Electronic device
By electrically connecting the sensing structure to the first circuit board through the second circuit board in the electronic device, the problem of the large area of the vibration sensor occupying the motherboard is solved, further miniaturization of the electronic device and the improvement of the sensitivity and measurement range of the vibration sensor are achieved.
Patent Information
- Application Number
- CN202420644874.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-29
AI Technical Summary
Vibration sensors in existing electronic devices occupy a large area of the motherboard, which leads to the inability to further reduce the area of the motherboard, affecting the miniaturization of the equipment and user experience.
By electrically connecting the sensing structure to the first circuit board through the second circuit board, the wiring space on the first circuit board is saved, and the electronic device is further miniaturized.
The area of the first circuit board is effectively reduced, further miniaturization of electronic equipment is achieved, and the sensitivity and measurement range of the vibration sensor are improved.
Smart Images
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Abstract
Description
Technical Field
[0001] The present application relates to the field of sensor technology, and in particular to an electronic device. Background Art
[0002] The vibration sensor in an electronic device generally includes a vibration structure and a sensing structure. When the vibration structure vibrates, the sensing structure recognizes the vibration of the vibration structure and converts the vibration signal into an electrical signal to extract characteristic information about the vibration. At present, since the vibration sensor occupies a large area of the motherboard of the electronic device, the area of the motherboard cannot be further reduced, and the electronic device cannot be further miniaturized, which affects the user experience. Utility Model Content
[0003] An embodiment of the present application provides an electronic device that can save wiring space on the first circuit board by electrically connecting a sensing structure to the first circuit board through a second circuit board, so that the area of the first circuit board can be further reduced, thereby further miniaturizing the electronic device.
[0004] In a first aspect, the present application provides an electronic device, comprising a first circuit board, a vibration component, a sensor component and a functional device. The first circuit board is provided with a first airway, and the first airway penetrates the first circuit board along the thickness direction of the first circuit board. The vibration component is mounted on one side of the first circuit board, the vibration component comprises a vibration structure and a first shell, the vibration structure is mounted on the first shell, and is spaced apart from the surface of the first shell facing the vibration structure, the vibration component has a first chamber, the first chamber is located on the side of the vibration structure facing the first circuit board, and is communicated with the first airway. The sensor component is mounted on the other side of the first circuit board, the sensor component comprises a sensor structure, a second shell and a second circuit board, the sensor structure is mounted in the second shell, the sensor component has a second chamber, the second chamber is located on the side of the sensor structure facing the first circuit board, and is communicated with the first airway. The functional device is connected to the first circuit board, and is spaced apart from the vibration component and the sensor component. The second circuit board is connected between the second shell and the first circuit board, the second circuit board is electrically connected to the first circuit board and the sensor component, the second circuit board is provided with a second airway, the second airway penetrates the second circuit board along the thickness direction of the second circuit board, and the second airway is communicated with the first airway.
[0005] In this embodiment, since the vibration component and the sensor component are arranged on opposite sides of the first circuit board, the volumes of the vibration component and the sensor component do not restrict each other. The volume of the vibration component can be appropriately increased, thereby increasing the volume of the vibration membrane and the mass block.
[0006] In addition, the vibration component can be connected to the first circuit board, and the vibration component can be used as a structural member to reinforce the whole machine circuit board (first circuit board). The surface of the first circuit board that is mainly used for electrical connection with electronic components is the surface facing the sensor component. Therefore, the surface position of the first circuit board facing the sensor component is relatively limited. By setting the vibration component on the surface of the first circuit board facing away from the sensor component, the vibration component does not occupy the position of the surface of one side of the first circuit board where the components are mainly set, thereby maximizing space utilization.
[0007] In this embodiment, the second circuit board can provide a circuit pattern for the sensing structure, thereby avoiding the need to set the circuit pattern required for the sensing structure on the first circuit board, saving the wiring space of the first circuit board, thereby further reducing the size of the first circuit board, and facilitating further miniaturization of electronic equipment.
[0008] After the vibration signal of the external environment is received by the first shell, the vibration structure in the first shell will move relative to the first shell under the action of inertia, thereby changing the pressure of the first chamber and generating a transient pressure change. The pressure change in the first chamber will be transmitted from the first airway to the second chamber. The transient pressure change of the second chamber can be picked up by the sensing structure as a transient pressure change signal, which is the environmental vibration signal. The vibration signal can be processed by the device on the first circuit board to form the required signal form.
[0009] In a possible implementation manner, an area of an orthographic projection of the first shell onto the first circuit board is greater than an area of an orthographic projection of the second shell onto the first circuit board.
[0010] In this embodiment, the area of the orthographic projection of the vibration component onto the first circuit board is relatively large. The increase in the area of the vibration component can improve the sensitivity of the electronic device in identifying vibrations, which enables it to more effectively capture and respond to changes in external pressure. Therefore, when the external pressure changes, the vibration identification structure in the vibration component with a large area is more likely to deform, thereby improving the sensitivity of the electronic device in identifying vibrations.
[0011] Moreover, a vibrating component with a large area may be able to withstand greater pressure changes without damage, thereby expanding the range of vibration signals measured by electronic devices. This is particularly important for application scenarios that require detection of high pressure or large-scale pressure changes.
