Circuit board testing device and testing method and application of circuit board testing device and testing method in electronic information engineering

Abstract

The invention belongs to the technical field of circuit board testing, and discloses a circuit board testing device, a circuit board testing method and application of the circuit board testing device in electronic information engineering.The circuit board testing device comprises a detection assembly, and the detection assembly is connected with two driving assemblies; the ends, away from the detection assembly, of the two driving assemblies are connected with a sealing assembly, the detection assembly comprises a bearing plate, and through mutual cooperation of a buffer assembly, an air hole and a clamping assembly, on one hand, it is ensured that the contact rate of the working assembly is controllable when the working assembly approaches a circuit board; on one hand, interference of the working assembly on the position of the circuit board in the moving process can be reduced while the working assembly is prevented from making direct contact with the circuit board, on the other hand, gas in the cavity is exhausted through the gas holes through compression of the buffer shell, welding points on the circuit board are tested through the gas generated by the gas holes, and the welding stability of the welding points is ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board testing, and in particular relates to a circuit board testing device, a testing method and applications thereof in electronic information engineering. Background Art

[0002] With the rapid development of electronic technology, the integration and output of circuit boards are constantly improving, which puts higher requirements on the quality and performance of circuit boards. Therefore, circuit board defect detection technology has become a very critical technology in the electronics industry. In order to ensure the performance and reliability of electronic products, the performance test of circuit boards has become particularly important. Among them, traditional manual detection methods are inefficient and have limited accuracy.

[0003] The patent with application number CN202310243892.7 discloses a circuit board testing device, including: a base assembly, including a first mounting plate and a pin plate detachably connected to the first mounting plate; a carrier plate, arranged on the pin plate, and provided with a first placement position for placing a first circuit board under test and a second placement position for placing a second circuit board under test; a test interface, arranged on the carrier plate, and the test interface is used to electrically connect to the first circuit board under test or the second circuit board under test; a test plug, used to electrically connect to the test machine, and the test plug is also used to be plugged into the test interface. The circuit board testing device provided by the above scheme can realize the testing of two different circuit boards under test, without the need to develop and produce two different circuit board testing devices for two different circuit boards under test, thereby reducing the research and development and production costs of the circuit board testing device. When the above scheme is used, it can only realize the performance testing of the finished circuit board waiting for the connection device, and cannot test the circuit board after production.

[0004] In the process of testing the circuit board, the first thing that needs to be determined is whether the welding points on the circuit board are welded completely and whether the connection between the welding points and the circuit board is tight and stable. At the same time, in the process of testing the circuit board body, due to the different materials and volumes of the circuit board, the circuit board is clamped in the process, which can easily cause the circuit board to produce curvature and angle deviations during the test, affecting the contact performance between the test component and the circuit board, and ultimately interfering with the test results of the circuit board.

[0005] Therefore, in order to solve the above technical problems, this case proposes a circuit board testing device. Summary of the invention

[0006] The purpose of the present invention is to solve the above problems. The present invention provides a circuit board testing device, a testing method and its application in electronic information engineering, which have the advantages of ensuring safety and stability during circuit board testing.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solutions: a circuit board testing device, comprising a detection component, two driving components are connected to the detection component, and a closing component is connected to one end of the two driving components away from the detection component, the detection component comprises a carrying plate, and a detection cavity for placing a circuit board is opened at one end of the carrying plate close to the closing component, and clamping components are respectively connected to two sides of the detection cavity distributed along the length direction; A buffer component is connected to one end of the detection component close to the closing component, and the buffer component includes a buffer shell, a cavity is opened in the buffer shell, and the buffer shell is made of elastic material; The detection cavity is also connected with a protection component for mounting the middle part of the circuit board.

[0008] Preferably, the protection component includes an adjustment part, the adjustment part is connected to a side cavity surface of the detection cavity, a buffer part is connected to the side of the adjustment part away from the detection cavity, an insulating pad is connected to one end of the buffer part away from the adjustment part, and a buffer cavity is opened in the buffer part.

[0009] Preferably, the height of the protection component is smaller than the depth of the detection cavity, and an air hole is opened on the cavity wall of the detection cavity, and the air hole is communicated with the cavity.

[0010] Preferably, the closing component includes a cover plate, and two interference blocks are connected to one end of the cover plate close to the detection component, and the two interference blocks can correspond to the positions of the two buffer components. The cover plate is also connected to one end close to the detection component with a working component, and the working component is located between the two interference blocks.

