Method and device for manufacturing solder mask area on surface of Ni layer of copper-clad plate

Abstract

The invention discloses a method and a device for manufacturing a solder mask area on the surface of a Ni layer of a copper-clad plate, and aims to solve the technical problems of low integration level of components and easy introduction of redundant materials during processing due to the fact that the solder mask area cannot be controlled when the surface of the Ni layer of the copper-clad plate is processed in the prior art. According to the method, the copper-clad plate is placed in the resistance welding area auxiliary device to be subjected to two rounds of plasma cleaning, the first round is carried out in the inert atmosphere, the second round is carried out in the oxidizing atmosphere, resistance welding area treatment on the surface of the copper-clad plate and accurate control over the resistance welding area are achieved, and therefore the integration degree of components is improved, and introduction of redundant materials during machining is reduced. The device comprises the baffle plate and the copper-clad plate placing mold, the copper-clad plate is fixed and covers the rest part, and only the solder mask area is exposed in a processing environment, so that the accurate processing of the solder mask area is realized.

Description

Technical Field

[0001] The invention relates to the field of hybrid integrated circuit packaging, and in particular to a method and a device for manufacturing a solder resist area on the surface of a Ni layer of a copper clad plate. Background Art

[0002] The development of high-tech electronic equipment has promoted the development of electronic components towards intelligence, integration, modularization and high reliability. Missile-borne, airborne, satellite-borne and aerospace electronic equipment have put forward increasingly higher requirements for reliability, volume and performance ratio. In order to improve the heat dissipation performance of electronic equipment and reduce the thermal resistance between the internal circuit substrate and the outer shell, such as high-power drive modules, the substrate of the power part of the circuit is often treated differently from the control part. The substrate of the control part can generally be a 96 porcelain thick film process substrate, while the substrate of the power part is generally a copper clad laminate to meet the needs of high current, high power and high thermal conductivity. Copper clad laminates are substrates made of aluminum oxide, aluminum nitride or silicon nitride ceramics, etc., with copper directly clad or brazed on their surface. Generally, the surface of the copper layer will be further plated with Ni to facilitate subsequent component welding and bonding.

[0003] Generally, the copper clad laminate currently used has no solder mask on its surface. During welding and assembly, the solder on its surface spreads uncontrollably, resulting in the components being too close or even close to each other, which does not meet the visual inspection standard, and the solder will occupy the reserved bonding position, resulting in the failure of bonding and the failure of the substrate. Therefore, when designing the copper clad laminate layout, a large space must be reserved between the two welding components and between the solder joints and the bonding wires, which seriously limits the integration of components. There are two existing solder mask methods: surface coating of non-solderable materials and surface processing to remove solderable materials. The solder mask on the surface of an ordinary thick film substrate is formed by coating a glass dielectric material on the surface. For copper clad laminates, the thermal expansion coefficient of the glass dielectric material is quite different from that of the glass dielectric material, and the dielectric material has poor adhesion to the Ni layer surface. There is no mature glass dielectric material that can be applied to its surface for the time being; and the solder mask ink applied to the surface of the PCB substrate does not match the process environment during the assembly of the hybrid integrated circuit and cannot be used. Therefore, there is no mature and widely used solder mask coating material on the surface of the copper clad laminate. The traditional method of removing solderable materials from the surface is generally mechanical processing. For copper-clad laminates, they are easily damaged during mechanical processing, and the Cu layer under the Ni layer is also solderable, so it is not applicable. In recent years, there have been reports on the use of laser processing to remove solderable materials on the surface. This method can achieve solder resistance, but it is highly equipment-dependent, and it is easy to introduce slag excess into the coating surface. In addition, a single area is processed at one time, and the efficiency is relatively low. Therefore, in order to overcome the limitations of existing processing methods and improve the accuracy and efficiency of processing the surface of copper-clad laminates, a new processing method and device are needed. Summary of the invention

[0004] The purpose of the present invention is to provide a method and device for making a solder mask area on the Ni surface of a copper clad laminate, so as to overcome the shortcomings of the prior art that the solder mask area cannot be controlled when processing the Ni layer surface of the copper clad laminate, resulting in low component integration and easy introduction of redundant materials during processing.