[0012] The increased area of the vibration component can also improve the stability of the electronic device's vibration recognition function. Larger vibration components are more structurally stable and can resist external interference and vibration, reducing errors and drift, thereby improving measurement stability.
[0013] In a possible implementation manner, the functional device is a speaker, and the speaker is connected to a side of the first circuit board facing away from the vibration component.
[0014] The first circuit board may be a main board.
[0015] In this embodiment, the first circuit board can connect electrical devices with different voltages together and provide them with corresponding power supplies. The first circuit board can also be responsible for balancing the data, energy, speed, temperature, current, etc. in the electronic device to ensure that each device can work harmoniously and stably. The first circuit board can also make communication between different components easier, including connecting electrical devices with different functions together so that they can transmit information to each other. The first circuit board can improve the overall reliability of the device and provide a stable basis for the operation of each component of the electronic device.
[0016] Among them, the speaker plays the role of converting audio electrical signals into sound signals. This can be achieved through electromagnetic, piezoelectric or electrostatic effects inside the speaker. Specifically, the coil in the speaker generates a magnetic field under the action of the audio current. This magnetic field interacts with the magnet in the speaker, causing the coil to vibrate. This vibration in turn drives the speaker's diaphragm to vibrate accordingly, thereby producing sound.
[0017] In a possible implementation, the electronic device further includes a housing, and the housing is connected to a side of the first housing facing away from the first circuit board.
[0018] In this embodiment, the housing can form a cavity with the first circuit board to provide a space for the vibration structure, and the housing provides a stable support and protection for the vibration sensor, so that the vibration sensing structure can accurately measure the vibration of the housing without being disturbed by external factors.
[0019] Secondly, the shell also plays a certain sealing and protective role. It can prevent dust, moisture or other contaminants from entering the interior of the vibration component, thereby ensuring the normal operation and service life of the vibration component. In addition, the first shell can also prevent the vibration component from being affected by mechanical shock or vibration, further improving the stability and reliability of the vibration component.
[0020] The vibration component and the housing in the embodiment of the present application are directly connected, which can shorten the environmental vibration transmission path, which is beneficial to further improve the fidelity of signal pickup, thereby improving the sensitivity and signal-to-noise ratio of the vibration component to vibration signal recognition.
[0021] In a possible embodiment, the first shell includes a side shell and a bottom shell, the side shell is connected to the periphery of the bottom shell, the bottom shell is connected to the outer shell, the side of the side shell facing away from the bottom shell is connected to the side surface of the circuit board facing away from the sensor component, and the periphery of the vibration structure is connected to the side shell.
[0022] In a possible embodiment, the side shell includes a first part and a second part, one surface of the first part in the thickness direction is connected to the first circuit board, the other surface of the first part in the thickness direction is connected to the second part, the side of the second part facing away from the first part is connected to the periphery of the bottom shell, and the vibration structure is connected between the first part and the second part.
[0023] In a possible implementation manner, an edge of the vibration structure is arranged to protrude relative to an outer peripheral surface of the second part.
[0024] In this embodiment, the periphery of the vibration structure is protruding relative to the second part, and the periphery of the vibration structure is located outside the cavity of the first shell. The middle area of the vibration structure is the vibrating part. When the first shell vibrates with the outer shell, the middle area of the vibration structure remains motionless relative to an external reference object (such as a user's hand or ear, etc.) under the inertia of the mass block. At this time, the middle area of the vibration structure and the mass block move relative to the first circuit board and the bottom of the first shell. At this time, the space of the first chamber becomes smaller, or the space of the first chamber becomes larger.
[0025] In addition, the vibrating structure and the mass block work together to achieve the conversion of mechanical vibration into electrical signals. When the vibrating structure is subjected to mechanical vibration, its surface will deform, and the attached mass block will aggravate this deformation, so that the electronic device can more accurately detect the vibration and convert it into an electrical signal output.
[0026] In this embodiment, at least the area where the periphery of the vibration structure is connected to the first part can be located outside the space of the first shell, and the vibrating area of the middle area of the vibration structure accounts for a relatively large proportion of the space of the first shell, so that when the vibration structure vibrates, the volume of the first chamber and the third chamber can be changed to a greater extent, so that the change in pressure of the first chamber and the third chamber is increased, which is beneficial to increasing the sensitivity of the electronic device in recognizing vibrations.
[0027] In a possible embodiment, the vibration structure is provided with a third air duct, the third air duct penetrates the vibration structure along the thickness direction of the vibration structure, a third chamber is provided between the vibration structure and the bottom shell, the third air duct connects the first chamber and the third chamber, and the third air duct is completely staggered with the first air duct.
[0028] In a possible implementation, the first housing includes a side housing and a bottom housing, the bottom housing is connected to the first circuit board, the bottom housing is provided with a fourth air channel, the fourth air channel penetrates the bottom housing along the thickness direction of the bottom housing, and the fourth air channel is connected to the first air channel. The side housing is connected to the periphery of the bottom housing and extends to the side of the bottom housing away from the first circuit board, the side of the side housing away from the bottom housing is connected to the outer housing, and the periphery of the vibration structure is connected to the side housing.
