Multifunctional computer case

Abstract

A multifunctional computer case belongs to the field of computer technology. The present invention solves the problem that the existing computers generally have low heat dissipation performance and are cumbersome to disassemble and assemble during maintenance, which brings a lot of inconvenience to the maintenance of the computer. A multifunctional computer case includes a shell and a heat dissipation device; both sides of the main frame are hinged with side panels, the top of the main frame is hinged with a top plate, a motherboard mounting seat is arranged inside the main frame, and the rear end of the main frame is sequentially provided with a first fan and a water tank mounting cavity from top to bottom, a cover plate is hinged at the bottom of the water tank mounting cavity, and a second fan is arranged at the front end of the main frame; one end of the water cooling pipe is connected to the upper end of the water tank, and the other end is connected to the lower end of the water tank through a circulating pump. The present invention is simple to operate, effectively reduces the time required for computer maintenance, and can greatly improve the heat dissipation performance of the computer, effectively avoiding the situation where the computer fails due to high temperature.

Description

Technical Field

[0001] The invention relates to a computer case, in particular to a multifunctional computer case, and belongs to the technical field of computers. Background Art

[0002] With the progress of society, computers have become an indispensable part of the development of all walks of life, and computers have been widely used in various fields. They can replace people to complete various tedious tasks more accurately. The existing computer cases generally have low heat dissipation performance, and are cumbersome to disassemble and assemble during maintenance, which brings a lot of inconvenience to computer maintenance. Summary of the invention

[0003] The purpose of the present invention is to provide a multifunctional computer case, which solves the problem that the existing computer cases generally have low heat dissipation performance and are cumbersome to disassemble and assemble during maintenance, which brings a lot of inconvenience to the maintenance of the computer.

[0004] The technical solution of the present invention:

[0005] A multifunctional computer case, comprising a shell and a heat dissipation device;

[0006] The housing comprises a side plate, a mainboard mounting seat, a top plate, a main frame, a first telescopic rod, a second telescopic rod, a first fan, a second fan, a water tank mounting cavity and a cover plate;

[0007] The main frame is hinged with side panels on both sides, a top panel is hinged at the top of the main frame, one end of the first telescopic rod is hinged on the side panel, and the other end is hinged on the main frame, one end of the two second telescopic rods is hinged on the top surface of the main frame in parallel, and the other end is hinged on the lower end surface of the top panel, a mainboard mounting seat is arranged inside the main frame, a first fan and a water tank mounting cavity are arranged in sequence from top to bottom at the rear end of the main frame, a cover plate is hinged at the bottom end of the water tank mounting cavity, and a second fan is arranged at the front end of the main frame;

[0008] The heat dissipation device comprises a water tank, a circulation pump, a water cooling pipe and a radiator;

[0009] The water tank is arranged in the water tank installation cavity, and the water cooling pipe is arranged in a serpentine shape on the mainboard mounting seat. One end of the water cooling pipe is connected to the upper end of the water tank, and the other end is connected to the lower end of the water tank through a circulating pump. A radiator is provided on the water cooling pipe, and the heat dissipation end of the radiator is connected to the second fan.

[0010] Preferably, the radiator comprises a radiating fin, a radiating pipe, a fixing plate and a sealing sleeve;

[0011] Two fixing plates are symmetrically fixed on one side of the second fan and connected through two heat dissipation pipes. A plurality of heat sinks are arranged on the heat dissipation pipes. Two sealing sleeves are arranged in parallel on the fixing plates. The ends of the heat dissipation pipes pass through the fixing plates and are connected to the water cooling pipes through the sealing sleeves.

[0012] Preferably, the side plates, the top plate and the cover plate are all provided with magnets that attract each other opposite to the main frame.

[0013] Preferably, the heat dissipation tube is a copper tube, and the heat dissipation fin is an aluminum heat dissipation fin.

[0014] Preferably, a sealing cover is provided on the water tank.

[0015] Preferably, the water cooling tube is made of glass.

[0016] The beneficial effects of the present invention are:

[0017] 1. The heat dissipation device used in the present invention can greatly improve the heat dissipation performance of the computer.

[0018] 2. The top plate and side plates provided on the housing of the present invention can be unfolded at will, so that the computer can be inspected and repaired more conveniently.

[0019] 3. The first telescopic rod and the second telescopic rod used in the present invention can buffer the force generated when closing the side panels and the top panel, thereby avoiding hard contact between the side panels, the top panel and the main frame, and effectively extending the service life of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a front view of the present invention;

[0021] Figure 2 is a side view of a drinking water carrying device;

[0022] Figure 3 It is a structural diagram of the radiator.

