Method for photocuring 3D printing of high-temperature-resistant mold

Abstract

The invention provides a method for photocuring 3D printing of a high-temperature-resistant mold, and the method comprises the following steps: synthesizing high-temperature-resistant photocuring 3D printing resin which comprises the following components in percentage by weight: 50-80% of ethoxylated bisphenol A diacrylate, 15-35% of ethoxylated trimethylolpropane triacrylate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5 the component A comprises the following components in percentage by weight: 3-10% of 2, 3, 6-trimethylbenzoyl-diphenyl phosphine oxide, 1-5% of filler and 0-2% of auxiliaries; a mold model is constructed through three-dimensional modeling software, and the mold model structurally comprises a conformal cooling water pipeline; slicing processing is conducted on the mold modeling model through slicing software, printing parameters are set, and a slicing file is generated; and the generated slice file is guided into photocuring 3D printing equipment, the high-temperature-resistant photocuring 3D printing resin serves as a 3D printing material, and a high-temperature-resistant mold is formed through the photocuring 3D printing technology. According to the method for photocuring 3D printing of the high-temperature-resistant mold, the high-temperature resistance and the compression resistance of the photocuring 3D printing molding high-temperature-resistant mold can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of mold manufacturing, and in particular to a method for photocuring 3D printing a high temperature resistant mold. Background Art

[0002] As the "mother of industry", molds are the cornerstone of industrial production. Traditional molds have high manufacturing costs, long manufacturing cycles, and low iteration efficiency. Therefore, directly printing molds through 3D printing can effectively shorten the mold making cycle, reduce costs, reduce material waste, greatly increase the freedom of mold design, and realize the integrated molding of conformal cooling water pipes that are difficult to manufacture with traditional processing technology, greatly improve mold cooling efficiency, reduce stress deformation, and further improve printing accuracy.

[0003] At present, 3D printing molds are mainly based on metal molds, which have rough mold surfaces and low precision. The surface precision can be greatly improved through photocuring 3D printing. However, the current photocuring 3D printing resin has poor high temperature resistance and low compression resistance, which makes it difficult to meet the performance requirements of metal powder injection molding molds and plastic injection molding molds.

[0004] In view of this, it is necessary to provide a new process to solve the above technical problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for photocuring 3D printing high-temperature resistant molds, which can effectively improve the high-temperature resistance and compression resistance of the photocuring 3D printing high-temperature resistant molds.

[0006] The technical solution of the present invention is as follows:

[0007] A method for photocuring 3D printing a high temperature resistant mold comprises the following steps:

[0008] Step S1, synthesizing a high temperature resistant light-curable 3D printing resin, wherein the high temperature resistant light-curable 3D printing resin comprises the following components by weight percentage:

[0009] Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, auxiliary agent 0-2%;

[0010] Step S2, constructing a mold model by using 3D modeling software, wherein the mold model structure includes a conformal cooling water pipeline;

[0011] Step S3, slicing the mold model through slicing software and setting printing parameters to generate a slicing file;

[0012] Step S4, importing the generated slice file into a light-curing 3D printing device, using the high temperature resistant light-curing 3D printing resin as a 3D printing material, and using light-curing 3D printing technology to form a high temperature resistant mold.

[0013] Furthermore, in step S1, the filler is silicon dioxide particles or aluminum oxide particles, and the particle size thereof is 50-100 nm.

[0014] Furthermore, in step S1, the auxiliary agent is at least one of a defoaming agent, an inhibitor, a leveling agent or a dispersant.

[0015] Furthermore, the synthesis method of the high temperature resistant light-curable 3D printing resin in step S1 is:

[0016] Stir ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate in a water bath at 55-65°C until completely mixed;

[0017] Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed;

[0018] Finally, add fillers and additives and continue stirring until completely mixed.

[0019] Furthermore, in step S2, the conformal cooling water pipe is arranged inside the mold, fits the mold wall, and changes with the shape of the inner surface of the mold.

[0020] Furthermore, in step S3, the printing parameters include exposure time, layer thickness and lifting speed.

[0021] Furthermore, in step S4, LCD light-curing 3D printing technology is used to form a high-temperature resistant mold.

[0022] Furthermore, the method further includes step S5, in which the surface of the formed high temperature resistant mold is treated by grinding, polishing, chemical plating or electroplating.

[0023] Furthermore, chemical copper plating is performed on the surface of the formed high temperature resistant mold.

