

[0020] In some possible implementations, the additional acoustic black hole vibration reduction structure is an eccentric structure, and the central body is not coaxial with the acoustic black hole.

[0021] In some possible embodiments, the projection of the additional acoustic black hole vibration reduction structure on the cover plate is a rectangular ring structure, and the central body is a rectangular parallelepiped structure of equal thickness; the acoustic black holes are in two groups and the thickness of each group of acoustic black holes decreases exponentially with increasing distance from the center plane of the central body; the extended platforms are in two groups and are rectangular parallelepipeds, and the two groups of extended platforms are located outside the acoustic black holes; the outside described here refers to the side of the acoustic black hole away from the elastic film.

[0022] In some possible implementations, the additional acoustic black hole vibration reduction structure is an eccentric structure, and the closest distances between the two groups of extension platforms and the central plane of the central body are not equal.

[0023] In some possible implementations, in order to enable the additional acoustic black hole vibration-damping thermal conductive structure to replace the aluminum material of the traditional acoustic black hole to enhance the thermal conductivity of the additional acoustic black hole vibration-damping structure and improve the heat dissipation capacity; the additional acoustic black hole vibration-damping structure is made of any one of silicon carbide ceramics, boron nitride ceramics, and tungsten-copper alloys, which are device materials used for heat dissipation and vibration reduction of airborne electronic equipment.

[0024] In some possible embodiments, the shell is provided with a pipe 1 which serves as an input port of the upper pump chamber and is connected to the liquid cooling plate, a pipe 2 which serves as an output port of the upper pump chamber and is connected to the lower pump chamber through a connecting pipe provided outside the shell, a pipe 3 which serves as an input port of the lower pump chamber and is connected to the lower pump chamber, and a pipe 4 which serves as an output port of the lower pump chamber and is connected to the liquid cooling plate.

[0025] In some possible embodiments, the pipeline one, pipeline two, pipeline three, and pipeline four are all conical tubes; wherein the small end of pipeline one is connected to the upper pump chamber, the large end of pipeline two is connected to the upper pump chamber, the small end of pipeline three is connected to the lower pump chamber, and the large end of pipeline four is connected to the lower pump chamber.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention arranges an additional acoustic black hole vibration reduction structure in the shell and cooperates with the liquid cooling plate; through the dynamic vibration absorption effect triggered by the coupling of the additional acoustic black hole vibration reduction heat conduction structure with multiple modes of the cover plate of the electronic equipment and the damping enhancement effect caused by the acoustic black hole energy accumulation, the vibration of the airborne electronic equipment is reduced in a simple and compact form in the narrow space of the aircraft, while driving the internal liquid circulation to dissipate the heat of the airborne electronic equipment;

[0028] The present invention uses an additional acoustic black hole vibration reduction structure for eccentric arrangement to improve the coupling degree between the moment-reducing annular vibration heat-conducting structure and the electronic equipment cover plate and the number of dynamic vibration absorption modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 It is a structural schematic diagram of the shell, the additional acoustic black hole vibration reduction structure, the first pipeline, the second pipeline, the third pipeline, the fourth pipeline, and the connecting pipeline in the present invention;

[0031] Figure 3 It is a schematic structural diagram of the rectangular annular and eccentric additional acoustic black hole vibration reduction structure in Example 1 of the present invention;

[0032] Figure 4 It is a schematic diagram of the principle of generating pressure difference by the vibration pump in the present invention;

[0033] Among them: 1. Vibration pump; 2. Liquid cooling plate; 3. Airborne electronic equipment; 4. Cover plate; 5. Shell; 51. Upper pump chamber; 52. Lower pump chamber; 6. Additional acoustic black hole vibration reduction structure; 7. Elastic film; 8. Pipeline one; 9. Pipeline four; 10. Central body; 11. Acoustic black hole; 12. Extension platform. DETAILED DESCRIPTION

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two groups of components or the interaction relationship between two groups of components. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "a group" or "one" and other similar words do not indicate a quantity restriction, but indicate the existence of at least one group. In the implementation of this application, "and / or" describes the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple groups" refers to two or more groups. For example, multiple groups of positioning columns refer to two or more groups of positioning columns. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The present invention is described in detail below.

[0036] like Figure 1-Figure 4 As shown;

[0037] A device for heat dissipation and vibration reduction of airborne electronic equipment, comprising a vibration pump 1 and a liquid cooling plate 2 connected to the inside of the vibration pump 1;

[0038] like Figure 2 As shown, the vibration pump 1 includes a shell 5, an additional acoustic black hole vibration reduction structure 6 installed in the shell 5 and projected on the cover plate to be a rectangular ring structure and eccentrically designed, and an elastic film 7 for connecting the shell 5 to the additional acoustic black hole vibration reduction structure 6.