[0029] In this embodiment, the bottom of the first shell is connected to the first circuit board, and the connection between the vibration component and the first circuit board is more stable, so that the pressure change in the first chamber is more obvious, which is conducive to the electronic device to better identify the vibration action. Thereby improving the measurement accuracy of the vibration component and ensuring that the deformation and response of the vibration membrane when it is vibrated are accurate and predictable. If the connection between the vibration component and the first circuit board is unstable, it may cause the vibration membrane to produce additional displacement or deformation during the vibration process, thereby introducing errors and reducing the measurement accuracy.
[0030] And the stable connection between the vibration component and the first circuit board can reduce the possibility of failure of the electronic device during long-term use. Unstable connection may cause looseness, breakage or wear, thereby affecting the performance and life of the electronic device.
[0031] The unstable connection between the vibration component and the first circuit board may introduce additional mechanical noise or vibration noise, thereby interfering with the measurement of the vibration signal by the electronic device. The stable connection between the vibration component and the first circuit board can reduce such noise interference and improve the signal-to-noise ratio of the signal.
[0032] In a possible implementation, the electronic device further includes an electrical connector connected between the first circuit board and the second circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying any creative work.
[0034] Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of the present application;
[0035] Figure 2 yes Figure 1 A schematic cross-sectional view of a first embodiment of an electronic device is shown;
[0036] Figure 3 is a cross-sectional schematic diagram of a second embodiment of an electronic device provided by an embodiment of the present application;
[0037] Figure 4 is a cross-sectional schematic diagram of a third embodiment of an electronic device provided by an embodiment of the present application;
[0038] Figure 5 It is a cross-sectional schematic diagram of a fourth embodiment of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0039] The specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can also be implemented in other ways different from those described herein, and therefore, the present application is not limited to the following embodiments.
[0040] For ease of understanding, the terms involved in the embodiments of the present application are first explained.
[0041] Multiple: refers to two or more than two.
[0042] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.
[0043] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.
[0044] At present, some devices are equipped with some vibration sensing functions to identify vibrations or changes in air pressure in the environment. The vibration sensing function of current devices mainly relies on micro-electromechanical systems (MEMS), that is, MEMS-based vibration sensors. However, the inherent and serious disadvantage of traditional MEMS-based vibration sensors is the limited weight of the movable mass block, because this limitation has a significant impact on the basic background noise (Johnson-Nyquist noise level) of the vibration sensor.
[0045] Based on this, please refer to Figure 1 and Figure 2 , Figure 1 is a structural diagram of an electronic device 100 provided in an embodiment of the present application, Figure 2 yes Figure 1 The schematic cross-sectional view of the first embodiment of the electronic device 100 is shown. The present application improves the sensitivity of the electronic device 100 in identifying vibration signals by adjusting the structure of the electronic device 100.
[0046] The electronic device 100 includes a housing 10, a first circuit board 20, a support member 30, a functional device 40, a vibration assembly 50 and a sensor assembly 60. The first circuit board 20, the support member 30, the functional device 40, the vibration assembly 50 and the sensor assembly 60 can all be installed inside the housing 10.
[0047] It should be noted that Figure 2The purpose is only to schematically describe the connection relationship between the housing 10, the first circuit board 20, the support member 30, the functional device 40, the vibration component 50 and the sensor component 60, and it does not specifically limit the connection position, specific structure and quantity of each device. The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.
[0048] The housing 10 may be the outer shell of the electronic device 100. The housing 10 has the functions of protecting the internal components of the device, improving the overall performance of the device, and giving the device an aesthetic appearance.
[0049] Specifically, in this embodiment, the housing 10 can effectively protect the first circuit board 20, the functional device 40, the vibration component 50 and the sensor component 60, etc., from external physical impact, chemical corrosion, dust and moisture. The housing 10 can play a certain shielding role, protecting the internal circuit of the device from interference from external electromagnetic waves. The housing 10 is also part of the product appearance design, and the overall aesthetics of the product can be improved through reasonable shape and color matching.
[0050] Exemplarily, the material of the housing 10 may include plastic, metal, glass, etc. Plastic housings have the advantages of low cost, light weight, and easy processing, and can be used in various consumer electronic products. Metal housings have high strength, hardness, and wear resistance, and can be used in high-end electronic products such as mobile phones and laptops. Glass housings have the characteristics of being beautiful and highly ornamental, and can be used in devices that need to display the internal structure of the product.
[0051] The first circuit board 20 may be a main board of the electronic device 100. The main board ensures stable operation of the device and provides users with rich functions and expansion possibilities.
[0052] The first circuit board 20 may include a first surface 21 and a second surface 22. The first surface 21 and the second surface 22 are disposed opposite to each other along a thickness direction of the first circuit board 20.
[0053] The first surface 21 may be provided with some electronic components, various slots, interfaces and / or chips, etc. The second surface 22 may also be provided with some electronic components and circuits, and the electronic components and circuits of the second surface 22 may also be responsible for transmitting electronic signals inside the first circuit board 20 and providing a stable power supply for various components. The first circuit board 20 is provided with a first air duct 23. The first air duct 23 penetrates the first surface 21 and the second surface 22 of the first circuit board 20 along the thickness direction of the first circuit board 20.