[0024] Compared with the prior art, the method for photocuring 3D printing high temperature resistant mold provided by the present invention has the following beneficial effects:

[0025] 1. The method for photocuring 3D printing high temperature resistant mold provided by the present invention improves the high temperature resistance and compression resistance of the 3D printing resin material by designing a new photosensitive resin material for the high temperature resistant mold. The compression strength of the prepared high temperature resistant mold can reach 275MPa, and the thermal weight loss T 5％ =392.83℃、T max =448.45℃ and T91％ =553.69° C. Therefore, the high temperature resistant mold formed by the method of the present invention can meet the performance requirements of metal powder injection molding and plastic injection molding molds, and has good application value.

[0026] 2. The method for photocuring 3D printing high-temperature resistant molds provided by the present invention uses photocuring 3D printing technology to produce molds with excellent high-temperature resistance and compression resistance, which can realize personalized customization of the mold, have high design freedom, and have high molding accuracy; photocuring 3D printing technology can effectively shorten the mold manufacturing cycle, improve production efficiency, reduce material waste, and reduce mold manufacturing costs; compared with traditional mold processing technology, photocuring 3D printing technology can easily realize the integrated molding of conformal cooling water pipes in the mold structure, which can significantly improve cooling efficiency and reduce product stress deformation.

[0027] 3. The method for photocuring 3D printing high-temperature resistant molds provided by the present invention can process the surface of the formed high-temperature resistant mold by grinding and polishing, chemical plating or electroplating, improve the surface quality of the mold, and further improve the precision, smoothness and service life of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 is a thermogravimetric analysis diagram of a high temperature resistant mold prepared in Example 1 of the present invention;

[0030] Figure 2 This is a compression strength effect diagram of the high temperature resistant mold prepared in Example 1 of the present invention. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation modes of the present invention are further described below.

[0032] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0033] A method for photocuring 3D printing a high temperature resistant mold comprises the following steps:

[0034] Step S1, synthesizing a high temperature resistant light-curable 3D printing resin, wherein the high temperature resistant light-curable 3D printing resin comprises the following components by weight percentage:

[0035] Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, auxiliary agent 0-2%;

[0036] The filler is silicon dioxide particles or aluminum oxide particles, and the particle size thereof is 50-100 nm; the auxiliary agent is at least one of a defoamer, an inhibitor, a leveling agent or a dispersant.

[0037] The synthesis method of high temperature resistant light-curing 3D printing resin is:

[0038] Stir ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate in a water bath at 55-65°C until completely mixed;

[0039] Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed;

[0040] Finally, add fillers and additives and continue stirring until completely mixed.

[0041] Step S2, constructing a mold model by using a three-dimensional modeling software, wherein the mold model structure includes a conformal cooling water pipeline; specifically, the conformal cooling water pipeline is arranged inside the mold, fits with the mold wall, and changes with the shape of the inner surface of the mold;

[0042] Step S3, slicing the mold model through slicing software and setting printing parameters to generate a slicing file; wherein the printing parameters include exposure time, layer thickness and lifting speed;

[0043] Step S4, importing the generated slice file into a light-curing 3D printing device, using the high temperature resistant light-curing 3D printing resin as a 3D printing material, and using light-curing 3D printing technology to form a high temperature resistant mold;

[0044] Step S5, if a mold with a high-finish surface is required, the surface of the molded high-temperature resistant mold can be processed by grinding and polishing, chemical plating or electroplating.

[0045] In the present invention, the high temperature resistant light-cured 3D printing resin uses ethoxylated bisphenol A diacrylate as a prepolymer, ethoxylated trimethylolpropane triacrylate as an active diluent, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide as a photoinitiator. The photoinitiator 2,4,6-trimethylbenzoyl-diphenylphosphine oxide generates free radicals under 405nm ultraviolet light irradiation, which initiates the polymerization reaction of the multifunctional monomer ethoxylated trimethylolpropane triacrylate and the prepolymer ethoxylated bisphenol A diacrylate, thereby forming a three-dimensional structure with a high degree of cross-linking. Among them, the acrylate group of ethoxylated bisphenol A diacrylate forms a cross-linked network through free radical polymerization. Due to the high reactivity of the acrylate group, the photocuring reaction rate of the prepolymer ethoxylated bisphenol A diacrylate is fast, and the cured ethoxylated bisphenol A diacrylate-based material usually has a high hardness, and its benzene ring structure also provides thermal stability within the molecule; the multi-functional structure of ethoxylated trimethylolpropane triacrylate significantly increases the cross-linking density of the polymer, and the three-dimensional network structure with a high degree of cross-linking formed greatly improves the thermal stability and mechanical properties of the material; the filling of silica particles / alumina particles not only provides mechanical reinforcement, but also improves the thermal conductivity and rigidity of the material, further improving the high temperature resistance and stability of the material. Therefore, the components work synergistically to ensure excellent mechanical strength and thermal stability in high temperature environments to meet the needs of metal powder injection molding and plastic injection molding.

