Articles containing enclosed compositions
A technology of composition and liquid composition, applied in the field of products containing encapsulated composition, can solve problems such as the influence of leakage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment I
[0088] Use a cylindrical mold with a diameter of 10 mm and a depth of 8 mm. There is a rubber layer 0.5 mm thick on the peripheral edge of the mould. There are holes in the mold material which allow a vacuum to be applied to the mold. A piece of Chris-Craft M-8630 or CXP4087 film was placed on top of the mold and secured. Applying vacuum draws the film inside the mold and pulls the film flush with the inner surface of the mold. Composition B or D (see below) is poured into the mold, preferably in such an amount as to nearly or completely fill the mold. Then, another sheet of the same film substance was placed over the mold and sealed to the first by applying a flat ring piece heated at medium pressure over a rubber ring at the edge of the mold to seal the two sheets together. Heat seal together to form a second pouch.
[0089] Use another cylindrical mold with a diameter of 45 mm and a depth of 25 mm. There is a 1.0 mm thick layer of rubber around the peripheral edge of t...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com