[0054] In this embodiment, the first circuit board 20 can connect electrical devices of different voltages together and provide them with corresponding power supplies. The first circuit board 20 can also be responsible for balancing the data, energy, speed, temperature, current, etc. in the electronic device to ensure that each device can work harmoniously and stably. The first circuit board 20 can also make communication between different components easier, including connecting electrical devices with different functions together so that they can transmit information to each other. A good first circuit board 20 can improve the overall reliability of the device and provide a stable basis for the operation of each component of the electronic device 100.
[0055] The support member 30 may be connected between the first circuit board 20 and the housing. The support member 30 can fix the first circuit board 20 and the housing. Exemplarily, the support member 30 may be bonded to the housing 10 via an adhesive layer 70 .
[0056] In this embodiment, the support member 30 can fix the first circuit board 20 to the housing 10, and the fixed first circuit board 20 can provide a more stable operating environment. Since the first circuit board 20 is fixed to the housing 10, the first circuit board 20 can avoid damage to its structure due to vibration or movement, thereby helping to ensure that the electronic components on the first circuit board 20 work properly.
[0057] Secondly, the first circuit board 20 can improve the overall reliability of the electronic device 100. When the first circuit board 20 is fixed to the housing 10, the first circuit board 20 is not easily disturbed by the external environment, such as dust, moisture or other pollutants. This helps to reduce circuit failures or performance degradation of the first circuit board 20 caused by environmental factors, thereby extending the service life of the electronic device 100.
[0058] In addition, fixing the first circuit board 20 and the housing 10 also helps to optimize the heat dissipation performance of the device. The electronic device 100 generates heat when working. When the first circuit board 20 is fixed to the housing 10, it is easier to design and implement an effective heat dissipation solution, such as adding a heat sink, to ensure that the components on the first circuit board 20 operate at an appropriate temperature.
[0059] Finally, fixing the first circuit board 20 to the housing 10 also helps to simplify the assembly and maintenance process of the electronic device 100. By fixing the first circuit board 20 to the housing 10, it can ensure its correct position during the assembly process, reducing installation problems caused by misoperation. At the same time, during the maintenance process, the fixed first circuit board 20 is also easier to check and replace, which improves the efficiency and convenience of maintenance.
[0060] The functional device 40 may be disposed on the first surface 21 of the first circuit board 20. The functional device 40 may be a speaker, a microphone (MIC) and / or a sensor.
[0061] Among them, the speaker plays the role of converting audio electrical signals into sound signals. This is achieved through electromagnetic, piezoelectric or electrostatic effects inside the speaker. Specifically, the coil in the speaker generates a magnetic field under the action of the audio current. This magnetic field interacts with the magnet in the speaker, causing the coil to vibrate. This vibration in turn drives the diaphragm of the speaker to vibrate accordingly, thereby producing sound.
[0062] The main function of the microphone is to capture and transmit sound signals. Specifically, when the user speaks or makes a sound, the microphone converts the sound into electrical signals, which are then transmitted to the corresponding device or system for processing or recording. The application of the microphone in the headset makes it more convenient and efficient for users to make voice calls, voice chats, recordings and other operations. For example, in a voice call, the microphone can capture the user's voice in real time and transmit it to the other party through the headset to achieve real-time communication. In the recording application, the microphone can record the sound of the user's surrounding environment, such as the sound of meetings, lectures, interviews and other occasions, for the user to use or share later. The microphone can also have a noise reduction function. This function can reduce or eliminate background noise through specific technical means, such as active noise reduction technology, making the user's voice clearer and improving the quality of voice communication or recording.
[0063] The sensor may be an optical sensor, a Hall sensor, a gyroscope, a heart rate sensor, an environmental sensor or an accelerometer. When the electronic device 100 is a headset, the optical sensor is mainly used to detect whether the headset is correctly worn on the user's ear. Once it is detected that the headset is worn, it can automatically trigger music playback or other related functions. The Hall sensor is usually used to implement the automatic start and stop function of the headset. When the headset is placed in or taken out of the charging box, it can automatically detect and trigger the headset to be turned on or off. The gyroscope is mainly used to identify the user's movement type or state, thereby providing more accurate movement data or realizing specific functions, such as head tracking in virtual reality or augmented reality applications. The heart rate sensor is used to monitor the user's heart rate and is usually used in applications such as health management and sports tracking. Environmental sensors include ambient light sensors and microphone sensing elements, etc., which are used to detect changes in the external environment, such as light intensity or sound level, to optimize the performance of the headset or provide a more personalized user experience. The accelerometer is used to measure the acceleration of the user, which is widely used in sports tracking, game control and virtual reality. In addition to the above sensors, the sensors can also be barometric altimeters, geomagnetic sensors, MEMS silicon microphones, VPU and other sensors to provide richer and more accurate functions.
[0064] The functional device 40 can also be a main control chip, a Bluetooth module, an audio codec, a memory chip, a power management module, etc. Among them, the main control chip is the core of the mainboard and is responsible for the overall control and audio processing of the electronic device 100. The main control chip performs various tasks, including signal decoding, audio output management, and communication with external devices. The Bluetooth module is responsible for wirelessly connecting the electronic device 100 with other devices so that the electronic device 100 can receive and send audio signals to achieve wireless audio playback and call functions. The audio codec can encode and decode audio signals to ensure audio quality while reducing distortion and noise during signal transmission. The memory chip stores firmware, configuration files and other important data for the electronic device 100. The power management module is responsible for battery charging and power management of the electronic device 100 to ensure the endurance and stability of the electronic device 100. In addition, other auxiliary components such as resistors, capacitors, inductors, etc. may be provided on the first circuit board 20 to optimize circuit performance and improve the efficiency and stability of signal transmission.
