Diamond wire pre-plating structure capable of achieving uniform electroplating

Abstract

The diamond wire pre-plating structure comprises a pre-plating tank and a conductive tank, wherein the pre-plating tank and the conductive tank are used for allowing a diamond wire to pass through and are arranged at intervals; an anode material placed in the pre-plating tank is electrolyzed through current to form a pre-plating layer on the surface of the diamond wire; a power supply anode is connected in the pre-plating tank, and a power supply cathode is connected in the conductive tank to form a plurality of parallel pre-plating loops. The multiple pre-plating loops are arranged, so that the surface of the diamond wire is uniformly pre-plated, and meanwhile, the plating thickness is increased.

Description

Technical Field

[0001] The invention belongs to the field of diamond wire manufacturing, and in particular relates to a uniformly electroplated diamond wire pre-plating structure. Background Art

[0002] Diamond wire, also known as diamond wire, is widely used in solar silicon wafer cutting, sapphire cutting and other fields. It is usually made by electroplating a layer of metal (usually nickel or copper) on the surface of steel wire, and then fixing artificial diamond particles on this layer of metal. This wire saw can achieve precise cutting of hard materials by rotating at high speed and moving under a certain tension.

[0003] The plating process of diamond wire is one of the key processes for the preparation of diamond wire. The current plating processes for diamond wire are pre-plating and thickening plating. Pre-plating is the key step of plating. The busbar that has been pre-treated and sanded is immersed in the pre-plating tank. Under the action of the current, a thin and complete nickel plating layer is formed on the surface of the busbar to preliminarily fix the diamond dust on the busbar. Nickel balls are used as anodes in the tank, and the busbars are used as cathodes. Traditional pre-plating is divided into two parts: pre-plating one and pre-plating two. The main purpose of pre-plating one is to preliminarily fix the diamond dust to the busbar, and then the diamond dust that is not firmly bonded will be peeled off through the electrolytic tank; the main purpose of pre-plating two is to further consolidate the diamond dust to the busbar to prevent it from falling off at the cathode wheel of the subsequent thickening tank, in preparation for subsequent thickening plating.

[0004] Traditional pre-plating control methods and wiring methods easily lead to uneven distribution of current in the pre-plating tank. This will lead to significant differences in the thickness of the coating in different areas of the busbar surface, which in turn affects the consistency and quality of the final product. Due to the uneven current distribution, the traditional pre-plating process often cannot ensure the uniform distribution and firm fixation of diamond dust on the busbar. This not only reduces the service life of the diamond wire, but also increases the manufacturing cost. In the traditional pre-plating process, the titanium basket plays an important role as an anode material in the electroplating process. However, due to improper wiring methods, the connection between the titanium basket and the power supply is unstable, and sometimes even invalid connection occurs, which seriously affects the pre-plating effect. Due to the existence of the above problems, the quality of the coating in the traditional pre-plating process is difficult to control, and problems such as uneven coating and poor bonding often occur, which directly affect the performance and reliability of the diamond wire. Summary of the invention

[0005] The present invention aims to provide a uniformly electroplated diamond wire pre-plating structure to solve the technical problem of improving the pre-plating effect and ensuring the pre-plating thickness during the diamond wire pre-plating process.

[0006] To achieve the above object, the specific technical solution of a uniformly electroplated diamond wire pre-plating structure of the present invention is as follows:

[0007] A uniformly electroplated diamond wire pre-plating structure comprises a pre-plating tank and a conductive tank for the diamond wire to pass through and arranged at intervals, and an anode material placed in the pre-plating tank is electrolyzed by current to form a pre-plating layer on the surface of the diamond wire;

[0008] The pre-plating tank is connected to the positive pole of the power supply, and the conductive tank is connected to the negative pole of the power supply, so as to form a plurality of parallel pre-plating loops.

[0009] As a further improvement of the present invention, the pre-plating structure of the present invention adopts a single power supply.

[0010] As a further improvement of the present invention, the positive electrode of the power supply is symmetrically connected from both sides in the pre-plating tank, and the negative electrode of the power supply is symmetrically connected from both sides in the conductive tank.

[0011] As a further improvement of the present invention, the anode material in the pre-plating tank is placed in an anode basket, and the anode basket is connected to the positive electrode of the power supply.

[0012] As a further improvement of the present invention, a connection with the negative electrode of the power supply is provided in the conductive slot.

[0013] As a further improvement of the present invention, a single group of anode baskets is arranged in the pre-plating tank, and the anode baskets and the cathode materials in the conductive tank adjacent to the pre-plating tank form a pre-plating loop.