[0046] The following is a detailed description of the method for photocuring 3D printing a high temperature resistant mold of the present invention through specific embodiments.

[0047] Example 1

[0048] A method for photocuring 3D printing a high temperature resistant mold comprises the following steps:

[0049] Step S1, synthesizing high temperature resistant light-curing 3D printing resin: mix and stir the resin prepolymer, active diluent, photoinitiator, filler and other additives in a certain ratio to obtain a high temperature resistant light-curing 3D printing resin. In this embodiment, 60% by mass of ethoxylated bisphenol A diacrylate and 27% by mass of ethoxylated trimethylolpropane triacrylate are weighed and stirred in a 60°C water bath until they are evenly mixed, then 8% by mass of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is weighed and added to the system, and heated and stirred until the mixture is evenly mixed, and finally 5% by mass of silica particles is weighed and added to the system, and heated and stirred until the mixture is evenly mixed, thereby obtaining a high temperature resistant photosensitive resin, which is stored in the dark;

[0050] Step S2, designing and modeling a mold model: according to actual needs, using Solidworks modeling software to design a mold model, whose internal structure includes a conformal cooling water pipeline, and exporting an STL file of the mold model;

[0051] Step S3, slicing: import the STL file of the mold modeling model into the light-curing 3D printing slicing software, set the printing parameters, including layer exposure time of 8s, layer thickness of 0.05mm and lifting speed of 65mm / min, and generate a slicing file;

[0052] Step S4, using light-curing 3D printing technology to form a high-temperature resistant mold: importing the generated slice file into an LCD light-curing 3D printing device to perform LCD light-curing 3D printing to obtain a high-temperature resistant mold.

[0053] The thermogravimetric analysis diagram of the high temperature resistant mold formed by 3D printing technology in this embodiment is as follows: Figure 1 As shown in the figure, the compression strength effect diagram is as follows Figure 2 The high temperature resistant mold of this embodiment has high temperature resistance and compression strength that can meet the requirements of metal powder injection molding molds and plastic injection molding molds (common plastic and metal powder feeding molds have a temperature resistance of 150-250°C and a compression strength of 50-200MPa), among which the mold compression strength reaches 256MPa, and the thermal weight loss T 5％ =386.86℃、T max =438.40℃ and T 91％ =541.62℃, the mold surface has slight layers.

[0054] Example 2

[0055] A method for photocuring 3D printing a high temperature resistant mold comprises the following steps:

[0056] Steps S1-S4 are the same as in Example 1;

[0057] Step S5, surface chemical copper plating treatment: first, the high-temperature resistant mold formed by photocuring 3D printing is immersed in a sodium hydroxide solution for 10 minutes in a 60°C water bath for degreasing treatment, and then placed in a sulfuric acid solution for 2 minutes at room temperature to further remove impurities, and then immersed in a cationic active agent at 60°C for 10 minutes, and then immersed in a silver ammonia solution for 2 minutes at room temperature, and finally placed in a copper salt plating solution for copper plating treatment.

[0058] The high temperature resistant mold formed by 3D printing technology in this embodiment has high temperature resistance and compression strength that meet the requirements of metal powder injection molding molds and plastic injection molds, wherein the mold compression strength reaches 256MPa, and the thermal weight loss T 5％ =386.86℃、T max=438.40℃ and T 91％ =541.62℃. In addition, by copper plating the surface of the high-temperature resistant mold formed by light-curing 3D printing, a higher finish of the mold surface is achieved, and the service life of the mold is significantly extended.

[0059] Example 3

[0060] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 3 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0061] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0062] Ethoxylated bisphenol A diacrylate 70%, ethoxylated trimethylolpropane triacrylate 20%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 5%, filler 3%, auxiliary agent 2%.

[0063] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 260MPa and a thermal weight loss of T 5％ =390.44℃、T max =440.52℃ and T 91％ =545.88℃.

[0064] Example 4

[0065] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 4 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0066] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0067] Ethoxylated bisphenol A diacrylate 75%, ethoxylated trimethylolpropane triacrylate 20%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3%, filler 1%, auxiliary agent 1%.