[0065] The present application also provides a variety of different vibration components 50 to make the electronic device 100 suitable for different usage scenarios.
[0066] For the first possible embodiment, please refer to Figure 2 The vibration assembly 50 is mounted on one side of the first circuit board 20. The vibration assembly 50 includes a vibration structure 51 and a first shell 52. The vibration structure 51 is mounted on the first shell 52 and is spaced apart from the surface of the first shell 52 facing the vibration structure 51. The first shell 52 is connected to a side of the housing 10 away from the first circuit board 20.
[0067] In this embodiment, the housing 10 can form a cavity with the first circuit board 20 to provide a housing space for the vibration structure 51. The housing 10 also provides a stable support and protection for the vibration sensor, so that the vibration sensing structure can accurately measure the vibration of the housing 10 without being disturbed by external factors.
[0068] Secondly, the housing 10 also plays a certain sealing and protective role. It can prevent dust, moisture or other pollutants from entering the interior of the vibration assembly 50, thereby ensuring the normal operation and service life of the vibration assembly 50. In addition, the first housing 52 can also prevent the vibration assembly 50 from being affected by mechanical shock or vibration, further improving the stability and reliability of the vibration assembly 50.
[0069] Specifically, the first housing 52 includes a side housing 521 and a bottom housing 522, and the side housing 521 is connected to the periphery of the bottom housing 522. The bottom housing 522 is connected to the housing 10 by dispensing glue, adhesive backing, welding, foam, etc., and the side of the side housing 521 away from the bottom housing 522 is connected to the second surface 22 of the circuit board by dispensing glue, adhesive backing, welding, etc. The periphery of the vibration structure 51 is connected to the side housing 521.
[0070] The vibration component 50 and the housing 10 in the embodiment of the present application are directly connected, which can shorten the environmental vibration transmission path, which is beneficial to further improve the fidelity of signal pickup, thereby improving the sensitivity and signal-to-noise ratio of the vibration component 50 to vibration signal recognition.
[0071] Exemplarily, the side shell 521 includes a first portion 5211 and a second portion 5212. The first portion 5211 may be an annular connecting piece. One surface of the first portion 5211 in the thickness direction is connected to the second surface 22 of the first circuit board 20, and the other surface of the first portion 5211 in the thickness direction is connected to the second portion 5212. The first portion 5211 is arranged around the first air passage 23 on the first circuit board 20. The second portion 5212 surrounds to form a peripheral side surface of the first shell 52. The side of the second portion 5212 facing away from the first portion 5211 is connected to the peripheral edge of the bottom shell 522.
[0072] The outer periphery of the first portion 5211 is protruding relative to the outer periphery of the second portion 5212 .
[0073] The vibration structure 51 is connected between the first part 5211 and the second part 5212. Specifically, the vibration structure 51 includes a vibration membrane 511 and a mass block 512.
[0074] The vibration membrane 511 is connected between the first part 5211 and the second part 5212. The orthographic projection of the vibration membrane 511 onto the first part 5211 covers the surface of the first part 5211 facing the second part 5212. The periphery of the vibration membrane 511 is protruded relative to the outer peripheral surface of the second part 5212. That is, the edge of the vibration structure 51 is located on the outside of the first shell 52. The vibration membrane 511 is spaced apart from the first circuit board 20. The space between the vibration membrane 511 and the first circuit board 20 is the first chamber 501 of the vibration assembly 50. The first chamber 501 is connected to the first air duct 23. The space between the vibration membrane 511 and the bottom shell 522 of the first shell 52 is the third chamber 502.
[0075] The mass block 512 is connected to the middle area of the vibration membrane 511 and is located on the surface of the vibration membrane 511 away from the first part 5211. The mass block 512 is located in the third chamber 502. The mass block 512 is located in the space surrounded by the second part 5212. The periphery of the mass block 512 is spaced apart from the second part 5212, and the mass block 512 is spaced apart from the bottom shell 522.
[0076] The vibration structure 51 is provided with a third air channel 510, and the third air channel 510 penetrates the vibration membrane 511 and the mass block 512 along the thickness direction of the vibration structure 51. The third air channel 510 connects the first chamber 501 and the third chamber 502. The third air channel 510 and the first air channel 23 are completely staggered.
[0077] In this embodiment, the periphery of the vibration membrane 511 is protruding relative to the second part 5212, and the periphery of the vibration membrane 511 is located outside the cavity of the first shell 52. The middle area of the vibration membrane 511 is a vibrating part. When the first shell 52 vibrates with the outer shell 10, the middle area of the vibration membrane 511 and the mass block 512 move relative to the first circuit board 20 and the bottom of the first shell 52 under the inertia of the mass block 512. At this time, the space of the first chamber 501 becomes smaller, and the space of the third chamber 502 becomes larger. Alternatively, the space of the first chamber 501 becomes larger, and the space of the third chamber 502 becomes smaller.
[0078] Since the mass block 512 has a large mass, it can make the vibration structure 51 make a more obvious inertial response, thereby improving the vibration measurement accuracy of the vibration component 50.
