Highly integrated 2.5 D packaging structure and method

Abstract

The invention relates to the technical field of semiconductor devices, in particular to a highly-integrated 2.5 D packaging structure and method, and the structure comprises a supporting frame structure, a carrier plate, and an auxiliary structure. A chip is arranged on the front surface of the carrier plate, and a bonding wire is arranged between the chip and the carrier plate; a component is arranged on the back surface of the carrier plate, the carrier plate is arranged in an inner cavity of the supporting frame structure, a solder ball is arranged at the bottom end of the supporting frame structure, and an auxiliary structure is arranged in the supporting frame structure; surface mounting is mainly carried out on the back surface of the carrier plate, so that functional devices can be concentrated on one carrier plate to work, the space utilization rate is improved, and more components are added; and moreover, the auxiliary structure has an auxiliary heat dissipation effect on the packaging structure, and convenience is provided for the installation work of the packaging structure through the connecting assembly arranged in the auxiliary structure.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a highly integrated 2.5D packaging structure and method. Background Art

[0002] The existing document with announcement number CN118866828A discloses a 2.5D packaging structure and a 2.5D packaging method, which includes multiple support structures, a second substrate and multiple chips. Each support structure includes a first substrate and a conductive column. The conductive column runs through the first substrate and protrudes from both sides of the first substrate respectively. Multiple support structures are electrically connected to the second substrate; there is a gap between adjacent support structures; multiple chips are stacked and electrically connected to the conductive columns of the support structure. By setting gaps between the support structures, it is beneficial for the bottom filler to be dispersed onto the second substrate, reducing the amount of bottom filler accumulated at the bottom of the chip, and reducing the impact of colloid stress on the chip.

[0003] In the existing packaging, high-integration packaging only mounts chips, components and some functional devices on one side of the substrate. As the functions of the product increase, the functional devices required on the substrate also become more and more numerous. In the existing structure, most packaging products are only structures with single functions. Different functional chips may require several packaging types to support them. If more components are set on a carrier board, the internal heat will be higher when working, and there is a lack of suitable heat dissipation structure to ensure its normal use. The existing high-integration structure lacks suitable auxiliary structure to meet its heat dissipation and installation requirements.

[0004] To this end, the present invention proposes a highly integrated 2.5D packaging structure and method for solving the above-mentioned problems. Summary of the invention

[0005] The object of the present invention is to provide a highly integrated 2.5D packaging structure and method to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a highly integrated 2.5D packaging structure, comprising a support frame structure, a carrier board and an auxiliary structure;

[0007] A chip is arranged on the front side of the carrier board, and a bonding wire is arranged between the chip and the carrier board;

[0008] Components are arranged on the back of the carrier board, the carrier board is arranged in the inner cavity of the support frame structure, solder balls are arranged at the bottom end of the support frame structure, and an auxiliary structure is arranged in the support frame structure.

[0009] Preferably, the auxiliary structure includes a through frame bar, a first heat dissipation hole, an installation cavity, a connecting assembly and a heat dissipation auxiliary component; the through frame bar is arranged through the supporting frame structure, and the side walls of the through frame bar are evenly provided with the first heat dissipation holes, and the two ends of the through frame bar are penetrated with installation cavities.

[0010] Preferably, both ends of the through-frame strip extend outwards in the supporting frame structure, and the outwardly extending portion of the through-frame strip is connected to the heat dissipation auxiliary component.

[0011] Preferably, a connecting component is provided in the installation cavity, and the connecting component includes a mounting strip frame, a second heat dissipation hole, a limiting frame strip, a threaded hole and a positioning screw; the side wall of the mounting strip frame is equidistantly provided with a second heat dissipation hole, and threaded holes are provided at both end side positions of the mounting strip frame, and the threaded holes are threadedly connected to the positioning screws.

[0012] Preferably, a limit frame strip is fixedly arranged at one end of the installation strip frame.

[0013] Preferably, an auxiliary knob is fixedly provided on one end of the positioning screw.