[0014] As a further improvement of the present invention, two groups of anode baskets are arranged in the pre-plating tank, the two groups of anode baskets are respectively connected to the positive electrode of the power supply, and the two groups of anode baskets are respectively connected to the cathode materials in the conductive tanks on both sides of the pre-plating tank to form a pre-plating loop.

[0015] As a further improvement of the present invention, the anode material is nickel, and nickel ions are electrolytically dissolved in an electroplating solution and attached to the surface of the diamond wire to form a pre-plating layer; and the cathode material is graphite.

[0016] As a further improvement of the present invention, the anode basket is a titanium basket.

[0017] As a further improvement of the present invention, the power supply specification is 5A / 12V, and the pre-plating current is 0.8-1.5A.

[0018] Beneficial effects:

[0019] The present invention connects the negative pole of the power supply in the conductive slot and forms multiple parallel pre-plating circuits with the anode material in the pre-plating slot (connected to the positive pole of the power supply), thereby ensuring that the current is more evenly distributed in each pre-plating slot. The design of a single power supply makes the current control more precise, avoiding the current fluctuation and imbalance that may be caused by multiple power supplies, thereby improving the consistency and stability of the coating. The positive pole of the power supply and the negative pole of the power supply are symmetrically connected from both sides, further enhancing the uniformity of the current distribution, avoiding the phenomenon of local current being too strong or too weak, and improving the consistency and stability of the coating. Due to the uniform current distribution, the present invention can significantly improve the quality of the coating, ensuring that the thickness of the pre-plating layer formed on the surface of the diamond wire is uniform and defect-free. The anode material (such as nickel) can be evenly dissolved in the electroplating solution during the electrolysis process, further improving the uniformity and adhesion of the coating.

[0020] The anode material in the pre-plating tank is placed in an anode basket (such as a titanium basket) and connected to the positive pole of the power supply, ensuring a stable and reliable connection between the anode material and the power supply. The design of the anode basket not only facilitates the replacement of the anode material, but also ensures that its position is fixed during the electroplating process to avoid uneven current distribution caused by movement.

[0021] The design of single or double anode baskets enables the pre-plating tank and the conductive tank to form an effective pre-plating loop, which simplifies the process flow and improves production efficiency. The cathode material (such as graphite) is set in the conductive tank to further enhance the conduction effect of the current and ensure the effective use of the current.

[0022] The power supply specifications and current are optimized, and the optimized parameter range ensures that the current intensity during the electroplating process is moderate, neither too strong to cause uneven coating, nor too weak to affect the coating formation speed. Reasonable current parameter settings can effectively avoid coating defects such as pinholes, spots, etc., and further improve the quality of the coating.

[0023] The invention has a simple structure and is easy to operate, reduces the number of reworks caused by uneven current distribution, and improves production efficiency. The efficient and stable pre-plating process reduces unnecessary downtime and material waste, and reduces production costs.

[0024] In summary, the present invention achieves a pre-plating effect with uniform current distribution, high coating quality, and stable and reliable connection by optimizing the pre-plating structure and process parameters, greatly improving the efficiency and product quality of the diamond wire pre-plating process. This improvement is of great significance to improving the performance and market competitiveness of diamond wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a uniformly electroplated diamond wire pre-plating structure of the present invention;

[0026] Explanation of the marks in the figure: 11, first pre-plating tank; 12, second pre-plating tank; 13, third pre-plating tank; 14, fourth pre-plating tank; 15, fifth pre-plating tank; 21, first conductive tank; 22, second conductive tank; 23, third conductive tank; 24, fourth conductive tank; 31, first titanium basket; 32, second titanium basket; 40, positive pole of power supply; 50, negative pole of power supply. DETAILED DESCRIPTION

[0027] In order to better understand the purpose, structure and function of the present invention, a uniformly electroplated diamond wire pre-plating structure of the present invention is further described in detail below in conjunction with the accompanying drawings.