[0079] Secondly, the mass block 512 also affects the range and sensitivity of measuring vibration of the electronic device 100. By properly adjusting the mass and position of the mass block 512, the performance of the electronic device 100 can be optimized to meet different application requirements.
[0080] In addition, the vibration membrane 511 and the mass block 512 work together to achieve the conversion of mechanical vibration into electrical signals. When the vibration membrane 511 is subjected to mechanical vibration, its surface will deform, and the additional mass block 512 will aggravate this deformation, so that the electronic device 100 can more accurately detect the vibration and convert it into an electrical signal output.
[0081] In this embodiment, at least a portion of the area where the periphery of the vibration membrane 511 is connected to the first part 5211 can be located outside the space of the first shell 52, and the vibrating area of the middle region of the vibration membrane 511 accounts for a relatively large proportion of the space of the first shell 52, so that when the vibration membrane 511 vibrates, the spatial size of the first chamber 501 and the third chamber 502 can be changed to a greater extent, so that the change in pressure of the first chamber 501 and the third chamber 502 is increased, which is beneficial to increasing the sensitivity of the sensor component 60 of the electronic device 100.
[0082] In addition, the vibration component 50 is connected to the first circuit board 20 and the housing 10 at the same time, and the vibration component 50 can be used as a structural component to reinforce the entire circuit board (first circuit board 20) without occupying more area of the first surface 21 of the first circuit board 20, thereby maximizing space utilization.
[0083] For a second possible embodiment, see Figure 3 , Figure 3 1 is a cross-sectional schematic diagram of a second embodiment of the electronic device 100 provided in an embodiment of the present application. The vibration assembly 50 of the second embodiment is different from the vibration assembly 50 of the first embodiment in that the bottom shell 522 of the first shell 52 of the second embodiment is connected to the first circuit board 20, and the side shell 521 of the first shell 52 is connected to the housing 10 at a side away from the bottom shell 522.
[0084] Specifically, the first portion 5211 of the side shell 521 of the first shell 52 is bonded to the housing 10 through an adhesive layer. The surface of the bottom shell 522 of the first shell 52 that is away from the side shell 521 is connected to the first circuit board 20. The bottom shell 522 is provided with a fourth air channel 5220, which penetrates the bottom shell 522 along the thickness direction of the bottom shell 522, and the fourth air channel 5220 is connected to the first air channel 23.
[0085] In this embodiment, the bottom shell 522 of the first shell 52 is connected to the first circuit board 20, and the connection between the vibration component 50 and the first circuit board 20 is more stable, so that the pressure change of the first chamber 501 is more obvious, which is conducive to the electronic device 100 to better identify the vibration action. Thereby improving the measurement accuracy of the vibration component 50, ensuring that the deformation and response of the vibration membrane 511 when it is vibrated are accurate and predictable. If the connection between the vibration component 50 and the first circuit board 20 is unstable, it may cause the vibration membrane 511 to produce additional displacement or deformation during the vibration process, thereby introducing errors and reducing the measurement accuracy.
[0086] Furthermore, the stable connection between the vibration assembly 50 and the first circuit board 20 can reduce the possibility of failure of the electronic device 100 during long-term use. An unstable connection may cause looseness, breakage or wear, thereby affecting the performance and life of the electronic device 100.
[0087] The stable connection between the vibration membrane 511 and the first housing 52 helps to ensure that the response characteristics of the electronic device 100 within a specific frequency range are stable and consistent. This is particularly important for applications that require accurate detection of vibrations at specific frequencies.
[0088] The unstable connection between the vibration assembly 50 and the first circuit board 20 may introduce additional mechanical noise or vibration noise, thereby interfering with the measurement of the electronic device 100. The stable connection between the vibration assembly 50 and the first circuit board 20 can reduce such noise interference and improve the signal-to-noise ratio of the signal.
[0089] For a third possible embodiment, see Figure 4 , Figure 4 1 is a cross-sectional schematic diagram of a third embodiment of the electronic device 100 provided by the present application. The vibration assembly 50 of the third embodiment is different from the vibration assembly 50 of the second embodiment in that the first housing 52 of the third embodiment does not include a bottom housing 522 .
[0090] The first housing 52 only includes a side shell 521. One side of the first portion 5211 of the first housing 52 is connected to the first circuit board 20, and the surface of the second portion 5212 of the first housing 52 facing away from the first portion 5211 is connected to the housing 10.
[0091] In this embodiment, the first housing 52 is not provided with a bottom housing 522, and the side housing 521 of the first housing 52 is directly connected to the first circuit board 20 and the housing 10. The overall thickness of the first housing 52 is reduced, and the space of the first chamber 501 and the third chamber 502 is not reduced. In this embodiment, the vibration component 50 retains the original sensitivity of vibration recognition while being thinned, which is conducive to the thinning and miniaturization of the electronic device 100.
[0092] For a fourth possible embodiment, see Figure 5 , Figure 5 1 is a cross-sectional schematic diagram of a fourth embodiment of the electronic device 100 provided by the embodiment of the present application. The vibration assembly 50 of the fourth embodiment is different from the vibration assembly 50 of the third embodiment in that one side of the first part 5211 of the first shell 52 of the fourth embodiment is connected to the housing 10, and the surface of the second part 5212 of the first shell 52 facing away from the first part 5211 is connected to the first circuit board 20.