[0005] In order to achieve the above object, the present invention adopts the following technical solution: A method for making a solder resist area on the surface of a Ni layer of a copper clad plate comprises the following steps: S1, making a solder mask auxiliary device according to the copper clad board to be processed; S2, assembling and installing the copper clad plate and the auxiliary device of the solder mask area; S3, performing a first round of plasma cleaning on the copper-clad laminate equipped with the solder mask auxiliary device under an inert atmosphere; S4, performing a second round of plasma cleaning on the copper clad laminate equipped with the solder mask auxiliary device in an oxidizing atmosphere.

[0006] Furthermore, the method described in the present invention first designs and manufactures a device for assisting in forming a solder mask area, including a shielding plate and a copper-clad laminate placement mold, thereby ensuring that the cleaning area can be precisely controlled during the subsequent plasma cleaning process, avoiding unnecessary areas from being cleaned, and improving the accuracy of solder mask area production.

[0007] Secondly, the copper clad laminate is correctly placed in the placement mold and covered with a shielding plate in preparation for plasma cleaning. Through physical combination and installation, the copper clad laminate is ensured to be stably positioned during the cleaning process to prevent movement or dislocation during the cleaning process, laying the foundation for the precise production of the solder mask area.

[0008] The first round of plasma cleaning is then carried out in an inert atmosphere (such as argon or nitrogen) to provide a stable physical bombardment environment to remove surface contamination without introducing new chemical reactions, preparing for the second round of plasma cleaning, which is the oxidation step.

[0009] The second round of plasma cleaning is carried out in an oxidizing atmosphere, so that an oxide layer is formed on the surface of the Ni layer in the solder mask area, reducing the solderability of this area, thereby achieving a solder mask effect, effectively controlling the spreading of the solder, preventing bridging and short circuits during welding, and improving the reliability of welding and the stability of the circuit.

[0010] Furthermore, the solder resist area auxiliary device includes a shielding plate and a copper clad laminate placement mold. When the copper clad laminate and the solder resist area auxiliary device are assembled and installed, the copper clad laminate is placed in the copper clad laminate placement mold, and the shielding plate is placed on the copper clad laminate.

[0011] Furthermore, the solder mask auxiliary device processing process includes the following steps: S101, preparing a solder mask design drawing according to the layout of soldered components on the surface of the copper clad board to be processed; S102, designing a copper clad laminate placement mold according to the size of the copper clad laminate, and designing a shielding plate according to the solder mask area of ​​the copper clad laminate; S103, processing a copper clad laminate placement mold and a shielding plate, wherein the copper clad laminate placement mold is provided with a groove for placing the copper clad laminate, and the shielding plate is provided with a solder resist window area for exposing the solder resist area.

[0012] Furthermore, when processing the solder mask auxiliary device, the present invention first determines the specific position and shape of the solder mask area on the copper clad board where it is needed to be made to match the layout of the welding components, ensure the precise design of the solder mask area, meet specific circuit design and welding requirements, and avoid unnecessary areas being soldered, which affects the normal function of the circuit.

[0013] Next, a mold for placing and fixing the copper clad laminate and a shielding plate with a specific window area for covering the copper clad laminate are created. The copper clad laminate placement mold ensures that the copper clad laminate is stably placed during the plasma cleaning process, while the shielding plate ensures that only the predetermined solder mask area is exposed for subsequent cleaning and oxidation treatment.

[0014] Then the actual manufacturing of the copper clad laminate placement mold and the shield plate is carried out to meet the design specifications and functional requirements. The processed mold and shield plate can accurately fix the copper clad laminate and control the range of plasma cleaning to ensure the accurate formation of the solder mask area.

[0015] After a series of processing, a copper clad laminate placement mold with grooves for placing copper clad laminates can be obtained to ensure that the copper clad laminates will not move during the cleaning process and maintain accurate positioning; and a shielding plate with solder mask openings to expose the solder mask area can ensure that only these specific areas are plasma cleaned to form a solder mask layer. Through precise design and processing, it is ensured that the solder mask layer is only formed in the required area to avoid negative impact on circuit performance. At the same time, the standardized mold and shielding plate design allows the production of solder mask areas to be carried out quickly and repeatedly, improving production efficiency. Accurate solder mask area production helps to improve welding quality and reduce welding defects, thereby improving the performance and reliability of the final product. In addition, the processing process can be adjusted according to different copper clad laminate sizes and component layouts. It has good flexibility and adaptability and is suitable for a variety of different products and application scenarios.