[0011] Preferably, the working assembly comprises a connecting plate, the connecting plate is connected to the cover plate, and an end of the connecting plate away from the cover plate is connected to a detection head for detecting the circuit board.

[0012] Preferably, a controller is connected to one end of the cover plate away from the working assembly, and the controller is used to control the electronic components of the device.

[0013] Preferably, the two clamping assemblies each include a telescopic part, to which a force-bearing plate is connected, and the ends of the two force-bearing plates close to each other are respectively connected to rotating disks, and a movable groove is opened in the rotating disk, and the two ends of the movable groove distributed along the length direction are respectively connected to a stationary plate and a clamping plate, and the clamping plate is slidably connected in the movable groove, and the ends of the stationary plate opposite to the clamping plate are both connected to an anti-slip layer.

[0014] Preferably, a bending cavity is also provided on the supporting plate, and the driving assembly is located in the bending cavity. The driving assembly includes a connecting rod, one end of the connecting rod is hinged to the inner wall of the bending cavity, and the other end of the connecting rod is rotatably provided with a swing rod, and the end of the swing rod away from the connecting rod is hinged to the closing assembly, and the connecting rod is connected to a driving rod at one end close to the swing rod.

[0015] The present invention also includes a testing method, which is performed using a circuit board testing device and includes the following steps: S1. Control the movement of the sealing component through the driving component to expose the detection cavity, and drive the force-bearing plate to rise through the telescopic part to move the static plate out of the detection cavity; S2, placing the circuit board to be tested on the stationary plate, and clamping the circuit board by controlling the clamping plate through the controller; S3, using a controller to control the telescopic part to shrink, so that the circuit board moves toward one end close to the detection cavity, so that the circuit board contacts the insulating pad but does not compress the buffer part; S4, after the cover plate is moved to one side of the carrier plate by controlling the driving assembly, the cover plate is controlled to move toward the side close to the carrier plate, and the angle of the circuit board is adjusted by using the rotating disk; S5, using the abutment block to contact the buffer shell and compress the volume of the cavity, so that the gas in the cavity moves out through the pores and acts on the circuit board body; S6. Then, the angle of the circuit board is controlled to reset, so that the cover plate covers the carrier plate, and the performance of the circuit board is tested by the detection head.

[0016] The present invention also includes a method of utilizing the circuit board testing device to complete its application in electronic information engineering.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting the coordination between the buffer component, the air hole and the clamping component, on the one hand, it is ensured that the contact rate of the working component when approaching the circuit board is controllable, avoiding the working component from directly contacting the circuit board, and reducing the interference of the working component on the position of the circuit board during movement. On the other hand, through the compression of the buffer shell, the gas in the cavity is forced to be discharged through the air hole, and the clamping component can control the angle deflection of the circuit board, and the gas generated by the air hole is used to test the welding points on the circuit board to ensure the welding stability of the welding points.

[0018] 2. Through the protection component, the middle area of ​​the circuit board can be supported during the performance test of the circuit board to ensure that the end face of the circuit board to be tested is in a horizontal state during the test, ensure the contact tightness between the detection head and the circuit board, reduce the test error during the test, and at the same time, utilize the contact pressure recognition between the buffer part and the circuit board to ensure the horizontality of the circuit board in the detection cavity, further improve the test accuracy during the circuit board test. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the overall device of the present invention; Figure 2 It is a schematic diagram of the connection structure of the working components of the present invention; Figure 3 It is a schematic diagram of the connection structure of the drive assembly of the present invention; Figure 4 It is a schematic cross-sectional structure diagram of the buffer assembly of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the protection component of the present invention; Figure 6 It is a schematic diagram of the cross-sectional structure of the protection component of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the clamping assembly of the present invention.

