Film forming device

Active Publication Date: 2018-09-20
TOSHIBA MITSUBISHI-ELECTRIC IND SYST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a film forming device that has a detachable bottom plate on the mist spray head, which makes it easy to remove any reaction products from the bottom surface. This allows for constant cleaning and maintenance of the device without having to stop using it. Additionally, the device can have multiple bottom plates in advance, so that one can be cleaned while another is being used. This ensures that the device can be used continuously without the need for frequent cleaning.

Problems solved by technology

However, in the chemical vapor deposition method, it is often necessary to form a film under vacuum, and in addition to a vacuum pump or the like, there is a case where it is necessary to use a large vacuum container.
Further, in the chemical vapor deposition method, there has been a problem that it is difficult to adopt a substrate having a large area as a substrate to be formed from the viewpoint of cost and the like.

Method used

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Experimental program
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embodiment 1

[0023](Overall Structure)

[0024]FIG. 1 is a cross sectional view showing a mist spray head 100 and its periphery which are main components of a film forming device according to Embodiment 1 of the present invention. FIG. 2 is a cross sectional view showing a cross sectional structure taken along line A-A of FIG. 1. In FIGS. 1 and 2 and in FIGS. 3 to 8 shown later, XYZ orthogonal coordinate axes are also shown. Also, in FIG. 2, the bottom plate 21 is omitted.

[0025]In the film forming device of Embodiment 1, a film is formed on a substrate 23 by spraying an atomized raw material solution to the atmosphere by the mist spray head 100. That is, the film forming device is a device for forming a desired film on the substrate 23 by the mist method, which is a film forming processing in the atmosphere.

[0026]Specifically, the raw material solution is contained in a container (not shown), and the raw material solution is atomized in the container by utilizing ultrasonic vibration. Then, the ato...

embodiment 2

[0148]FIG. 5 is a cross sectional view showing a configuration of the mist spray head 100B in the film forming device according to Embodiment 2. FIG. 6 is a cross sectional view showing a cross sectional structure taken along line C-C of FIG. 5. Also, in FIG. 6, illustration of the bottom plate 21B is omitted.

[0149]FIG. 7 is a plan view showing the bottom structure of the mist spray head 100B in a state in which the bottom plate 21Bis removed. FIG. 8 is an explanatory view showing the appearance structure and the like of the base plate 20B in a state in which the bottom plate 21B is removed, as viewed from the Y direction. In FIG. 8, FIG. 8(a) is a side view of the mist spray head 100B as viewed from the left side surface (−X direction), and FIG. 8(b) is a front view as viewed from the front (+Y direction). The cross sectional structure taken along line D-D of FIG. 8(a) is a sectional view shown in FIG. 5.

[0150]The mist spray head 100 according to embodiment 1 includes two reaction ...

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Abstract

Provided is a film forming device having a structure for easily removing adhered reaction products. The film forming device of the present invention includes a bottom plate (21) detachably provided on the bottom surface of a mist spray head (100). The bottom plate (21) includes a raw material solution opening (35), reaction material openings (36, 37), and inert gas openings (392-394) formed in regions corresponding to a raw material solution ejection port (15), reaction material ejection ports (16, 17), and inert gas ejection ports (192-194), when the bottom plate (21) is attached to the bottom surface of the mist spray head (100).

Description

TECHNICAL FIELD[0001]The present invention relates to a film forming device for forming a film on a substrate.BACKGROUND ART[0002]As a method of forming a film on a substrate, there is a chemical vapor deposition (CVD) method. However, in the chemical vapor deposition method, it is often necessary to form a film under vacuum, and in addition to a vacuum pump or the like, there is a case where it is necessary to use a large vacuum container. Further, in the chemical vapor deposition method, there has been a problem that it is difficult to adopt a substrate having a large area as a substrate to be formed from the viewpoint of cost and the like. Therefore, a mist method capable of film forming processing under atmospheric pressure attracts attention.[0003]As a conventional technique relating to a film forming device or the like utilizing a mist method, for example, there is a technique according to Patent Document 1.[0004]In the technique according to the Patent Document 1, atomized ra...

Claims

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Application Information

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IPC IPC(8): B05B13/02B05B1/34B05B7/00
CPCB05B13/0278B05B1/34B05B13/0285B05B7/0081C23C16/4412C23C16/45519C23C16/45551C23C16/45563C23C16/4401C23C16/453C23C16/45565C23C18/1279B05B12/1472B05B7/08B05B12/18C23C16/4586B05B14/30B05B7/24C23C18/1275C23C16/45574C23C16/45595B05B7/025
InventorSHIRAHATA, TAKAHIROORITA, HIROYUKI
OwnerTOSHIBA MITSUBISHI-ELECTRIC IND SYST CORP