[0016] A device for making a solder mask on the surface of a Ni layer of a copper clad laminate. The device can be used as a solder mask auxiliary device in the above method. The device includes a shielding plate and a copper clad laminate placement mold. The shielding plate is used to cover the copper clad laminate, and the solder mask window area thereon is exposed to expose the part that needs to be solder masked, so as to control the range of plasma cleaning, and ensure that only the designated area is subjected to plasma cleaning to form a solder mask, while other areas remain in their original state. The copper clad laminate placement mold is used to fix and support the copper clad laminate, ensure the stable position of the copper clad laminate during the plasma cleaning process, provide precise positioning of the copper clad laminate during the cleaning process, and improve the consistency and repeatability of cleaning. The copper clad laminate can be placed in the copper clad laminate placement mold, and the shielding plate covers the copper clad laminate, and the solder mask window area is provided on the shielding plate.

[0017] Furthermore, the copper clad laminate placement mold is provided with a notch, which is convenient for operators to pick up and place the copper clad laminate, improve the convenience of operation, and reduce possible errors or damages during operation. The notch is a part of the copper clad laminate placement mold, and is integrally formed with the copper clad laminate placement mold or processed separately after the copper clad laminate placement mold is processed.

[0018] Furthermore, the copper clad laminate placement mold is provided with a plurality of copper clad laminate placement locations, allowing for simultaneous processing of a plurality of copper clad laminates, thereby reducing the time and equipment required for processing each laminate individually, thereby reducing the processing cost of a single product and ensuring that each copper clad laminate receives the same processing conditions during the plasma cleaning process, which helps to maintain process consistency between different products.

[0019] Furthermore, the solder mask opening area is designed according to the layout of the chip on the surface of the copper clad laminate. The solder mask opening area exposes the portion of the copper clad laminate that needs to be solder masked, and the shielding plate is the same size as the copper clad laminate, and is physically placed and fixed to control the precise area of ​​plasma cleaning, ensuring that only the Ni layer surface in the window area is oxidized.

[0020] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention provides a method for making a solder mask on the surface of the Ni layer of a copper clad laminate. The method uses plasma cleaning to perform deep oxidation treatment on the solder mask set on the surface of the copper clad laminate before assembly. During cleaning, an inert atmosphere is first used to remove the existing possible contamination on the surface of the Ni layer of the copper clad laminate by physical bombardment, and then an active atmosphere is used for plasma cleaning, so that the Ni layer on the surface of the solder mask is oxidized and the solderability is deteriorated, thereby achieving the effect of solder mask controlling the spread of solder. The method of the present invention uses plasma cleaning technology to make a solder mask on the surface of the Ni layer of the copper clad laminate, effectively overcoming the problem of low component integration caused by the inability to accurately control the solder mask in the prior art. This method can accurately form a solder mask in a set area, thereby reducing the design spacing requirements between components and improving the integration of components. In addition, the plasma cleaning technology avoids the problem of easy damage to the copper clad laminate and the introduction of excess materials in the traditional mechanical processing process, ensures the cleanliness and flatness of the processing surface, and improves the circuit assembly yield rate. By performing plasma cleaning twice in an inert atmosphere and an oxidizing atmosphere, this method not only improves the welding quality, but also effectively isolates the problem of poor electrical performance of the electrical equipment due to environmental conditions over a long period of time, thereby enhancing the reliability and thermal management capabilities of electronic components.

[0021] The present invention provides a device for making a solder mask on the surface of the Ni layer of a copper clad laminate, which provides an accurate and efficient solution for making the solder mask on the surface of the Ni layer of the copper clad laminate. The design of the device described in the present invention makes the placement and fixation of the copper clad laminate simple and quick, reducing the complexity of operation and the possibility of error. By setting multiple placement locations on the copper clad laminate placement mold, the device can process multiple copper clad laminates at the same time, significantly improving the efficiency and production capacity of the production line. In addition, the position and shape of the solder mask are accurately controlled, and the device improves the accuracy of processing, ensuring that the solder mask processing of each copper clad laminate can meet the same quality standards, and improving the consistency and reliability of the product. The flexibility and adaptability of the device are also very strong, and can be adjusted according to different copper clad laminate sizes and component layouts, so that it is suitable for a variety of different products and application scenarios. Through these designs, the device not only reduces the processing cost, but also improves the market competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The present invention is a schematic flow chart of a method for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to an embodiment of the present invention.