[0020] Description of the drawings: 1. Detection component; 101. Load-bearing plate; 1011. Bending cavity; 102. Detection cavity; 1021. Air hole; 2. Support leg; 3. Buffer component; 301. Buffer shell; 302. Cavity; 4. Clamping component; 401. Telescopic part; 402. Force-bearing plate; 403. Rotating disk; 4031. Movable groove; 404. Stationary plate; 405. Clamping plate; 406. Anti-skid layer; 5. Driving component; 501. Connecting rod; 502. Driving rod; 503. Swinging rod; 6. Protection component; 601. Adjustment part; 602. Buffer part; 6021. Buffer cavity; 603. Insulation pad; 7. Closing component; 701. Cover plate; 702. Resistance block; 8. Controller; 9. Working component; 901. Connecting plate; 902. Detection head. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0022] like Figure 1-Figure 7As shown, the present invention discloses a circuit board testing device, including a detection component 1 for identifying a circuit board, two driving components 5 are connected to the detection component 1, and a closing component 7 is connected to one end of the two driving components 5 away from the detection component 1, wherein the closing component 7 can cover one end of the detection component 1, and the position of the closing component 7 can be controlled by controlling and regulating the two driving components 5, the detection component 1 includes a carrier plate 101, and a support leg 2 is connected to one end of the carrier plate 101 away from the closing component 7, and the stability of the detection component 1 is maintained by the support leg 2, and a detection cavity 102 for placing the circuit board is opened at one end of the carrier plate 101 close to the closing component 7, and clamping components 4 are respectively connected to the two sides of the detection cavity 102 distributed along the length direction, and the edge of the circuit board is clamped and fixed by the clamping component 4, and the circuit board to be detected is placed on the clamping component 4, and the position of the circuit board is constrained by the clamping component 4, and then the clamping component 4 is controlled to move, so as to prompt the clamping component 4 to move the circuit board to be detected into the detection cavity 102, waiting for subsequent detection.

[0023] In order to prevent the circuit board testing device from colliding with the supporting plate 101 when the working component 9 approaches the circuit board during the test, which may affect the connection stability of the circuit board and even cause damage to the circuit board to be tested in serious cases, a buffer component 3 for offsetting the impact force of the closing component 7 is connected to the end of the detection component 1 close to the closing component 7, wherein the buffer component 3 includes a buffer shell 301, a cavity 302 is defined in the buffer shell 301, and the buffer shell 301 is made of elastic material. In this embodiment, the elastic material of the buffer shell 301, when the closing component 7 closes the detection component 1, the buffer shell 301 is subjected to external force, which drives the buffer shell 301 to deform, thereby causing the cavity 302 to be compressed, thereby buffering the force during the movement of the closing component 7, and ensuring that the movement of the closing component 7 will not affect the circuit board in the detection cavity 102.

[0024] Due to the different sizes of circuit boards, when the volume of the circuit board is large, even under the clamping action of the clamping component 4, the central area thereof will partially sink, thereby affecting the contact between the working component 9 and the circuit board, and ultimately causing deviations in the test results of the circuit board. A protection component 6 for carrying the middle part of the circuit board is also connected in the detection cavity 102. The protection component 6 is used to support the middle area of ​​the circuit board. When the clamping component 4 drives the circuit board to move toward one end close to the detection cavity 102, the circuit board will contact the protection component 6, and the protection component 6 is used to maintain various areas of the circuit board in the same horizontal state.

[0025] In order to ensure that the protection component 6 does not interfere with the test of the circuit board when supporting the circuit board, such as Figure 5-Figure 6As shown, further, the protection component 6 includes an adjusting part 601, wherein the adjusting part 601 can adjust the height of the insulating pad 603 and the buffer part 602 according to the contact situation between the circuit board and the insulating pad 603, so as to ensure that the protection component 6 can contact the circuit board under any circumstances and ensure the stability of the circuit board during the detection process. The adjusting part 601 is connected to a side surface of the detection cavity 102, and a buffer part 602 is connected to the side of the adjustment part 601 away from the detection cavity 102, and an insulating pad 603 is connected to one end of the buffer part 602 away from the adjusting part 601, and a buffer cavity 6021 is opened in the buffer part 602. As the clamping component 4 drives the circuit board to move, the circuit board will conflict with the insulating pad 603, and then as the circuit board moves, the buffer part 602 is compressed to ensure that the horizontality of the circuit board in the detection cavity 102 can meet the normal test of the working component 9, and after the buffer part 602 is compressed and deformed, it can serve as an extension part of the insulating pad 603 to support other parts of the circuit board.

[0026] At the same time, during use, the state of the circuit board in the detection cavity 102 is identified based on the supporting state of the insulating pad 603 and the buffer part 602 for the circuit board. That is, when the deformation amount of the buffer part 602 around the insulating pad 603 is the same, it means that the circuit board is in a horizontal state in the detection cavity 102 at this time. When the deformation amount of the buffer part 602 around the insulating pad 603 is different, it means that the circuit board is not in a horizontal state in the detection cavity 102. The height of the control adjustment part 601 is adjusted to achieve the height regulation of the insulating pad 603 to ensure the stability of the circuit board.