[0014] Preferably, the heat dissipation auxiliary component includes a connecting side groove, an auxiliary mesh hole, a connecting thread groove, a heat conducting plate, a mounting hole, a connecting screw and a contact pin; the connecting side groove is symmetrically arranged on both sides of the through-frame bar, and a connecting thread groove is arranged in the connecting side groove, one side of the heat conducting plate is adapted to be clamped in the connecting side groove, and a mounting hole is arranged on the heat conducting plate, and the connecting screw passes through the mounting hole and is threadedly connected to the connecting thread groove.

[0015] Preferably, auxiliary mesh holes are evenly spaced in the connecting side grooves, and the auxiliary mesh holes are connected to the inner cavity that penetrates the frame strip.

[0016] Preferably, a contact pin is provided at the bottom end of the heat conducting sheet.

[0017] A method for a highly integrated 2.5D packaging structure, the method comprising:

[0018] Component 5 mounting - chip 3 mounting - wire 4 welding - plastic sealing - back side chip mounting / device mounting - ball planting - plastic sealing - grinding - laser - reflow - printing - packaging - shipment.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The 2.5D packaging structure and the corresponding packaging method designed by the present invention are mainly mounted on the back side of a carrier board, so that functional devices can be concentrated on one carrier board to work, improve space utilization, and add more components; in addition, the auxiliary structure provided has an auxiliary heat dissipation effect on the packaging structure, and the connection components provided therein provide convenience for the installation of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the front side of the 2.5D packaging structure of the present invention;

[0022] Figure 2 For the present invention Figure 1 A magnified schematic diagram of the local structural connection;

[0023] Figure 3 This is a schematic diagram of the front bottom side of the 2.5D packaging structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the rear side of the 2.5D packaging structure of the present invention;

[0025] Figure 5 For the present invention Figure 4 A magnified schematic diagram of the local structural connection;

[0026] Figure 6 It is a schematic diagram of the internal plane of the packaging structure of the present invention;

[0027] Figure 7 This is a schematic diagram of the front side of the auxiliary structure connection of the present invention;

[0028] Figure 8 For the present invention Figure 7 A magnified schematic diagram of the local structural connection;

[0029] Fig. 9 This is a schematic diagram of the auxiliary structure connection tail side of the present invention;

[0030] Fig.10 For the present invention Fig. 9 A magnified schematic diagram of the local structural connection;

[0031] Fig.11 It is a schematic diagram of the packaging process of the packaging structure of the present invention.

[0032] In the figure: support frame structure 1, carrier board 2, chip 3, welding wire 4, component 5, solder ball 6, through frame bar 701, first heat dissipation hole 702, mounting cavity 703, mounting bar frame 801, second heat dissipation hole 802, limiting frame bar 803, threaded hole 804, positioning screw 805, connecting side groove 901, auxiliary mesh hole 902, connecting threaded groove 903, heat conductive sheet 904, mounting hole 905, connecting screw 906, contact foot 907. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention are described clearly and completely below. The embodiments of the present invention and all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0034] Example 1: Please refer to Figure 1-Figure 11 , a highly integrated 2.5D packaging structure, comprising a support frame structure 1, a carrier board 2 and an auxiliary structure;

[0035] A chip 3 is arranged on the front side of the carrier 2, and a welding wire 4 is arranged between the chip 3 and the carrier 2; components 5 are arranged on the back side of the carrier 2, the carrier 2 is arranged in the inner cavity of the support frame structure 1, a solder ball 6 is arranged at the bottom end of the support frame structure 1, and an auxiliary structure is arranged in the support frame structure 1.

[0036] Component 5 mounting - chip 3 mounting - wire 4 welding - plastic sealing - back side chip mounting / component mounting - ball planting - plastic sealing - grinding - laser - reflow - printing - packaging - shipment; wherein chip 3 is arranged on the upper surface of carrier 2, which is a functional chip or a power chip; here multiple chips can be stacked on the functional chip, and chip 3 is connected to carrier 2 with copper wire; component 5 is on the lower surface of carrier 2; solder ball 6 is connected to component 5, and after ball planting, the product is plastic sealed to form a protective layer for the device on the lower surface of carrier 2.