[0093] In this embodiment, the vibration component 50 can increase the connection area with the first circuit board 20 while reducing the overall structure, thereby increasing the connection stability between the vibration component 50 and the first circuit board 20 .
[0094] Please refer to Figure 2The sensor component 60 is mounted on the first surface 21 of the first circuit board 20. The sensor component 60 is spaced apart from the functional device 40 (speaker, etc.) on the first circuit board 20.
[0095] The sensor assembly 60 includes a sensor structure 61, a second housing 62 and a second circuit board 63. The sensor structure 61 is installed in the second housing 62. The second housing 62 is connected to the second circuit board 63. The second circuit board 63 is connected to the first circuit board 20 at a side away from the second housing 62.
[0096] The second circuit board 63 is connected to the first circuit board 20 through an electrical connector 65. The second circuit board 63 is located on one side of the first surface 21 of the first circuit board 20. Exemplarily, the second circuit board 63 can be connected to the first circuit board 20 through pad welding (PAD welding). The electrical connector 65 can be a metal part used for connection during pad welding. The second circuit board 63 is provided with a second air duct 630, which penetrates the second circuit board 63 along the thickness direction of the second circuit board 63, and the second air duct 630 is connected to the first air duct 23.
[0097] In this embodiment, the second circuit board 63 can provide a circuit pattern for the sensing structure 61, thereby avoiding the need to set the circuit pattern required for the sensing structure 61 on the first circuit board 20. This saves the wiring space of the first circuit board 20 and makes the setting of the sensing component 60 more flexible.
[0098] The second housing 62 is connected to the side of the second circuit board 63 facing away from the first circuit board 20. The second housing 62 covers the second air passage 630. The second housing 62 has an accommodating space inside. The sensing structure 61 is located in the accommodating space. The area of the orthographic projection of the second housing 62 onto the first circuit board 20 is smaller than the area of the orthographic projection of the second housing 62 onto the first circuit board 20.
[0099] In this embodiment, since the vibration assembly 50 and the sensor assembly 60 are disposed on opposite sides of the first circuit board 20, and the housings of the vibration assembly 50 and the sensor assembly 60 are disposed separately, the volumes of the vibration assembly 50 and the sensor assembly 60 do not restrict each other. The volume of the vibration assembly 50 can be appropriately increased, thereby increasing the volume of the vibration membrane 511 and the mass block 512.
[0100] The increase in the area of the vibration membrane 511 can improve the sensitivity of the electronic device 100. Since a larger vibration membrane 511 generally has a larger surface area, it can more effectively capture and respond to changes in external pressure. Therefore, when the external pressure changes, the vibration membrane 511 with a larger area is more likely to deform, thereby improving the sensitivity of the electronic device 100 to the vibration signal measurement.
[0101] The increase in the area of the vibration membrane 511 can enhance the measurement range of the electronic device 100. The vibration membrane 511 with a large area may be able to withstand greater pressure changes without damage, thereby expanding the measurement range of the vibration signal of the electronic device 100. This is particularly important for application scenarios that require detection of high pressure or a large range of pressure changes.
[0102] The increase in the area of the vibration membrane 511 can also improve the stability of vibration signal recognition by the electronic device 100. A larger vibration membrane 511 is more stable in structure, can resist external interference and vibration, reduce errors and drift, and thus improve the stability of measurement.
[0103] The sensing structure 61 includes a pressure identification unit 611 and a signal processing unit 612. The pressure identification unit 611 is responsible for receiving and converting pressure signals. The pressure identification unit 611 converts pressure changes into measurable physical quantities (such as changes in resistance value, changes in capacitance, etc.) through specific principles (such as resistance strain, capacitance change, etc.). The signal processing unit 612 is responsible for converting the physical quantity changes generated by the pressure identification unit 611 into electrical signals. For example, when the resistance value of the pressure identification unit 611 changes, the signal processing unit 612 can convert this change into a voltage or current signal. The signal processing unit 612 can also further process the electrical signal output by the converter, such as filtering, amplification, linearization, etc., so that it meets the requirements of subsequent circuits or systems. The signal processing unit 612 may also include an analog-to-digital converter to convert analog signals into digital signals for digital processing and analysis.
[0104] The pressure identification part 611 is connected to the side of the second circuit board 63 facing away from the first circuit board 20. The pressure identification part 611 includes a spacer 6111 and an identification film 6112. The spacer 6111 is arranged around the opening of the second air channel 630. The identification film 6112 is connected to the side of the spacer 6111 facing away from the second circuit board 63. The pressure identification part 611 covers the second air channel 630 of the second circuit board 63. There is a second chamber 64 between the identification film 6112 and the second circuit board 63. In summary, the second chamber 64 is located on the side of the sensing structure 61 facing the first circuit board 20, and is connected to the first air channel 23.
[0105] The signal processing unit 612 is electrically connected to the pressure identification unit 611 . The signal processing unit 612 is connected to a side of the second circuit board 63 that is away from the first circuit board 20 , and is located in the second housing 62 .