[0027] It should be noted that, since the circuit board and the protection component 6 are in a mutually perpendicular state when in contact, after the circuit board compresses the protection component 6 , the buffer portion 602 spreads evenly along the insulating pad 603 .

[0028] When testing the circuit board, it is necessary to ensure that the welding points on the circuit board are in a stable connection state. Furthermore, the height of the protection component 6 is less than the depth of the detection cavity 102, thereby preventing the protection component 6 from directly contacting the circuit board when the circuit board enters the detection cavity 102 but does not reach the detection position, causing a bulge in the middle area of ​​the circuit board, thereby ensuring the horizontality of the circuit board in the detection cavity 102, and an air hole 1021 is opened on the cavity wall of the detection cavity 102, and the air hole 1021 is connected to the cavity 302, and then when the closing component 7 contacts and compresses the buffer shell 301, the gas in the cavity 302 will act on the circuit board through the air hole 1021, and then the welding points on the circuit board are identified. When the welding points on the circuit board are in a stable state, the welding points will not become loose under the action of the wind force of the air hole 1021. When the welding points on the circuit board are loose or the welding is not tight, the welding points on the circuit board can be removed under the action of the wind force generated by the air hole 1021, thereby realizing the position identification of the welding points on the circuit board.

[0029] In order to ensure that the circuit board can meet the test requirements, and the buffer component 3 can effectively buffer the movement of the closing component 7, as shown in FIG. Figure 2 As shown, further, the closing component 7 includes a cover plate 701, and the cover plate 701 can cover the carrier plate 101. Two contact blocks 702 are connected to one end of the cover plate 701 close to the detection component 1, and the two contact blocks 702 can correspond to the positions of the two buffer components 3, and then in the process of the cover plate 701 covering the carrier plate 101, the contact blocks 702 can interfere with the buffer components 3, and then with the movement of the cover plate 701, the movement of the contact blocks 702 is achieved, and finally the compression of the buffer components 3 is achieved, ensuring that the gas generated by the pores 1021 can test the welding points of the circuit board, and at the same time, a working component 9 is also connected to one end of the cover plate 701 close to the detection component 1, and the working component 9 is located between the two contact blocks 702. The working component 9 is used to contact the welding points on the circuit board to achieve performance testing of the circuit board.

[0030] like Figure 2 As shown, in order to facilitate the working component 9 to contact the welding points, the working component 9 further includes a connecting plate 901, and the connecting plate 901 is connected to the cover plate 701. The end of the connecting plate 901 away from the cover plate 701 is connected with a plurality of detection heads 902 for detecting the circuit board, wherein the connecting plate 901 can transmit and receive data on the detection head 902. At the same time, after the cover plate 701 covers the carrier plate 101, the detection head 902 moves to contact and identify the welding points on the circuit board to complete the performance test of the circuit board.

[0031] like Figure 1As shown, further, a controller 8 is connected to one end of the cover plate 701 away from the working component 9, and the controller 8 is used to control the electronic components of the device, and the circuit board testing device is controlled by the controller 8, while the status of the electronic components in each area is identified and judged.

[0032] In order to ensure that the clamping assembly 4 does not damage the circuit board during the clamping process and can meet the requirements of clamping different types of circuit boards, such as Figure 7 As shown, further, the two clamping assemblies 4 both include a telescopic portion 401, through which the height of the stationary plate 404 can be adjusted, thereby facilitating the placement and removal of the circuit board for testing and reducing the time loss during the test. The telescopic portion 401 is connected to a force-bearing plate 402, and the ends of the two force-bearing plates 402 close to each other are respectively connected to a rotating disk 403, wherein the rotating disk 403 can rotate on the force-bearing plate 402, and the two rotating disks 403 can rotate synchronously, and the distance between the end face of the rotating disk 403 and the force-bearing plate 402 can be dynamically adjusted, that is, according to the model of the circuit board being tested, the distance between the two rotating disks 403 can be adjusted, thereby ensuring that the test device can clamp circuit boards of different models, and an active The movable groove 4031, the two ends of the movable groove 4031 distributed along the length direction are respectively connected with a stationary plate 404 and a clamping plate 405, the clamping plate 405 is slidably connected in the movable groove 4031, when the circuit board is located on the stationary plate 404, the clamping plate 405 is controlled to move in the movable groove 4031, and the clamping plate 405 and the stationary plate 404 are prompted to cooperate with each other to constrain the position of the circuit board, in order to avoid damage to the circuit board caused by the clamping plate 405 and the stationary plate 404 during the clamping process, the opposite ends of the stationary plate 404 and the clamping plate 405 are connected with an anti-slip layer 406, and the anti-slip layer 406 is used to contact the circuit board to avoid relative displacement between the circuit board and the clamping plate 405, thereby ensuring the integrity of the circuit board during the detection process and reducing external interference.

