Thermal bonding structure and manufacture process of flexible printed circuit board
a technology of printed circuit board and manufacturing process, which is applied in the direction of printed circuit manufacturing, printed circuit aspects, printed element electric connection formation, etc., can solve the problems of poor bonding quality and appearance of products, deterioration of materials in the bonding area, and free soldering, so as to reduce heat consumption at the insulating layer, reduce the cost of the bonding process, and reduce the heat energy consumption
Inactive Publication Date: 2008-09-04
HO YA TING +1
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Benefits of technology
This approach reduces heat consumption and costs, enhances bonding quality, and prevents burning issues at the bonding area, improving the overall material quality and appearance of the flexible printed circuit boards.
Problems solved by technology
However, it is necessary to increase the temperature of the bonding head 260 for bonding, and the high temperature will burn the first insulating layer 200 and the adjacent adhesive layer 210 black, and thus causing poor bonding quality and appearance of the product, or even deteriorating the materials in the bonding area.
However, the first insulating layer 200 and its adjacent adhesive layer 210 will be burned black at the temperature of 470° C., and such phenomenon is particularly severe for lead-free solders because the melting point of lead-free solders is higher than that of lead solders.
As a result, the burning effect produced in the bonding area 250 becomes obvious and severe.
Method used
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[0017]To make it easier for our examiner to understand the objective of the invention, its innovative features and performance, a detailed description and technical characteristics of the present invention are described together with the drawings as follows.
[0018]Referring to FIG. 3, a top view of a thermal bonding structure of a flexible printed circuit board and its corresponding cross-sectional view according to a preferred embodiment of the present invention are illustrated. In the preferred embodiment, a thermal bonding structure 3 of a flexible circuit board comprises: a laminated structure having a first insulating layer 310, an adhesive layer 320, a first conductive layer 330, an adhesive layer 320, a second insulating layer 340, an adhesive layer 320, a second conductive layer 350, and a third insulating layer 360; and at least one through hole 380 passing through each layer between the first conductive layer 330 and the second conductive layer 350. The first insulating lay...
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A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.
Description
RELATED APPLICATIONS[0001]This application is a Divisional patent application of co-pending application Ser. No. 11 / 085,097, filed on 22 Mar. 2005. The entire disclosure of the prior application Ser. No. 11 / 085,097, from which an oath or declaration is supplied, is considered a part of the disclosure of the accompanying Divisional application and is hereby incorporated by reference.FIELD OF THE INVENTION[0002]The present invention generally relates to a flexible printed circuit board, and more particularly relates to a thermal bonding structure and manufacture process of a flexible printed circuit board that can improve the issues of bonding burns and material quality.BACKGROUND OF THE INVENTION[0003]As our living standard is improving gradually, various electronic consumer products are introduced to meet extensive consumer requirements, and thus promoting the prosperity of various industries directly and driving the growth of related sub-industries indirectly. To further meet the c...
Claims
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IPC IPC(8): H05K3/00H05K3/36
CPCH05K1/0206H05K1/0212H05K3/281H05K3/3494Y10T29/49165H05K3/42H05K2201/09781H05K2203/0195Y10T29/49126H05K3/363
InventorHO, YA-TINGCHEN, LI-HUI
OwnerHO YA TING