Surface processing copper foil

Abstract

A surface-treated copper foil is provided to improve heat resistance / chemical resistance of a junction surface with a resin substrate and to increase contact power with the resin substrate by forming a second molybdenum layer on a first nickel layer. A surface-treated copper foil is composed of a first layer formed on at least one surface by using nickel or nickel alloy and a second layer formed on the first layer by using molybdenum or molybdenum alloy. Metal components except for nickel included in the first layer and molybdenum included in the second layer are included below 3~50mol.%, respectively. The content of molybdenum included in the second layer is 0.002~0.5 mg / dm^2. In particular, the content of molybdenum included in the second layer is 3~75mol.% for the metal content of the second layer.

Description

technical field

[0001] The present invention relates to a surface-treated copper foil used for printed wiring boards, FPC, COF, etc., and particularly relates to a surface-treated copper foil excellent in heat resistance and chemical resistance, and also excellent in adhesion to a polyimide film. Background technique

[0002] Recently, with the miniaturization and complexity of printed wiring incorporated into various home appliances, electronic products, computers, etc., printed wiring boards that can withstand severe conditions are required. Copper foil also needs to be improved in characteristics such as high bonding strength between the copper foil part and the substrate after the wiring board is manufactured, excellent chemical resistance, and excellent heat resistance during heating.

[0003] When manufacturing printed wiring boards with copper clad laminates, the bonding interface between the copper foil and the substrate is exposed to a solution containing hydrochlor...

Examples

Embodiment 1

[0083] On the M side of the electrolytic copper foil, it is plated for 8 seconds within the condition range of condition 1 to form a nickel film (first layer), and then plated for 10 seconds under the condition range of condition 4 to allow molybdenum to adhere (second layer). layer), then attach the anti-rust metal Zn·Cr, and then perform silane treatment.

[0084] Table 1 shows the deposition amount of each metal deposited on the copper foil surface.

Embodiment 2

[0086] On the M surface of the electrolytic copper foil, it is plated under the condition range of condition 2 for 15 seconds to form a nickel-cobalt layer, and then plated thereon for 8 seconds under the condition range of condition 5 to adhere the molybdenum-cobalt alloy, and then apply The anti-rust metal Zn·Cr is attached, followed by silane treatment.

[0087] Table 1 shows the deposition amount of each metal deposited on the copper foil surface. At this time, cobalt was 23 mol % with respect to the total metal amount of nickel-cobalt and molybdenum-cobalt.

Embodiment 3

[0089] On the M surface of the electrolytic copper foil, a nickel layer containing phosphorus is formed by plating for 12 seconds under the condition range of condition 3, and a molybdenum layer is formed by plating for 14 seconds under the condition range of condition 4, and the anti- Rust metal Zn·Cr is attached, and then silane treatment is performed.

[0090] Table 1 shows the deposition amount of each metal deposited on the copper foil surface. At this time, phosphorus was 4 mol% with respect to the total metal amount of nickel metal and molybdenum metal containing phosphorus.

technical field

[0001] The present invention relates to a surface-treated copper foil used for printed wiring boards, FPC, COF, etc., and particularly relates to a surface-treated copper foil excellent in heat resistance and chemical resistance, and also excellent in adhesion to a polyimide film. Background technique

[0002] Recently, with the miniaturization and complexity of printed wiring incorporated into various home appliances, electronic products, computers, etc., printed wiring boards that can withstand severe conditions are required. Copper foil also needs to be improved in characteristics such as high bonding strength between the copper foil part and the substrate after the wiring board is manufactured, excellent chemical resistance, and excellent heat resistance during heating.

[0003] When manufacturing printed wiring boards with copper clad laminates, the bonding interface between the copper foil and the substrate is exposed to a solution containing hydrochlor...

Examples

Embodiment 1

[0083] On the M side of the electrolytic copper foil, it is plated for 8 seconds within the condition range of condition 1 to form a nickel film (first layer), and then plated for 10 seconds under the condition range of condition 4 to allow molybdenum to adhere (second layer). layer), then attach the anti-rust metal Zn·Cr, and then perform silane treatment.

[0084] Table 1 shows the deposition amount of each metal deposited on the copper foil surface.

Embodiment 2

[0086] On the M surface of the electrolytic copper foil, it is plated under the condition range of condition 2 for 15 seconds to form a nickel-cobalt layer, and then plated thereon for 8 seconds under the condition range of condition 5 to adhere the molybdenum-cobalt alloy, and then apply The anti-rust metal Zn·Cr is attached, followed by silane treatment.

[0087] Table 1 shows the deposition amount of each metal deposited on the copper foil surface. At this time, cobalt was 23 mol % with respect to the total metal amount of nickel-cobalt and molybdenum-cobalt.

Embodiment 3

[0089] On the M surface of the electrolytic copper foil, a nickel layer containing phosphorus is formed by plating for 12 seconds under the condition range of condition 3, and a molybdenum layer is formed by plating for 14 seconds under the condition range of condition 4, and the anti- Rust metal Zn·Cr is attached, and then silane treatment is performed.

[0090] Table 1 shows the deposition amount of each metal deposited on the copper foil surface. At this time, phosphorus was 4 mol% with respect to the total metal amount of nickel metal and molybdenum metal containing phosphorus.

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