[0033] It should be noted that the surface area of ​​the stationary plate 404 is larger than the surface area of ​​the clamping plate 405 , and thus after the circuit board contacts the stationary plate 404 , without the intervention of external pressure, the position of the circuit board is in a relatively stable state.

[0034] In order to facilitate the control of the position of the closing component 7, the abutment block 702 can be brought into contact with the buffer component 3. Figure 3As shown, further, two bending cavities 1011 are provided on the carrier plate 101, and the driving assembly 5 is located in the bending cavity 1011, and then when the driving assembly 5 is in a retracted state, the driving assembly 5 is completely hidden in the bending cavity 1011, wherein the driving assembly 5 includes a connecting rod 501, one end of the connecting rod 501 is hinged to the inner wall of the bending cavity 1011, and the other end of the connecting rod 501 is rotatably provided with a swing rod 503, wherein in order to facilitate the storage of the swing rod 503, and then in this solution, the swing rod 503 is preferably a telescopic rod, and as the swing rod 503 rotates, the cover plate 701 is prompted to move After reaching the supporting plate 101, the length of the swing rod 503 is controlled to shrink, so that the end surface of the cover plate 701 is always in a parallel state with the end surface of the supporting plate 101, ensuring that the abutment block 702 can be in vertical contact with the buffer shell 301, and the end of the swing rod 503 away from the connecting rod 501 is hinged on the closing component 7, and the end of the connecting rod 501 close to the swing rod 503 is rotatably provided with a driving rod 502, and the angle of the connecting rod 501 is controlled by changing the angle and length of the driving rod 502, and the driving rod 502 is used to increase the bearing capacity of the connecting rod 501 to ensure the normal movement of the closing component 7.

[0035] During the use of the circuit board testing device, the driving component 5 is first used to move the closing component 7 away from the detection component 1 to expose the detection cavity 102. At the same time, the controller 8 is operated to adjust the distance between the two rotating disks 403 according to the model of the circuit board to be tested to ensure that the circuit board can be placed on the two stationary plates 404. The telescopic part 401 is then controlled to extend to move the two stationary plates 404 out of the detection cavity 102, thereby facilitating the placement of the circuit board on the stationary plates 404. When the closing component 7 and the clamping component 4 are moved to the target position, the circuit board to be tested is placed on the stationary plates 404.

[0036] When the circuit board is located on the stationary plate 404, the controller 8 is adjusted to make the clamping plate 405 move along the movable groove 4031 toward the end close to the stationary plate 404, ultimately ensuring that the two anti-slip layers 406 can constrain the position of the circuit board, and then control the movement of the driving component 5, shorten the length of the telescopic part 401, and drive the circuit board to move into the detection cavity 102, waiting for the working component 9 to detect the circuit board.

[0037] Furthermore, during the movement process, the controller 8 controls the angle between the swing rod 503 and the connecting rod 501 to change, and controls the length adjustment of the swing rod 503 to move the cover plate 701 to the upper side of the carrier plate 101, and ensure that the cover plate 701 and the opposite end of the carrier plate 101 are in a parallel state. At this time, the circuit board contacts the insulating pad 603 on the protection component 6 as the clamping component 4 moves but is not compressed, that is, the position of the circuit board corresponds to the height of the air hole 1021, thereby maintaining the position of the circuit board unchanged, and controlling the length of the swing rod 503 to shorten, thereby driving the cover plate 701 to move toward the side close to the carrier plate 101.

