Thermally isolated electronics utilities cavity for a substrate carrier

Inactive Publication Date: 2019-11-21
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text is about a substrate carrier for holding and transporting semiconductor wafers. The carrier includes multiple electrostatic chuck panels that are placed on a carrier body. The carrier body has an electronics utilities cavity and a battery for supplying power to control electronics. The carrier also has thermal insulating material on the walls of the cavity to ensure stable temperatures during transportation. The technical effect of the invention is the improved stability and reliability of the substrate carrier during transportation.

Problems solved by technology

However, as the control electronics and low voltage power supply are housed within the substrate carrier, they are exposed to high temperatures and changing pressures while in the processing chamber.
These conditions may cause one or more of the control electronics and low voltage power supply may fail while processing the substrate, which may cause catastrophic damage to the substrate.

Method used

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  • Thermally isolated electronics utilities cavity for a substrate carrier
  • Thermally isolated electronics utilities cavity for a substrate carrier
  • Thermally isolated electronics utilities cavity for a substrate carrier

Examples

Experimental program
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Embodiment Construction

[0015]Described herein are substrate carriers having a battery housed within an electronics utilities cavity and that is thermally isolated from high processing temperatures. One or more of the internal walls of the electronics utilities cavity may have a thermal isolating material disposed thereon. Further, the electronics utilities cavity may be disposed within a body member of a corresponding substrate carrier that is separated from another body member of the substrate carrier by thermal breaks, providing additional thermal isolation of the battery and control electronics housed within the electronics utilities cavity. Thermally isolating the battery and control electronics decreases the likelihood that the battery and / or control electronics will suffer a failure when the substrate carrier is exposed to high temperatures and changing pressures during substrate processing.

[0016]FIG. 1A is a schematic perspective view of a substrate carrier 100 having an ESC 104 thereon, according ...

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Abstract

Described herein is a substrate carrier comprises a plurality of electrostatic chuck panels and a carrier body. The plurality of electrostatic chuck panels is disposed on the carrier body. The carrier body has an electronics utilities cavity, and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. A battery is disposed within the electronics cavity, and is configured to provide a first power supply signal to control electronics. The carrier body may additionally include a first body member having the electrostatic chuck panels disposed thereon, and a second body member separated from the first body member by thermal breaks. The electronics utilities cavity may be housed within the second body member of the carrier body.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims benefit of priority to Indian Provisional Application Ser. No. 201841018921, filed on May 21, 2018, which is incorporated herein by reference in its entirety.BACKGROUNDField[0002]Embodiments described herein generally relate to regulating the environmental temperature of a battery within a substrate carrier.Description of the Related Art[0003]In the processing of substrates, such as semiconducting substrates and displays, the substrate is held on a substrate support surface of a substrate carrier or substrate support in a process chamber during processing. The substrate support surface can include an electrostatic chuck (ESC) that has one or more electrodes capable of being electrically biased to hold the substrate to the substrate support surface. Typically, each ESC is coupled to power supply which is controlled by control electronics. The control electronics are powered by a low voltage power supply, which may be...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/67H01M2/10H01M10/658
CPCH01L21/67017H01M2/1094H01L21/6833H01L51/56H01J2237/002H01J37/32724H01J37/32697H01L21/67109H01L21/68785H01L21/67346H01M2220/30Y02E60/10H01M50/24H01M10/658H10K71/00
InventorRAO, SHREESHA Y.VINCENT, JOSEPHQIAO, WENWEIWHITE, JOHN M.
OwnerAPPLIED MATERIALS INC