[0028] Implementation example:

[0029] A diamond wire pre-plating structure for uniform electroplating, the diamond wire passes through the pre-plating structure with pre-plating slots and conductive slots arranged at intervals in sequence, so that a pre-plating layer is formed on the surface, and the diamond grit is firmly attached to the surface of the diamond wire. A single power supply is used for power supply, the pre-plating slot is connected to the positive electrode 40 of the power supply, and the conductive slot is connected to the negative electrode 50 of the power supply. Compared with the traditional pre-plating process, the pre-plating structure of the present invention is obtained by reducing the pre-plating power supply and changing its corresponding wiring method and slot body design. The symmetrically distributed wiring method makes the current distribution more uniform. The new slot body design makes the plating interval wider in the pre-plating process, the coating thickness is effectively increased, and the bond between the diamond grit and the busbar is more firm. Different interval combinations of pre-plating slots and conductive slots can be made according to different site conditions, and 1 or 2 groups of anode baskets are set in the pre-plating slot. When more than 2 groups of titanium baskets are set in the pre-plating slot, the pre-plating effect of the middle titanium basket is poor, and no description is made.

[0030] like Figure 1 As shown, in this embodiment, a structure of 5 pre-plating slots are arranged with conductive slots at intervals, and a single power supply is connected to the pre-plating slot and the conductive slot from both sides through a symmetrical wiring method. Among them, the anode material in the pre-plating slot is a nickel ball, which is placed in an anode basket, and the anode basket is a titanium basket; the cathode material in the conductive slot is a graphite plate. The positive pole of the power supply is connected to the titanium basket, and the negative pole of the power supply is connected to the graphite plate. The pre-plating slot and the conductive slot are named as the first pre-plating slot 11 to the fifth pre-plating slot 15, and the first conductive slot 21 to the fourth conductive slot 24 in sequence according to the direction of the diamond wire passing through. Among them, the third pre-plating slot is a double titanium basket setting, which is named as the first titanium basket 31 and the second titanium basket 32 ​​along the direction of the diamond wire passing through.

[0031] The titanium basket in the first pre-plating tank 11 is connected to the positive pole of the power supply, and forms a first pre-plating loop with the graphite plate connected to the negative pole of the power supply in the first conductive tank 21. The titanium basket in the second pre-plating tank 12 and the first titanium basket in the third pre-plating tank 13 are respectively connected to the positive pole of the power supply, and form a second pre-plating loop with the graphite plate connected to the negative pole of the power supply in the second conductive tank 22. The second titanium basket 32 ​​in the third pre-plating tank 13 and the titanium basket in the fourth pre-plating tank 14 are respectively connected to the positive pole of the power supply, and form a third pre-plating loop with the graphite plate connected to the negative pole of the power supply in the third conductive tank 23. The titanium basket in the fifth pre-plating tank 15 is connected to the positive pole of the power supply, and forms a fourth pre-plating loop with the graphite plate connected to the negative pole of the power supply in the fourth conductive tank 24.

[0032] The specification of a single pre-plating power supply is 5A / 12V, and the pre-plating current can reach 1.5A. The current of each titanium basket is about 0.1A, and the current of each conductive slot is about 0.37A. The four pre-plating circuits evenly distribute the current on the titanium basket, thereby achieving the purpose of uniform plating, improving the uniformity of the coating and the stability of sanding. The effective increase in current can effectively increase the thickness of the coating, thereby enhancing the bonding force between the diamond sand and the substrate, and effectively reducing the line mark rate when cutting on the client side.

[0033] The following examples illustrate the performance of the pre-plating structure of the present invention in uniformly improving the thickness of the plating layer.

[0034] Case 1:

[0035] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0036] Step 2: The pre-plating current is set to 0.8A, and a 40-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0037] Step 3: The diameter of the obtained pre-plated coating sample wire is tested by a laser diameter gauge and the morphology is tested by an electron microscope: the coating thickness is 0.3 μm, and the coating surface is dense and smooth.

[0038] Case 2:

[0039] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0040] Step 2: The pre-plating current is set to 1.2A, and a 40-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0041] Step 3: The diameter of the obtained pre-plated coating sample wire is tested by a laser diameter gauge and the morphology is tested by an electron microscope: the coating thickness is 0.45 μm, and the coating surface is dense and smooth.

[0042] Case 3

[0043] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0044] Step 2: The pre-plating current is set to 1.5A, and a 40-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0045] Step 3: The diameter of the obtained pre-plated coating sample wire is tested by a laser diameter gauge and the morphology is tested by an electron microscope: the coating thickness is 0.6 μm, and the coating surface is dense and smooth.

[0046] Case 4:

[0047] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0048] Step 2: The pre-plating current is set to 0.8A, and a 37-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0049] Step 3: The obtained pre-plated coating sample wire is tested for diameter by a laser diameter gauge and morphology by an electron microscope: the coating thickness is 0.2 μm, and the coating surface is dense and smooth.