[0038] When the length of the swing rod 503 begins to shorten, while maintaining the circuit board clamping state, the rotating disk 403 is prompted to rotate, so that the circuit board is deflected in the detection cavity 102, ensuring that the gas generated by the air hole 1021 can act on the circuit board to the maximum extent. At the same time, in order to ensure the safety of the circuit board in the detection cavity 102, the rotation angle of the circuit board in the detection cavity 102 is controlled to be between 20° and 30°. When the abutment block 702 and the buffer shell 301 abut against each other and continue to move, the gas in the cavity 302 is prompted to act on the surface of the circuit board through the air hole 1021, thereby realizing the detection of the welding strength of the welding points on the surface of the circuit board. When the welding points on the circuit board are in a stable state, the welding points will not become loose under the action of the wind force of the air hole 1021. When the welding points on the circuit board are loose or the welding is not tight, the welding points on the circuit board can be removed under the action of the wind force generated by the air hole 1021, thereby realizing the position identification of the welding points on the circuit board.

[0039] It should be noted that the swing rod 503 controls the descending speed of the cover plate 701 , which can meet the gas detection requirements of the air hole 1021 .

[0040] After completing the inspection of the soldering points on the circuit board, the swing rod 503 is not retracted to the shortest point. At this time, the height of the swing rod 503 is maintained unchanged, and the rotating disk 403 is prompted to drive the circuit board to reset the angle, so that the circuit board is parallel to the bottom of the detection cavity 102. At the same time, the telescopic part 401 is controlled to shorten again to compress the insulating pad 603, so that the buffer part 602 spreads along the insulating pad 603, so that the insulating pad 603 and the buffer part 602 support the circuit board, thereby ensuring that the entire area of ​​the circuit board is parallel to the bottom of the detection cavity 102. At the same time, the state of the circuit board in the detection cavity 102 is identified according to the pressure condition of the buffer part 602, that is, when the insulating pad 603 is pressed, the insulating pad 603 and the buffer part 602 are pressed. When the deformation amount of the buffer part 602 around the pad 603 is the same, it means that the circuit board is in a horizontal state in the detection cavity 102 at this time. When the deformation amount of the buffer part 602 around the insulating pad 603 is different, it means that the circuit board is not in a horizontal state in the detection cavity 102. The height of the control adjustment part 601 is adjusted to achieve the height regulation of the insulating pad 603 to ensure the stability of the circuit board during the test, and then control the swing rod 503 to shorten so that the cover plate 701 completely covers the carrier plate 101, and the detection head 902 is used to contact the circuit board to achieve the performance test of the circuit board, and finally upload the test data to the controller 8.

[0041] When the test is completed, the cover plate 701 is moved out by the driving assembly 5, the clamping plate 405 is controlled to move, and the position of the telescopic part 401 is raised, so that the circuit board is moved out of the detection cavity 102, which is convenient for taking out the circuit board. Embodiment 2

[0042] The present invention also includes a testing method implemented by using a circuit board testing device, comprising the following steps: S1, controlling the movement of the sealing component 7 through the driving component 5 to expose the detection cavity 102, and driving the force-bearing plate 402 to rise through the telescopic part 401, so that the static plate 404 moves out of the detection cavity 102; S2, placing the circuit board to be tested on the stationary plate 404, and clamping the circuit board by adjusting the clamping plate 405 through the controller 8; S3, using the controller 8 to control the telescopic part 401 to contract, so that the circuit board moves toward the end close to the detection cavity 102, so that the circuit board contacts the insulating pad 603 but does not compress the buffer part 602; S4, after controlling the driving assembly 5 to move the cover plate 701 to one side of the carrier plate 101, the cover plate 701 is controlled to move toward the side close to the carrier plate 101, and the angle of the circuit board is adjusted by the rotating disk 403; S5, using the abutment block 702 to contact the buffer shell 301 and compress the volume of the cavity 302, so that the gas in the cavity 302 moves out through the air hole 1021 and acts on the circuit board body; S6 , then controlling the angle of the circuit board to reset, prompting the cover plate 701 to cover the carrier plate 101 , and performing a performance test on the circuit board through the detection head 902 . Embodiment 3

[0043] A circuit board testing device is used to complete its application in electronic information engineering. Through the above-mentioned circuit board testing device, it can be ensured that when the circuit board is used in electronic information engineering, the production efficiency can be effectively improved, the cost can be reduced, the product quality can be guaranteed, and the industry standards can be met.

[0044] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board testing device, comprising a detection component (1), characterized in that: The detection component (1) is connected to two drive components (5), and one end of the two drive components (5) away from the detection component (1) is connected to a closing component (7). The detection component (1) comprises a carrier plate (101), and an end of the carrier plate (101) close to the closing component (7) is provided with a detection cavity (102) for placing a circuit board, and two sides of the detection cavity (102) distributed along the length direction are respectively connected to clamping components (4); A buffer component (3) is connected to one end of the detection component (1) close to the sealing component (7), the buffer component (3) comprising a buffer shell (301), a cavity (302) is provided in the buffer shell (301), and the buffer shell (301) is made of elastic material; The detection cavity (102) is also connected to a protection component (6) for mounting the middle portion of the circuit board.

