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Ceramic heat pipe with porous ceramic wick

a ceramic wick and ceramic heat pipe technology, applied in the field of ceramic heat pipes, can solve the problems of insufficient thermal conductivity of conventional metal and ceramic substrates

Inactive Publication Date: 2010-04-01
OSRAM SYLVANIA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]An object of the present invention is to provide a novel heat pipe made entirely of ceramic that resists corrosion and on which electrical components such as LEDs can be mounted directly.
[0010]Yet another object of the present invention is to provide a novel method of making this heat pipe where the body and wick are provided from the same ceramic material and are formed together as a seamless monolithic structure made of the same ceramic material.

Problems solved by technology

LEDs generate heat as well as light and the heat is desirably transported away from the LEDs because elevated LED-junction operating temperatures (e.g., above about 115° C.) adversely affect light output.
However, conventional metal and ceramic substrates often do not have sufficient thermal conductivity, especially when many LEDs are placed in a small area.

Method used

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  • Ceramic heat pipe with porous ceramic wick
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Examples

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Embodiment Construction

[0015]With reference now to FIGS. 1 and 2, one embodiment of a heat pipe 10 of the present invention includes a hollow sealed body 12 made of a non-porous ceramic, a central vapor transport channel 14 that extends between two heat transfer locations 16, 16′ spaced apart on an exterior surface of the body 12, a ceramic wick 18 on the inside wall 7 of the body 12 and surrounding the vapor transport channel 14, the ceramic wick also extending between the two heat transfer locations 16, 16′ and a working fluid 20 inside the body 12 that partially fills the vapor transport channel 14. A thermal load comprising heat-emitting bodies, such as LEDs 22, may be mounted directly on the ceramic body at one of the heat transfer locations 16′ and the other heat transfer location 16 may be exposed to a cooler temperature so that operation of the heat pipe is conventional. The term “non-porous ceramic” as used herein means that the ceramic that forms the body of the heat pipe is sufficiently dense t...

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PUM

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Abstract

A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.

Description

BACKGROUND OF THE INVENTION[0001]The present invention is directed to a heat pipe that transports heat away from heat producing bodies, such as light emitting diodes (LEDs).[0002]LEDs generate heat as well as light and the heat is desirably transported away from the LEDs because elevated LED-junction operating temperatures (e.g., above about 115° C.) adversely affect light output. Heat can be transported away from the LEDs by mounting the LEDs on a substrate (heat sink) of sufficient thermal conductivity and appropriate surface area from which to dissipate the heat. However, conventional metal and ceramic substrates often do not have sufficient thermal conductivity, especially when many LEDs are placed in a small area. Consequently, a supporting substrate with improved thermal conductivity suitable for use with LEDs is desired.[0003]A heat pipe is a heat transfer device that can transport large quantities of heat, significantly more than conventional metal and ceramic heat sinks, fr...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF21V29/004F28D15/046F21V29/006H01L2924/0002H01L2924/00F21V29/51F21V29/83F21V29/86H01L33/64
Inventor KOENIGSBERG, WILLIAM D.SCOTCH, ADAM M.HAMBY, DAVID W.SELVERIAN, JOHN H.WENTZEL, DAVID
Owner OSRAM SYLVANIA INC