[0039] The present invention adopts an elastic film 7 and an additional acoustic black hole vibration reduction structure 6 to replace the plunger in the traditional pump structure; the additional acoustic black hole vibration reduction structure 6 and the elastic film 7 connect the upper and lower pump chambers (upper pump chamber 51 and lower pump chamber 52) in the shell 5; the bottom end of the additional acoustic black hole vibration reduction structure 6 will pass through the shell 5 and be installed on the cover plate 4 of the airborne electronic equipment 3.

[0040] like Figure 2As shown, the shell 5 is provided with pipe 1 8, pipe 2, pipe 3 and pipe 4 9, all of which are tapered pipes, so as to be connected with the liquid cooling plate 2, the upper pump chamber 51 and the lower pump chamber 52; wherein the pipe 1 8 with a contraction angle of 5 degrees serves as the inlet of the vibration pump 1, and the pipe 3 with an expansion angle of 5 degrees serves as the outlet of the vibration pump 1, replacing the ordinary one-way valve of the traditional pump structure to simplify the internal structure of the vibration pump 1, and ensuring that the liquid in the vibration pump 1 and the liquid cooling plate 2 keeps circulating in one direction.

[0041] Specifically, the output end of the pipeline in the liquid cooling plate 2 is connected to the pipeline 1 8, the small end of the pipeline 2 and the large end of the pipeline are connected through a connecting pipeline, the large end of the pipeline 2 is connected to the upper pump chamber 51, and the small end of the pipeline 3 is connected to the lower pump chamber; the large end of the pipeline 4 9 is connected to the lower pump chamber, and the small end of the pipeline 4 9 is connected to the input end of the pipeline in the liquid cooling plate 2, thereby forming a circulation pipeline;

[0042] The present invention induces a dynamic vibration absorption effect through the coupling of the additional acoustic black hole vibration reduction structure 6 and the electronic equipment cover 4 to suppress the vibration of the electronic equipment. At the same time, the extended platform 12 drives the elastic film 7 to vibrate, replacing the reciprocating motion of the plunger in the traditional pump structure, causing the volume change of the pump chambers of the two, and driving the liquid circulation in the vibration pump 1 and the liquid cooling plate 2.

[0043] The liquid in the vibration pump 1 and the liquid cooling plate 2 is used as the main energy dissipation material of the additional acoustic black hole vibration reduction structure 6 to replace the damping material design of the traditional acoustic black hole 11 vibration reduction structure;

[0044] The present invention is installed on the cover plate 4 of the airborne electronic equipment 3, and serves as a power component for driving the vibration pump 1 and the liquid circulation in the liquid cooling plate 2 and a component for suppressing the vibration of the airborne electronic equipment 3;

[0045] like Figure 3 As shown, the additional acoustic black hole vibration reduction structure 6 includes a central body 10 of equal thickness and in the shape of a rectangular parallelepiped, two groups of acoustic black holes 11 located on both sides of the central body 10 and whose thickness decreases exponentially as the distance from the central plane of the central body 10 increases, two groups of extended platforms 12 located outside the two groups of acoustic black holes 11 and in the shape of a rectangular parallelepiped, and an end surface for connecting the two groups of acoustic black holes 11, a gap is formed between the end surface and the inner side surface of the shell, and the top thereof is connected to the inner side of the shell, so that the interior of the lower pump chamber is connected; when there are two groups of acoustic black holes 11, there will also be two groups of elastic films 7; wherein, one end of the acoustic black hole 11 will pass through the bottom of the shell 5 to connect with the central body 10, and the other end thereof will be connected to the elastic film 7 through the extended platform 12;

[0046] Furthermore, an elastic film 7 may be provided between the end face and the inner side face of the shell 5, and an extension platform 12 may be provided between the elastic film 7 and the end face; four groups of elastic films 7 and four groups of extension platforms 12 are sequentially connected to form rectangular ring structures.

[0047] The end of the acoustic black hole 11 away from the central body 10 is connected to the elastic film 7 through an extension platform 12; the central body 10 will be on the cover plate 4 of the airborne electronic equipment 3; the bottom of the extension platform 12 is provided with an adhesive butyl rubber material to enhance the damping enhancement effect of the additional acoustic black hole vibration reduction structure 6 on the cover plate 4 of the airborne electronic equipment 3.

