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LED module and LED lamp including the same

a technology of led modules and led lamps, which is applied in the direction of electroluminescent light sources, semiconductor devices of light sources, lighting and heating apparatus, etc., can solve the problems of frequent replacement relatively short lifespan of incandescent bulb lamps or fluorescent lamps, etc., and achieve excellent processability

Active Publication Date: 2021-03-30
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution enhances luminous flux and adjusts light distribution characteristics, providing a more efficient and durable lighting solution with improved light emission in both forward and backward directions.

Problems solved by technology

Such incandescent bulb lamps or fluorescent lamps have a relatively short lifespan, and, therefore, may need to be frequently replaced.

Method used

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  • LED module and LED lamp including the same
  • LED module and LED lamp including the same
  • LED module and LED lamp including the same

Examples

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Embodiment Construction

[0029]Hereinafter, example embodiments of the present inventive concept will be described with reference to the accompanying drawings.

[0030]FIG. 1 is a cross-sectional view illustrating a light emitting diode (LED) module according to an embodiment of the present inventive concept, and FIG. 2 is a plan view illustrating a substrate employed in the LED module illustrated in FIG. 1.

[0031]Referring to FIGS. 1 and 2, an LED module 200 according to this embodiment may include a flexible substrate 110 having a first surface 110A and a second surface 110B positioned opposite to each other, a plurality of light emitting diode (LED) chips 150 mounted on the first surface 110A of the flexible substrate 110, an insulating reflective layer 120 disposed on the first surface 110A of the flexible substrate 110, first and second connection terminals 270a and 270b for applying a driving voltage and connected to the plurality of LED chips 150, and a wavelength conversion portion 190 covering the plur...

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Abstract

A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims benefit of priority to Korean Patent Application No. 10-2018-0047560 filed on Apr. 24, 2018, and Korean Patent Application No. 10-2018-0092318 filed on Aug. 8, 2018 in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference in their entirety.BACKGROUND1. Field[0002]The present disclosure relates to a light emitting diode (LED) module, and an LED lamp comprising the LED module.2. Description of Related Art[0003]In general, incandescent bulb lamps or fluorescent lamps are often used as indoor or outdoor lighting lamps. Such incandescent bulb lamps or fluorescent lamps have a relatively short lifespan, and, therefore, may need to be frequently replaced.[0004]In order to solve such a problem, a lighting device using a light emitting diode (LED) having high photoelectric conversion efficiency and an excellent lifespan has been prominent. In addition, LEDs offer various adva...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L33/00H01L33/50H01L33/40H01L33/26H01L33/10H05B45/00H05B44/00
CPCH01L33/50H01L33/10H01L33/26H01L33/40H05B45/00H01L33/60H01L33/44H01L25/0753F21K9/238F21K9/64F21K9/68F21Y2115/10H01L33/505H01L33/46H01L33/62F21K9/232
Inventor YOU, JAE SUNGPAEK, HO SUNSONGLEE, JUN BUM
Owner SAMSUNG ELECTRONICS CO LTD