[0037] The present invention is mounted on the back side of the carrier 2, so that the functional devices can be concentrated on one carrier to work, improve space utilization, and add more components 5; furthermore, the auxiliary structure provided has an auxiliary heat dissipation effect on the packaging structure, and the connection components provided therein facilitate the installation of the packaging structure.

[0038] Example 2: Based on Example 1, please refer to Figure 1-Figure 8 The auxiliary structure here includes a through frame bar 701, a first heat dissipation hole 702, a mounting cavity 703, a connection component and a heat dissipation auxiliary component; the through frame bar 701 is arranged through the support frame structure 1, and the side wall of the through frame bar 701 is evenly provided with the first heat dissipation hole 702, and the two ends of the through frame bar 701 are arranged through the mounting cavity 703; here, the two ends of the through frame bar 701 extend outward in the support frame structure 1, and the outward extending part of the through frame bar 701 is connected to the heat dissipation auxiliary component.

[0039] Here, a connection component is arranged in the installation cavity 703, and the connection component includes a mounting strip frame 801, a second heat dissipation hole 802, a limit frame strip 803, a threaded hole 804 and a positioning screw 805; the side wall of the mounting strip frame 801 is equidistantly provided with the second heat dissipation holes 802, and the two end sides of the mounting strip frame 801 are provided with threaded holes 804, and the threaded holes 804 are threadedly connected with the positioning screw 805; wherein the limit frame strip 803 is fixedly provided at one end of the mounting strip frame 801; wherein an auxiliary knob is fixedly provided at one end of the positioning screw 805.

[0040] By penetrating the through frame strip 701 in the support frame structure 1 and setting the first heat dissipation hole 702 on the through frame strip 701, and further by setting the installation strip frame 801 in the through frame strip 701 and setting the second heat dissipation hole 802 on the installation strip frame 801, an auxiliary heat dissipation effect is provided for the interior of the support frame structure 1. The purpose of setting the positioning screws 805 at both ends of the installation strip frame 801 is that when the packaging structure is installed, that is, when the packaging structure is installed with the circuit board substrate, a threaded hole compatible with the positioning screw 805 can be set at the installation point of the circuit board substrate, and the packaging structure is positioned by connecting the positioning screw 805 with the threaded hole, that is, when the packaging structure is installed, a pre-positioning effect is provided, which avoids the problem of position displacement of the packaging structure during the welding process, and has a positive effect on improving the quality of its installation work.

[0041] Furthermore, the positioning screws 805 provide a pre-positioning for the overall packaging structure and can also position the installation bar frame 801 so that the installation bar frame 801 can be disassembled.

[0042] Example 3: Based on Example 2, please refer to Figure 9-10 The heat dissipation auxiliary components here include a connecting side groove 901, an auxiliary mesh hole 902, a connecting thread groove 903, a heat conductive sheet 904, a mounting hole 905, a connecting screw 906 and a contact foot 907; the connecting side groove 901 is symmetrically arranged on both sides of the through-frame strip 701, and a connecting thread groove 903 is arranged in the connecting side groove 901, one side of the heat conductive sheet 904 is adapted to be stuck in the connecting side groove 901, and a mounting hole 905 is arranged on the heat conductive sheet 904, and a connecting screw 906 passes through the mounting hole 905 and is threadedly connected to the connecting thread groove 903; here, auxiliary mesh holes 902 are equidistantly arranged in the connecting side groove 901, and the auxiliary mesh holes 902 are connected to the inner cavity of the through-frame strip 701; a contact foot 907 is arranged at the bottom end of the heat conductive sheet 904.