[0050] Case 5:

[0051] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0052] Step 2: The pre-plating current is set to 1.2A, and a 37-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0053] Step 3: The diameter of the obtained pre-plated coating sample wire is tested by a laser diameter gauge and the morphology is tested by an electron microscope: the coating thickness is 0.32 μm, and the coating surface is dense and smooth.

[0054] Case 6

[0055] Step 1: setting a pre-plating tank and a conductive tank, as well as power supply wiring according to the pre-plating structure in this embodiment;

[0056] Step 2: The pre-plating current is set to 1.32A, and a 37-gauge carbon steel wire is used. After the wire-laying end, alkali washing, water washing, pre-plating, water washing, drying, visual inspection, and finally to the wire-receiving end, a pre-plated coating sample wire is obtained.

[0057] Step 3: The diameter of the obtained pre-plated coating sample wire is tested by a laser diameter gauge and the morphology is tested by an electron microscope: the coating thickness is 0.45 μm, and the coating surface is dense and smooth.

[0058] Case 1 to Case 3 show that under the condition of the same specification of carbon steel wire (40 specifications), as the pre-plating current increases from 0.8A to 1.5A, the coating thickness increases from 0.3μm to 0.6μm. Case 4 to Case 6 show that under the condition of a smaller specification of carbon steel wire (37 specifications), as the pre-plating current increases from 0.8A to 1.32A, the coating thickness increases from 0.2μm to 0.45μm. This shows that by adjusting the pre-plating current, the thickness of the coating can be accurately controlled to meet different process requirements. Through laser caliper test of diameter and electron microscope morphology test, it was found that no matter how the current setting changes, the coating surface is relatively dense and smooth. This shows that the pre-plating structure of the present invention can ensure the quality of the coating surface and maintain a uniform surface state even when the current changes greatly.

[0059] The uniformly electroplated diamond wire pre-plating structure of the present invention ensures the consistency and controllability of the coating thickness by optimizing the current setting and process flow, improves the quality of the coating surface, is applicable to carbon steel wires of different specifications, and improves production efficiency. These advantages make the present invention have significant advantages in practical applications and can significantly improve the efficiency and product quality of the diamond wire pre-plating process.

[0060] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A uniformly electroplated diamond wire pre-plating structure, characterized in that: It includes a pre-plating tank and a conductive tank which are arranged at intervals for the diamond wire to pass through, and an anode material placed in the pre-plating tank is electrolyzed by electric current to form a pre-plating layer on the surface of the diamond wire; The pre-plating tank is connected to the positive pole of the power supply, and the conductive tank is connected to the negative pole of the power supply, so as to form a plurality of parallel pre-plating loops.

2. The uniformly electroplated diamond wire pre-plating structure according to claim 1, characterized in that: Uses a single power supply.

3. The uniformly electroplated diamond wire pre-plating structure according to claim 1 or 2, characterized in that: The positive electrode of the power supply is symmetrically connected from both sides in the pre-plating tank, and the negative electrode of the power supply is symmetrically connected from both sides in the conductive tank.

4. The uniformly electroplated diamond wire pre-plating structure according to claim 1, characterized in that: The anode material in the pre-plating tank is placed in an anode basket, and the anode basket is connected to the positive electrode of the power supply.

5. The uniformly electroplated diamond wire pre-plating structure according to claim 4, characterized in that: The conductive slot is provided with a connection to the negative electrode of the power supply.

6. The uniformly electroplated diamond wire pre-plating structure according to claim 5, characterized in that: A single group of anode baskets is arranged in the pre-plating tank, and the anode baskets and the cathode materials in the conductive tank adjacent to the pre-plating tank form a pre-plating loop.

7. The uniformly electroplated diamond wire pre-plating structure according to claim 5, characterized in that: Two groups of anode baskets are arranged in the pre-plating tank, the two groups of anode baskets are respectively connected to the positive pole of the power supply, and the two groups of anode baskets are respectively connected to the cathode materials in the conductive tanks on both sides of the pre-plating tank to form a pre-plating loop.

8. The uniformly electroplated diamond wire pre-plating structure according to claim 5, characterized in that: The anode material is nickel, and nickel ions are electrolyzed and dissolved in an electroplating solution and attached to the surface of the diamond wire to form a pre-plating layer; the cathode material is graphite.

9. The uniformly electroplated diamond wire pre-plating structure according to claim 4 or 5, characterized in that: The anode basket is a titanium basket.

10. The uniformly electroplated diamond wire pre-plating structure according to claim 2, characterized in that: The power supply specification is 5A / 12V, and the pre-plating current is 0.8-1.5A.

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