[0048] The exponential expression of the two sets of acoustic black holes 11 whose thickness decreases exponentially as the distance from the central plane of the central body 10 increases is h(x)=a(x-x2) m +h1,(x1<x<x2);

[0049] Wherein, x represents the shortest distance from the central plane of the central body 10 to any point on the acoustic black hole 11;

[0050] x1 represents half of the width of the central body 10;

[0051] x2 represents the shortest distance from the extension platform 12 to the center plane or center line of the central body 10;

[0052] m = 2;

[0053] h0 is the thickness of the central body, h1 is the thickness of the extended platform, h0>h1;

[0054] Specifically, in the exponential form of an acoustic black hole, x1 = 10 mm; x2 = 110 mm; h1 = 0.4 mm; a = 0.00056;

[0055] In another set of exponential expressions of acoustic black holes, x1 = 10 mm; x2 = 60 mm; h1 = 0.4 mm; a = 0.00224;

[0056] When in use, the aerodynamic loads generated in the complex flow field environment at high altitude cause vibration waves containing different frequencies to propagate from the cover plate 4 of the onboard electronic equipment 3 through the central body 10 along the variable thickness acoustic black hole 11 to the extension platform 12;

[0057] When the vibration wave propagates in the central body 10, the amplitude and wavelength of the vibration wave remain unchanged; when the vibration wave propagates in the acoustic black hole 11, the amplitude of the vibration wave increases as the thickness of the acoustic black hole 11 decreases, while the wavelength decreases as the thickness decreases;

[0058] When the vibration wave propagates on the extended platform 12 , the amplitude and wavelength of the vibration wave continue to remain unchanged; as the distance to the central body 10 increases, the amplitude increases, and the energy of the vibration of the additional acoustic black hole vibration reduction structure 6 is dissipated through the liquid in the vibration pump 1 and the liquid cooling plate 2 .

[0059] There are multiple coupled vibration modes between the additional acoustic black hole vibration reduction structure 6 and the cover plate 4 of the airborne electronic device 3. At the frequencies corresponding to these vibration modes, the additional acoustic black hole vibration reduction structure 6 significantly suppresses the vibration of the airborne electronic device 3 through the dynamic vibration absorption effect; and at other vibration frequencies, the additional acoustic black hole vibration reduction structure 6 can also enhance the damping effect of the cover plate 4 of the airborne electronic device 3 through the energy gathering effect of the acoustic black hole 11, thereby suppressing the vibration of the airborne electronic device 3 to a certain extent.

[0060] The closest distances from the two groups of extension platforms 12 to the central plane of the central body 10 are not equal, thereby realizing the eccentric design of the additional acoustic black hole vibration reduction structure 6, improving the vibration coupling degree between the vibration reduction and heat conduction structure and the electronic equipment cover 4 and the number of dynamic vibration absorption modes.

[0061] like Figure 4 (a) is a schematic diagram of the principle of the vibration pump when it is not in use and does not generate a pressure difference. Figure 4 Schematic diagram of the principle of the vibration pump generating pressure difference when used in (b) and (c). While the additional acoustic black hole vibration reduction structure 6 suppresses the vibration of the airborne electronic equipment 3 through the dynamic vibration absorption effect and the damping enhancement effect, the elastic film 7 which is closely connected to the shell 5 and the additional acoustic black hole vibration reduction structure 6 and is close to the two sets of extension platforms 12 vibrates with a large amplitude, causing changes in the volume and pressure in the upper and lower pump chambers, replacing the reciprocating motion of the plunger of the traditional pump structure, causing changes in the volume of the two pump chambers, and driving the circulation of the liquid in the valveless vibration pump 1 and the liquid cooling plate 2.

[0062] The copper liquid cooling plate 2 is close to the area with high heat flux density of the airborne electronic equipment 3. The liquid in the liquid cooling plate 2 and the vibration pump 1 transfers the heat transferred from the airborne electronic equipment 3 to other areas of the liquid cooling plate 2 and the additional acoustic black hole vibration reduction structure 6 in the vibration pump 1 to reduce the temperature of the recording electronic equipment;

[0063] The additional acoustic black hole vibration reduction structure 6 is made of a thermally conductive material with good thermal conductivity, such as silicon carbide ceramics, boron nitride ceramics, and tungsten copper alloy, so as to ensure strength while having good thermal conductivity, thereby improving the heat dissipation capacity of the device for realizing the integrated solution of heat dissipation and vibration reduction of the airborne electronic equipment 3.

[0064] Embodiment 2:

[0065] Compared with the embodiment 1, the present embodiment has a different structure of the additional acoustic black hole vibration reduction structure 6. In the present embodiment, the projection of the additional acoustic black hole vibration reduction structure 6 on the cover plate 4 is a circular ring structure.

[0066] The central body 10 is a cylinder of uniform thickness;

[0067] Acoustic black hole 11, the thickness of acoustic black hole 11 decreases exponentially with the distance from the centerline of the central body;

[0068] An extension platform 12, the extension platform 12 is a circular ring body with uniform thickness;

[0069] The central body 10 is not coaxial with the acoustic black hole 11, and the eccentric structure formed thereby can improve the coupling degree between the annular vibration-damping heat-conducting structure and the electronic device cover and the number of dynamic vibration-absorbing modes.