2. The circuit board testing device according to claim 1, characterized in that: The protection component (6) comprises an adjusting portion (601), the adjusting portion (601) being connected to a cavity surface of one side of the detection cavity (102), a buffer portion (602) being connected to a side of the adjusting portion (601) away from the detection cavity (102), an insulating pad (603) being connected to an end of the buffer portion (602) away from the adjusting portion (601), and a buffer cavity (6021) being provided in the buffer portion (602).

3. The circuit board testing device according to claim 2, characterized in that: The height of the protection component (6) is smaller than the depth of the detection cavity (102), and an air hole (1021) is provided on the cavity wall of the detection cavity (102), and the air hole (1021) is communicated with the cavity (302).

4. The circuit board testing device according to claim 1, characterized in that: The closing component (7) comprises a cover plate (701), one end of the cover plate (701) close to the detection component (1) is connected to two abutment blocks (702), and the two abutment blocks (702) can correspond to the positions of the two buffer components (3), and one end of the cover plate (701) close to the detection component (1) is also connected to a working component (9), and the working component (9) is located between the two abutment blocks (702).

5. The circuit board testing device according to claim 4, characterized in that: The working assembly (9) comprises a connecting plate (901), the connecting plate (901) being connected to the cover plate (701), and a detection head (902) for detecting the circuit board being connected to one end of the connecting plate (901) away from the cover plate (701).

6. The circuit board testing device according to claim 4, characterized in that: One end of the cover plate (701) away from the working component (9) is connected to a controller (8), and the controller (8) is used to control the electronic components of the device.

7. The circuit board testing device according to claim 1, characterized in that: The two clamping assemblies (4) each comprise a telescopic portion (401), the telescopic portion (401) being connected to a force-bearing plate (402), the ends of the two force-bearing plates (402) close to each other being respectively connected to a rotating disk (403), a movable groove (4031) being provided in the rotating disk (403), the two ends of the movable groove (4031) being respectively connected to a stationary plate (404) and a clamping plate (405) along the length direction, the clamping plate (405) being slidably connected in the movable groove (4031), and the ends of the stationary plate (404) opposite to the clamping plate (405) being respectively connected to an anti-slip layer (406).

8. The circuit board testing device according to claim 1, characterized in that: The bearing plate (101) is also provided with a bending cavity (1011), and the driving assembly (5) is located in the bending cavity (1011). The driving assembly (5) comprises a connecting rod (501), one end of the connecting rod (501) is hinged to the inner wall of the bending cavity (1011), and the other end of the connecting rod (501) is rotatably provided with a swing rod (503), one end of the swing rod (503) away from the connecting rod (501) is hinged to the closing assembly (7), and one end of the connecting rod (501) close to the swing rod (503) is connected to a driving rod (502).

9. A testing method, performed using the circuit board testing device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, controlling the movement of the sealing component (7) through the driving component (5) to expose the detection cavity (102), and driving the force-bearing plate (402) to rise through the telescopic portion (401), so that the stationary plate (404) moves out of the detection cavity (102); S2, placing the circuit board to be tested on the stationary plate (404), and clamping the circuit board by regulating the clamping plate (405) through the controller (8); S3, using the controller (8) to control the telescopic portion (401) to contract, so that the circuit board moves toward the end close to the detection cavity (102), so that the circuit board contacts the insulating pad (603) but does not compress the buffer portion (602); S4, after controlling the driving assembly (5) to move the cover plate (701) to one side of the carrier plate (101), controlling the cover plate (701) to move toward the side close to the carrier plate (101), and at the same time using the rotating disk (403) to adjust the angle of the circuit board; S5, using the abutment block (702) to contact the buffer shell (301) and compress the volume of the cavity (302), so that the gas in the cavity (302) moves out through the air hole (1021) and acts on the circuit board body; S6. Then, the angle of the circuit board is controlled to be reset, so that the cover plate (701) covers the carrier plate (101), and the performance of the circuit board is tested by the detection head (902).

10. An application of the circuit board testing device according to any one of claims 1 to 8 in electronic information engineering.

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