[0023] Figure 2 The present invention is a schematic diagram of the manufacturing process of a solder resist auxiliary device in a method for manufacturing a solder resist on the surface of a Ni layer of a copper clad laminate in an embodiment of the present invention.

[0024] Figure 3 The present invention is a schematic diagram of a shielding plate structure in a device for making a solder resist area on the surface of a Ni layer of a copper-clad laminate in an embodiment of the present invention.

[0025] Figure 4 The present invention is a schematic diagram of a copper clad laminate placement mold structure in a device for making a solder resist area on the Ni layer surface of a copper clad laminate in an embodiment of the present invention.

[0026] In the figure, 1 is copper clad laminate, 2 is chip on the surface of copper clad laminate, 3 is shielding plate, 4 is solder mask window area, 5 is mold for placing copper clad laminate, and 6 is gap. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0031] Embodiment 1: like Figure 1The figure is a schematic flow chart of a method for making a solder resist area on the surface of a Ni layer of a copper-clad laminate in a specific embodiment of the present invention, wherein the method comprises the following steps: S1, making a solder mask auxiliary device according to the copper clad board to be processed; S2, assembling and installing the copper clad plate and the auxiliary device of the solder mask area; S3, performing a first round of plasma cleaning on the copper-clad laminate equipped with the solder mask auxiliary device under an inert atmosphere; S4, performing a second round of plasma cleaning on the copper clad laminate equipped with the solder mask auxiliary device in an oxidizing atmosphere.

[0032] Preferably, in this specific embodiment, a device for assisting in forming a solder mask area is first designed and manufactured, including a shielding plate and a copper-clad laminate placement mold, to ensure that the cleaning area can be accurately controlled during the subsequent plasma cleaning process, avoiding unnecessary areas from being cleaned, and improving the accuracy of solder mask area manufacturing.

[0033] Secondly, the copper clad laminate is correctly placed in the placement mold and covered with a shielding plate in preparation for plasma cleaning. Through physical combination and installation, the copper clad laminate is ensured to be stably positioned during the cleaning process to prevent movement or dislocation during the cleaning process, laying the foundation for the precise production of the solder mask area.

[0034] Then, an inert gas (such as argon or nitrogen) is used to perform the first round of plasma cleaning. In this embodiment, nitrogen is used to perform the first round of plasma cleaning on the surface of the copper clad laminate to provide a stable physical bombardment environment to remove surface contamination without introducing new chemical reactions, thereby preparing for the second round of plasma cleaning, i.e., the oxidation step.

[0035] The second round of plasma cleaning is carried out in an oxidizing gas. In this embodiment, oxygen is used to form an oxide layer on the surface of the Ni layer in the solder resist area, reducing the solderability of the area, thereby achieving a solder resist effect, effectively controlling the spreading of the solder, preventing bridging and short circuits during welding, and improving the reliability of welding and the stability of the circuit.

[0036] Preferably, the solder resist area auxiliary device in this embodiment includes a shielding plate and a copper clad laminate placement mold. When the copper clad laminate and the solder resist area auxiliary device are combined and installed, the copper clad laminate is placed in the copper clad laminate placement mold, and the shielding plate is placed on the copper clad laminate.

[0037] like Figure 2 As shown, the solder mask auxiliary device processing process includes the following steps: S101, preparing a solder mask design drawing according to the layout of soldered components on the surface of the copper clad board to be processed; S102, designing a copper clad laminate placement mold according to the size of the copper clad laminate, and designing a shielding plate according to the solder mask area of ​​the copper clad laminate; S103, processing a copper clad laminate placement mold and a shielding plate, wherein the copper clad laminate placement mold is provided with a groove for placing the copper clad laminate, and the shielding plate is provided with a solder resist window area for exposing the solder resist area.

[0038] Preferably, in this specific embodiment, the specific position and shape of the solder mask area on the copper clad laminate where it is needed is first determined to match the layout of the welding components, ensure the precise design of the solder mask area, meet specific circuit design and welding requirements, and avoid unnecessary areas being soldered, which affects the normal function of the circuit.

[0039] Next, a mold for placing and fixing the copper clad laminate and a shielding plate with a specific window area for covering the copper clad laminate are created. The copper clad laminate placement mold ensures that the copper clad laminate is stably placed during the plasma cleaning process, while the shielding plate ensures that only the predetermined solder mask area is exposed for subsequent cleaning and oxidation treatment.