[0068] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 266MPa and a thermal weight loss of T 5％ =395.31℃、T max =445.83℃ and T 91％ =549.37℃.

[0069] Example 5

[0070] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 5 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0071] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0072] Ethoxylated bisphenol A diacrylate 60%, ethoxylated trimethylolpropane triacrylate 30%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 6%, filler 4%.

[0073] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 245MPa and a thermal weight loss of T 5％ =365.49℃、T max =422.83℃ and T 91％ =518.84℃.

[0074] Example 6

[0075] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 6 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0076] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0077] Ethoxylated bisphenol A diacrylate 65%, ethoxylated trimethylolpropane triacrylate 23%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 10%, filler 1%, auxiliary agent 1%.

[0078] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 275MPa and a thermal weight loss of T 5％ =392.83℃、T max =448.45℃ and T 91％ =553.69℃.

[0079] Example 7

[0080] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 7 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0081] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0082] Ethoxylated bisphenol A diacrylate 50%, ethoxylated trimethylolpropane triacrylate 35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 8%, filler 5%, auxiliary agent 2%.

[0083] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 232MPa and a thermal weight loss of T 5％ =355.14℃、T max =417.62℃ and T 91％ =514.22℃.

[0084] Example 8

[0085] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, Example 7 is obtained by changing the formula of the high temperature resistant photocuring 3D printing resin while keeping other processes and parameters unchanged.

[0086] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0087] Ethoxylated bisphenol A diacrylate 80%, ethoxylated trimethylolpropane triacrylate 15%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3%, filler 1%, auxiliary agent 1%.

[0088] The high temperature resistant mold formed by 3D printing technology in this embodiment has a compression strength of 240 MPa and a thermal weight loss of T 5％ =366.45℃、T max =425.88℃ and T 91％ =522.73℃.

[0089] Comparative Example 1

[0090] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, the formula of the high temperature resistant photocuring 3D printing resin is changed, and other processes and parameters remain unchanged to obtain Comparative Example 1.

[0091] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0092] Silicon modified polyurethane acrylate 20%, bisphenol A type epoxy resin 35%, dipropylene glycol diacrylate 25%, 1,6-hexanediol diglycidyl ether 15%, diphenyl-(4-phenylthio)phenyl sulfonium hexafluoroantimonate 3.8%, auxiliary agent 1.2%. Among them, silicon modified polyurethane acrylate and bisphenol A type epoxy resin are used as prepolymers, dipropylene glycol diacrylate and 1,6-hexanediol diglycidyl ether are used as active diluents, and diphenyl-(4-phenylthio)phenyl sulfonium hexafluoroantimonate is used as a photoinitiator.

[0093] The mold formed by 3D printing technology in this embodiment uses other resin materials as prepolymers, and is matched with different reactive diluents and photoinitiators. Its heat deformation temperature is only 78°C, which does not meet the requirements of metal powder injection molding molds and plastic injection molds. The main reason is that the silicon-modified polyurethane acrylate and bisphenol A epoxy resin in the formula fail to provide sufficient cross-linking density and thermal stability, and the silicon-modified polyurethane acrylate gives the material a certain elasticity, which reduces the heat resistance and ultimately fails to meet the requirements of high-temperature molds. It can be explained that the selection of prepolymer and reactive diluent components directly affects the high temperature resistance of the prepared mold.

[0094] Comparative Example 2

[0095] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, the formula of the high temperature resistant photocuring 3D printing resin is changed, and other processes and parameters remain unchanged to obtain Comparative Example 2.

[0096] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0097] Poly(urethane)urea acrylate 50%, 2-(tert-butylamino)ethyl methacrylate 45%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 5%. Among them, poly(urethane)urea acrylate is used as a prepolymer, 2-(tert-butylamino)ethyl methacrylate is used as an active diluent, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is used as a photoinitiator.

[0098] The mold formed by 3D printing technology in this embodiment uses other resin materials as prepolymers, and is matched with different reactive diluents and photoinitiators. The temperature of 5% thermal weight loss is 289°C, but because the molded mold is an elastomer, the compression strength is extremely low and cannot meet the requirements of metal powder injection molding molds and plastic injection molds. The low compression strength of the 3D printing mold is mainly due to the elastomeric properties of the material. Poly (urethane) urea acrylate has high elasticity as a prepolymer, and its flexible chain segment causes the material to be easily deformed when under pressure, lacking sufficient rigidity and compression strength. In addition, 2- (tert-butylamino) ethyl methacrylate as an active diluent reduces the viscosity of the system, but at the same time reduces the cross-linking density of the material, further weakening the mechanical strength. Although the mold exhibits good heat resistance (the temperature of 5% thermal weight loss is 289°C), due to its elastomeric properties and the influence of diluents, it cannot meet the requirements of high compression strength for metal powder injection molding and plastic injection molds. It can be explained that the selection of prepolymer and reactive diluent components also directly affects the compression resistance of the prepared mold.