[0070] The exponential expression of the acoustic black hole 11 whose thickness decreases exponentially as the distance from the center line of the central body 10 increases is h(x)=a(x-x2) m +h1,(x1<x<x2);

[0071] Wherein, x represents the shortest distance from the centerline of the central body 10 to any point on the acoustic black hole 11;

[0072] x1 represents half of the width of the central body 10;

[0073] x2 represents the shortest distance from the extension platform to the centerline of the central body 10;

[0074] a is the coefficient;

[0075] m≥2; h0 is the thickness of the central body, h1 is the thickness of the extended platform, h0>h1.

[0076] In this embodiment, the structures of the housing and the liquid cooling plate are the same as those in Embodiment 1 and will not be described in detail here.

[0077] The present invention is not limited to the aforementioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A device for heat dissipation and vibration reduction of airborne electronic equipment, characterized in that: It includes a vibration pump and a liquid cooling plate connected to the vibration pump; The vibration pump comprises a shell with a chamber disposed therein, an additional acoustic black hole vibration reduction structure installed in the shell and having a heat conduction function, and an elastic film installed in the shell and connected to the additional acoustic black hole vibration reduction structure; The elastic film is arranged between the outer side of the attached acoustic black hole vibration reduction structure and the shell and divides the chamber into an upper pump chamber and a lower pump chamber which are connected to each other; the liquid cooling plate is connected to the upper pump chamber and the lower pump chamber respectively; The side of the additional acoustic black hole vibration reduction structure away from the upper pump chamber is located outside the shell.

2. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 1, characterized in that: The additional acoustic black hole vibration reduction structure includes a central body located outside the bottom of the shell, an acoustic black hole whose thickness decreases exponentially as the distance from the central plane or center line of the central body increases, and an extension platform for connecting the elastic film and the acoustic black hole.

3. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 2, characterized in that: The thickness of the central body is h0, the thickness of the extended platform is h1, and h0>h1; The exponential expression of the acoustic black hole whose thickness decreases exponentially as the distance from the central plane of the central body increases is: h(x)=a(x-x2) m +h1,(x1<x<x2); Among them, x represents the shortest distance from the central plane or center line of the central body to any point on the acoustic black hole; x1 represents half the width of the central body; x2 represents the shortest distance from the extended platform to the center plane or center line of the central body; a is the coefficient; m≥2。 4. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 3, characterized in that: The additional acoustic black hole vibration reduction structure is a circular ring structure, and the central body is a cylindrical structure of equal thickness; the acoustic black hole is a circular ring body, and its thickness decreases exponentially with increasing distance from the center line of the central body; the extended platform is a circular ring body of equal thickness.

5. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 3, characterized in that: The attached acoustic black hole vibration reduction structure is an eccentric structure, and the central body is not coaxial with the acoustic black hole.

6. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 3, characterized in that: The additional acoustic black hole vibration reduction structure is a rectangular ring structure, and the central body is a rectangular parallelepiped structure of equal thickness; the acoustic black holes are divided into two groups, and the thickness of each group of acoustic black holes decreases exponentially as the distance from the central plane of the central body increases; the extension platforms are divided into two groups, and the two groups of extension platforms are located outside the acoustic black holes.

7. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 6, characterized in that: The additional acoustic black hole vibration reduction structure is an eccentric structure, and the closest distances between the two groups of extension platforms and the central plane of the central body are not equal.

8. A device for heat dissipation and vibration reduction of airborne electronic equipment according to any one of claims 1 to 7, characterized in that: The additional acoustic black hole vibration reduction structure is made of any one of silicon carbide ceramics, boron nitride ceramics, and tungsten copper alloy, which is a device material used for heat dissipation and vibration reduction of airborne electronic equipment.

9. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 8, characterized in that: The shell is provided with a pipe 1 which serves as an input port of the upper pump chamber and is connected to the liquid cooling plate, a pipe 2 which serves as an output port of the upper pump chamber and is connected to the lower pump chamber via a connecting pipe arranged outside the shell, a pipe 3 which serves as an input port of the lower pump chamber and is connected to the lower pump chamber, and a pipe 4 which serves as an output port of the lower pump chamber and is connected to the liquid cooling plate.

10. The device for heat dissipation and vibration reduction of airborne electronic equipment according to claim 9, characterized in that: The pipeline one, pipeline two, pipeline three and pipeline four are all conical tubes; the small end of pipeline one is connected to the upper pump chamber, the large end of pipeline two is connected to the upper pump chamber, the small end of pipeline three is connected to the lower pump chamber, and the large end of pipeline four is connected to the lower pump chamber.

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