[0040] Then the actual manufacturing of the copper clad laminate placement mold and the shield plate is carried out to meet the design specifications and functional requirements. The processed mold and shield plate can accurately fix the copper clad laminate and control the range of plasma cleaning to ensure the accurate formation of the solder mask area.

[0041] After a series of processing, a copper clad laminate placement mold with grooves for placing copper clad laminates can be obtained to ensure that the copper clad laminates will not move during the cleaning process and maintain accurate positioning; and a shielding plate with solder mask openings to expose the solder mask area can ensure that only these specific areas are plasma cleaned to form a solder mask layer. Through precise design and processing, it is ensured that the solder mask layer is only formed in the required area to avoid negative impact on circuit performance. At the same time, the standardized mold and shielding plate design allows the production of solder mask areas to be carried out quickly and repeatedly, improving production efficiency. Accurate solder mask area production helps to improve welding quality and reduce welding defects, thereby improving the performance and reliability of the final product. In addition, the processing process can be adjusted according to different copper clad laminate sizes and component layouts. It has good flexibility and adaptability and is suitable for a variety of different products and application scenarios.

[0042] Embodiment 2: like Figure 3 to Figure 4The present invention is shown as a specific embodiment, which provides a device for making a solder resist area on the surface of the Ni layer of a copper clad laminate. The device can be used as the solder resist area auxiliary device in the method for making a solder resist area on the surface of the Ni layer of a copper clad laminate described in Example 1. The device includes a shielding plate 3 and a copper clad laminate placement mold 5. The shielding plate 3 is used to cover the copper clad laminate 1, and the solder resist window area 4 thereon is exposed to the part that needs to be solder resisted, so as to control the range of plasma cleaning, ensure that only the designated area is subjected to plasma cleaning to form a solder resist area, and other areas remain in their original state. The copper clad laminate placement mold 5 is used to fix and support the copper clad laminate 1, ensure the stable position of the copper clad laminate during the plasma cleaning process, provide accurate positioning of the copper clad laminate during the cleaning process, and improve the consistency and repeatability of cleaning. The copper clad laminate 1 can be placed in the copper clad laminate placement mold 5, and the shielding plate 3 covers the copper clad laminate 1, and the shielding plate 3 is provided with a solder resist window area 4.

[0043] Preferably, the copper clad laminate 1 placement position of the copper clad laminate placement mold 5 described in this embodiment is provided with a notch 6, which is convenient for operators to pick up and place the copper clad laminate 1, improves the convenience of operation, and reduces the errors or damages that may be caused during the operation. The notch 6 is a part of the copper clad laminate placement mold 5, and is integrally formed with the copper clad laminate placement mold 5 or is processed separately after the copper clad laminate placement mold 5 is processed.

[0044] Preferably, the copper clad laminate placement mold 5 described in this embodiment is provided with a plurality of copper clad laminate 1 placement locations, allowing for simultaneous processing of multiple copper clad laminates, reducing the time and equipment required for processing each laminate individually, reducing the processing cost of a single product while ensuring that each copper clad laminate receives the same processing conditions during the plasma cleaning process, which helps to maintain process consistency between different products.

[0045] Preferably, the solder mask opening area 4 in this embodiment is designed according to the layout of the chip 2 on the surface of the copper clad board. The solder mask opening area 4 exposes the portion of the copper clad board 1 that needs to be solder masked, and the shielding plate 3 is the same size as the copper clad board 1, and is physically placed and fixed to control the precise area of ​​plasma cleaning, ensuring that only the Ni layer surface in the window area is oxidized.

[0046] Embodiment 3: This specific embodiment provides a specific application scenario of a method and device for making a solder mask area on the surface of the Ni layer of a copper clad laminate. First, engineers use CAD software to design the solder mask area design drawing and the copper clad laminate placement mold 5 drawing according to the size of the copper clad laminate 1 and the layout of the chip 2 on the surface of the copper clad laminate. Then, suitable materials are selected to make the baffle plate 3 and the copper clad laminate placement mold 5, wherein the baffle plate 3 is processed with a ceramic material that is chemically stable and wear-resistant, high-temperature resistant, and corrosion-resistant, and the baffle plate 3 needs to remain flat after processing; the copper clad laminate placement mold 5 is processed with an aluminum alloy material with good mechanical strength to ensure that the baffle plate 3 and the copper clad laminate placement mold 5 can cover the rest of the copper clad laminate 1 during the solder mask area processing.