[0099] Comparative Example 3

[0100] A method for photocuring 3D printing a high temperature resistant mold is provided. Based on the method of Example 2, the formula of the high temperature resistant photocuring 3D printing resin is changed, and other processes and parameters remain unchanged to obtain Comparative Example 2.

[0101] Specifically, in this embodiment, the high temperature resistant light-curing 3D printing resin includes the following components in parts by weight:

[0102] Bisphenol A type epoxy resin 60%, ethoxylated trimethylolpropane triacrylate 27%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 8%, silicon dioxide 5%.

[0103] The mold formed by 3D printing technology in this embodiment has a compression strength of 120 MPa, a thermal weight loss T5% = 200.35 ° C, and a T max =225.64℃ and T 91％ =282.37℃. The light-cured 3D printing resin of Comparative Example 3 is different from that of Example 2 only in the prepolymer, but its compression resistance and high temperature resistance are significantly lower than those of Example 2. Bisphenol A epoxy resin is lower in compression strength and high temperature resistance than ethoxylated bisphenol A diacrylate. The main reason is that ethoxylated bisphenol A diacrylate forms a higher cross-linking density through free radical polymerization, giving it higher hardness, compression strength and heat resistance; while the cross-linking density of epoxy resin is low, and its high temperature resistance and mechanical strength after curing are not as good as those of acrylic resin. Therefore, ethoxylated bisphenol A diacrylate exhibits better high temperature resistance and compression strength.

[0104] From the test results of the above examples, it can be seen that the present invention uses a specific prepolymer and a reactive diluent, and the product generated by polymerization through the action of a photoinitiator can significantly improve the high temperature resistance and compression resistance of the mold. In the comparative example, the light-curing 3D resin material synthesized using other prepolymers and reactive diluents has a mold with significantly lower high temperature resistance and compression strength than the mold formed by the light-curing 3D resin material of the present invention.

[0105] The embodiments of the present invention are described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principles and spirit of the present invention are still within the protection scope of the present invention.

Claims

1. A method for photocuring 3D printing a high temperature resistant mold, characterized in that: The steps include: Step S1, synthesizing a high temperature resistant light-curable 3D printing resin, wherein the high temperature resistant light-curable 3D printing resin comprises the following components by weight percentage: Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, auxiliary agent 0-2%; Step S2, constructing a mold model by using 3D modeling software, wherein the mold model structure includes a conformal cooling water pipeline; Step S3, slicing the mold model through slicing software and setting printing parameters to generate a slicing file; Step S4, importing the generated slice file into a light-curing 3D printing device, using the high temperature resistant light-curing 3D printing resin as a 3D printing material, and using light-curing 3D printing technology to form a high temperature resistant mold.

2. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: In step S1, the filler is silicon dioxide particles or aluminum oxide particles, and the particle size thereof is 50-100 nm.

3. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: In step S1, the auxiliary agent is at least one of a defoaming agent, an inhibitor, a leveling agent or a dispersant.

4. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: The synthesis method of the high temperature resistant light-curing 3D printing resin in step S1 is: Stir ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate in a water bath at 55-65°C until completely mixed; Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed; Finally, add fillers and additives and continue stirring until completely mixed.

5. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: In step S2, the conformal cooling water pipe is arranged inside the mold, fits the mold wall, and changes with the shape of the inner surface of the mold.

6. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: In step S3, the printing parameters include exposure time, layer thickness and lifting speed.

7. The method for photocuring 3D printing a high temperature resistant mold according to claim 1, characterized in that: In step S4, LCD light-curing 3D printing technology is used to form a high-temperature resistant mold.

8. The method for photocuring 3D printing a high temperature resistant mold according to any one of claims 1 to 7, characterized in that: The method further includes step S5, wherein the surface of the formed high temperature resistant mold is processed by grinding, polishing, chemical plating or electroplating.

9. The method for photocuring 3D printing a high temperature resistant mold according to claim 8, characterized in that: The surface of the molded high temperature resistant mold is subjected to chemical copper plating treatment.

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