[0043] In this embodiment, the heat conductive sheet 904 is mainly used to provide an auxiliary effect on its heat dissipation, that is, the heat conductive sheet 904 is fixedly connected to the through-frame strip 701 by connecting screws 906, and an auxiliary mesh 902 is provided in the connecting edge groove 901, so that the heat inside the through-frame strip 701 can better contact with the heat conductive sheet 904, so that the heat conductive sheet 904 transfers the heat out, wherein a contact pin 907 is provided at the bottom end of the heat conductive sheet 904, which can also be used in conjunction with a cooling copper plate provided on the circuit board, and the contact pin 907 is in contact with the cooling copper plate to further improve its heat dissipation effect.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A highly integrated 2.5D packaging structure, characterized in that: It comprises a supporting frame structure (1), a carrier plate (2) and an auxiliary structure; A chip (3) is arranged on the front side of the carrier board (2), and a welding wire (4) is arranged between the chip (3) and the carrier board (2); Components (5) are arranged on the back of the carrier board (2), the carrier board (2) is arranged in the inner cavity of the support frame structure (1), solder balls (6) are arranged at the bottom end of the support frame structure (1), and an auxiliary structure is arranged in the support frame structure (1).

2. The highly integrated 2.5D packaging structure according to claim 1, characterized in that: The auxiliary structure comprises a through frame strip (701), a first heat dissipation hole (702), a mounting cavity (703), a connection assembly and a heat dissipation auxiliary component; the through frame strip (701) is arranged through the support frame structure (1), and the side wall of the through frame strip (701) is evenly provided with the first heat dissipation hole (702), and the two ends of the through frame strip (701) are arranged through the mounting cavity (703).

3. The highly integrated 2.5D packaging structure according to claim 2, characterized in that: Both ends of the through-frame strip (701) extend outwards in the supporting frame structure (1), and the outwardly extending portion of the through-frame strip (701) is connected to a heat dissipation auxiliary component.

4. The highly integrated 2.5D packaging structure according to claim 2, characterized in that: A connection assembly is arranged in the installation cavity (703), and the connection assembly comprises an installation strip frame (801), a second heat dissipation hole (802), a limit frame strip (803), a threaded hole (804) and a positioning screw (805); the side wall of the installation strip frame (801) is equidistantly provided with the second heat dissipation holes (802), and the two end sides of the installation strip frame (801) are provided with threaded holes (804), and the threaded holes (804) are threadedly connected with the positioning screw (805).

5. The highly integrated 2.5D packaging structure according to claim 4, characterized in that: A limit frame strip (803) is fixedly disposed at one end of the installation strip frame (801).

6. The highly integrated 2.5D packaging structure according to claim 4, characterized in that: An auxiliary knob is fixedly disposed on one end of the positioning screw (805).

7. The highly integrated 2.5D packaging structure according to claim 2, characterized in that: The heat dissipation auxiliary component comprises a connecting side groove (901), an auxiliary mesh hole (902), a connecting thread groove (903), a heat conducting sheet (904), a mounting hole (905), a connecting screw (906) and a contact foot (907); the connecting side groove (901) is symmetrically arranged on both sides of the through-frame strip (701), and a connecting thread groove (903) is arranged in the connecting side groove (901); one side of the heat conducting sheet (904) is adapted to be clamped in the connecting side groove (901), and a mounting hole (905) is arranged on the heat conducting sheet (904); the connecting screw (906) passes through the mounting hole (905) and is threadedly connected to the connecting thread groove (903).

8. The highly integrated 2.5D packaging structure according to claim 7, characterized in that: Auxiliary mesh holes (902) are arranged at equal intervals in the connecting side groove (901), and the auxiliary mesh holes (902) are connected to the inner cavity that penetrates the frame strip (701).

9. The highly integrated 2.5D packaging structure according to claim 7, characterized in that: A contact pin (907) is provided at the bottom end of the heat conducting sheet (904).

10. A method for a highly integrated 2.5D packaging structure according to any one of claims 1 to 9, characterized in that: The method is: Components (5) mounting - chips (3) mounting - wire bonding (4) welding - plastic sealing - back side chip mounting / mounting components - ball planting - plastic sealing - grinding - laser - reflow - printing - packaging - shipment.

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