[0106] The electronic device 100 provided in the embodiment of the present application may be a terminal device such as headphones, smart glasses, mobile phones, tablets, etc. The electronic device 100 may pick up vibration signals, and its working process is as follows:
[0107] First, the vibration signal of the external environment is transmitted to the first shell 52 through the shell 10. The first shell 52 vibrates with the shell 10. At this time, the vibration membrane 511 and the mass block 512 in the first shell 52 will not vibrate at the same frequency as the first shell 52 due to inertia, so that the relative positions of the vibration membrane 511 and the mass block 512 and the first shell 52 will change, thereby changing the pressure of the first chamber 501 and the third chamber 502, resulting in transient pressure changes. The change in pressure in the first chamber 501 will be transmitted from the airway (the first airway 23 and the second airway 630) to the second chamber 64. The transient pressure change of the second chamber 64 can pick up the transient pressure change signal through the pressure identification unit 611, which is the environmental vibration signal. The vibration signal can be processed by the device on the first circuit board 20 through the signal processing unit 612 to form the required signal form.
[0108] For example, the electronic device 100 may be a microphone structure, and the electrical signal emitted by the signal processing unit 612 may be restored to sound through a speaker, thereby realizing the conversion of sound into electrical signal, so that we can hear the sound captured by the microphone.
[0109] In some other embodiments, in addition to the application scenarios described above, the electronic device 100 of the present application may also be a MEMS barometer or other pressure-sensitive sensor device. When the external air pressure of the electronic device 100 changes, the relative positions of the vibration membrane 511 and the mass block 512 inside the vibration assembly 50 and the first circuit board 20 and the first shell 52 change, thereby changing the pressure of the first chamber 501 and the third chamber 502, so that the pressure of the second chamber 64 changes, and the signal processing unit 612 can calculate the air pressure through the change of the identification membrane 6112 of the signal recognition unit. These barometers have the advantages of small size, low power consumption and high performance, and are therefore widely used in altitude detection, fitness tracking, fall detection, indoor floor height positioning and navigation.
[0110] The above are exemplary embodiments of the present application. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made thereto without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.
Claims
1. An electronic device, characterized in that: include: A first circuit board is provided with a first air channel, wherein the first air channel penetrates the first circuit board along a thickness direction of the first circuit board; a vibration component mounted on one side of the first circuit board, the vibration component comprising a vibration structure and a first shell, the vibration structure being mounted on the first shell and spaced apart from a surface of the first shell facing the vibration structure, the vibration component having a first chamber, the first chamber being located on a side of the vibration structure facing the first circuit board and being in communication with the first airway; a sensor assembly installed on the other side of the first circuit board, the sensor assembly comprising a sensor structure, a second shell and a second circuit board, the sensor structure being installed in the second shell, the sensor assembly having a second chamber, the second chamber being located on a side of the sensor structure facing the first circuit board and being in communication with the first airway; and A functional device, connected to the first circuit board, and spaced apart from the vibration component and the sensor component; The second circuit board is connected between the second shell and the first circuit board, the second circuit board is electrically connected to the first circuit board and the sensor component, the second circuit board is provided with a second air duct, the second air duct penetrates the second circuit board along the thickness direction of the second circuit board, and the second air duct is connected to the first air duct.
2. The electronic device according to claim 1, characterized in that: An area of an orthographic projection of the first shell onto the first circuit board is greater than an area of an orthographic projection of the second shell onto the first circuit board.
3. The electronic device according to claim 1 or 2, characterized in that: The functional device is a speaker, and the speaker is connected to a side of the first circuit board facing away from the vibration component.
4. The electronic device according to claim 1 or 2, characterized in that: The electronic device further includes a shell connected to a side of the first housing that is away from the first circuit board.
5. The electronic device according to claim 4, characterized in that: The first shell includes a side shell and a bottom shell, the side shell is connected to the periphery of the bottom shell, the bottom shell is connected to the outer shell, the side of the side shell facing away from the bottom shell is connected to the side surface of the first circuit board facing away from the sensor component, and the periphery of the vibration structure is connected to the side shell.
6. The electronic device according to claim 5, characterized in that: The side shell includes a first part and a second part, one surface of the first part in the thickness direction is connected to the first circuit board, the other surface of the first part in the thickness direction is connected to the second part, the side of the second part facing away from the first part is connected to the periphery of the bottom shell, and the vibration structure is connected between the first part and the second part.
7. The electronic device according to claim 6, characterized in that: The edge of the vibration structure is arranged to protrude relative to the outer peripheral surface of the second part.
8. The electronic device according to any one of claims 5 to 7, characterized in that: The vibration structure is provided with a third air duct, and the third air duct penetrates the vibration structure along the thickness direction of the vibration structure. A third chamber is provided between the vibration structure and the bottom shell. The third air duct connects the first chamber and the third chamber, and the third air duct is completely staggered with the first air duct.
9. The electronic device according to claim 4, characterized in that: The first housing includes a side housing and a bottom housing, the bottom housing is connected to the first circuit board, the bottom housing is provided with a fourth air passage, the fourth air passage penetrates the bottom housing along the thickness direction of the bottom housing, and the fourth air passage is communicated with the first air passage; The side shell is connected to the periphery of the bottom shell and extends to the side of the bottom shell away from the first circuit board. The side of the side shell away from the bottom shell is connected to the outer shell. The periphery of the vibration structure is connected to the side shell.
10. The electronic device according to claim 1 or 2, characterized in that: The electronic device further includes an electrical connector connected between the first circuit board and the second circuit board.