[0047] Use a laser cutting machine to process the copper clad laminate placement mold and shielding plate according to the design drawing to ensure that the solder mask opening area on the shielding plate accurately corresponds to the position where the solder mask area needs to be made on the copper clad laminate. Then, the processed copper clad laminate placement mold 5 and shielding plate 3 are surface treated to ensure their durability and corrosion resistance during the plasma cleaning process. Perform a preliminary assembly test on the shielding plate 3, copper clad laminate placement mold 5 and copper clad laminate 1 to ensure that the shielding plate 3 and copper clad laminate placement mold 5 can stably fix the copper clad laminate 1, and that the shielding plate 3 correctly covers the predetermined solder mask area.

[0048] Place the copper clad laminate 1 on the placement position on the copper clad laminate placement mold 5, ensure that the copper clad laminate 1 is flat and accurately positioned, then place the shielding plate 3 on the copper clad laminate 1, and ensure that the solder mask opening area 4 of the shielding plate 3 is aligned with the solder mask area on the copper clad laminate 1. After the installation is completed, put the entire device into a plasma cleaning machine for two rounds of plasma cleaning. First, perform the first round of cleaning in an inert atmosphere to remove surface impurities, and then perform the second round of cleaning in an oxidizing atmosphere (such as oxygen) to form an oxide layer in the solder mask area.

[0049] After the solder mask treatment is completed, the copper clad board 1 will be sent to the next process for drilling and electroplating, followed by a series of processes such as assembly, packaging, and testing.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for making a solder resist area on the surface of a Ni layer of a copper clad laminate, characterized in that: The following steps are involved: S1, making a solder mask auxiliary device according to the copper clad board to be processed; S2, assembling and installing the copper clad plate and the auxiliary device of the solder mask area; S3, performing a first round of plasma cleaning on the copper-clad laminate equipped with the solder mask auxiliary device under an inert atmosphere; S4, performing a second round of plasma cleaning on the copper clad laminate equipped with the solder mask auxiliary device in an oxidizing atmosphere.

2. The method for making a solder resist on the surface of a Ni layer of a copper clad laminate according to claim 1, characterized in that: The solder resist area auxiliary device includes a shielding plate and a copper clad laminate placement mold. When the copper clad laminate and the solder resist area auxiliary device are assembled and installed, the copper clad laminate is placed in the copper clad laminate placement mold, and the shielding plate is placed on the copper clad laminate.

3. The method for making a solder resist on the surface of a Ni layer of a copper clad laminate according to claim 2, characterized in that: The solder mask auxiliary device processing process comprises the following steps: S101, preparing a solder mask design drawing according to the layout of components to be soldered on the surface of the copper clad laminate to be processed; S102, designing a copper clad laminate placement mold according to the size of the copper clad laminate, and designing a shielding plate according to the solder mask area of ​​the copper clad laminate; S103, processing a copper clad laminate placement mold and a shielding plate, wherein the copper clad laminate placement mold is provided with a groove for placing the copper clad laminate, and the shielding plate is provided with a solder resist window area for exposing the solder resist area.

4. The method for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 1, characterized in that: The inert atmosphere is argon or nitrogen.

5. The method for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 1, characterized in that: The oxidizing atmosphere is oxygen.

6. A device for making a solder resist area on the surface of a Ni layer of a copper clad laminate, characterized in that: The device comprises a shielding plate (3) and a copper-clad laminate placement mold (5), wherein a copper-clad laminate (1) can be placed in the copper-clad laminate placement mold (5), the shielding plate (3) covers the copper-clad laminate (1), and a solder resist window area (4) is provided on the shielding plate (3).

7. The device for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 6, characterized in that: A notch (6) is provided at the copper-clad laminate (1) placement position of the copper-clad laminate placement mold (5).

8. The device for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 6, characterized in that: The copper clad laminate placement mold (5) is provided with a plurality of copper clad laminate (1) placement locations.

9. The device for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 6, characterized in that: The solder resist window area (4) is designed according to the layout of the chip (2) on the surface of the copper clad laminate.

10. The device for making a solder resist area on the surface of a Ni layer of a copper clad laminate according to claim 6, characterized in that: The solder resist window area (4) exposes the portion of the copper clad laminate (1) that needs to be solder resisted, and the shielding plate (3) is the same size as the copper clad laminate (1).

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