[0023] In the figure: 1-housing, 101-side panel, 102-mainboard mounting seat, 103-top panel, 104-main frame, 105-first telescopic rod, 106-second telescopic rod, 107-first fan, 108-second fan, 109-water tank mounting cavity, 110-cover plate, 2-heat dissipation device, 21-water tank, 22-circulating pump, 23-water cooling pipe, 24-radiator, 241-heat sink, 242-heat dissipation pipe, 243-fixing plate, 244-sealing sleeve, 3-magnet, 4-sealing cover. DETAILED DESCRIPTION

[0024] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] like Figures 1 to 3A multifunctional computer case is shown, comprising a housing 1 and a heat sink 2;

[0026] The housing 1 includes a side plate 101, a mainboard mounting seat 102, a top plate 103, a main frame 104, a first telescopic rod 105, a second telescopic rod 106, a first fan 107, a second fan 108, a water tank mounting cavity 109 and a cover plate 110;

[0027] The main frame 104 is hinged with side panels 101 on both sides, and a top panel 103 is hinged at the top of the main frame 104. One end of a first telescopic rod 105 is hinged on the side panel 101, and the other end is hinged on the main frame 104. One end of two second telescopic rods 106 are hinged on the top surface of the main frame 104 in parallel, and the other end is hinged on the lower end surface of the top panel 103. A mainboard mounting seat 102 is arranged inside the main frame 104. A first fan 107 and a water tank installation cavity 109 are arranged in sequence from top to bottom at the rear end of the main frame 104. A cover plate 110 is hinged at the bottom end of the water tank installation cavity 109, and a second fan 108 is arranged at the front end of the main frame 104.

[0028] The heat dissipation device 2 includes a water tank 21, a circulation pump 22, a water cooling pipe 23 and a radiator 24;

[0029] The water tank 21 is arranged in the water tank installation cavity 109, and the water cooling pipe 23 is arranged in a serpentine shape on the motherboard mounting base 102. One end of the water cooling pipe 23 is connected to the upper end of the water tank 21, and the other end is connected to the lower end of the water tank 21 through the circulation pump 22. A radiator 24 is provided on the water cooling pipe 23, and the heat dissipation end of the radiator 24 is connected to the second fan 108.

[0030] Further, the radiator 24 includes a heat sink 241, a heat pipe 242, a fixing plate 243 and a sealing sleeve 244;

[0031] The two fixing plates 243 are symmetrically fixed on one side of the second fan 108 and connected through two heat dissipation pipes 242. A plurality of heat dissipation fins 241 are arranged on the heat dissipation pipe 242. Two sealing sleeves 244 are arranged in parallel on the fixing plate 243. The ends of the heat dissipation pipes 242 pass through the fixing plate 243 and are connected to the water cooling pipe 23 through the sealing sleeve 244.

[0032] Furthermore, magnets 3 that attract each other are arranged on the side plate 101 , the top plate 103 and the cover plate 110 , facing the main frame 104 .

[0033] Furthermore, the heat dissipation tube 242 is a copper tube, and the heat dissipation fin 241 is an aluminum heat dissipation fin 241 .

[0034] Furthermore, a sealing cover 4 is provided on the water tank 21 .

[0035] Furthermore, the water cooling tube 23 is made of glass.

[0036] The working process of this device is:

[0037] First, open the cover 110, open the sealing cover 4 on the water tank 21, and inject water-cooling liquid, then tighten the sealing cover 4 and close the cover 110, and the circulation pump 22 draws water from the bottom of the water tank 21 to fill the entire water-cooling pipe 23 with water-cooling liquid. When the water-cooling liquid flows through the heat dissipation pipe 242, the heat dissipation pipe 242 transfers the heat to the heat sink 241, thereby achieving a large-area heat dissipation effect. When the water-cooling liquid flows through the motherboard mounting seat 102, it can take away the heat of the motherboard and finally return to the water tank 21. The first fan 107 blows wind into the main frame 104 from the rear end of the chassis, and the second fan 108 blows air outward to blow the heat on the heat sink 241 out from the front end of the main frame 104. When the computer needs to be repaired, the side panel 101 and the top panel 101 can be manually connected. 3 is opened, thus saving the step of tightening screws, thereby saving the time required for maintenance and making maintenance more convenient. When the maintenance is completed, the side panels 101 and the top panel 103 are manually reset. The side panels 101, the top panel 103, the cover panel 110 and the main frame 104 are all provided with magnets 3, so that the top panel 103, the side panels 101 and the cover panel 110 can be closely fitted with the main frame 104. The first telescopic rod 105 and the second telescopic rod 106 arranged between the side panels 101, the top panel 103 and the main frame 104 can buffer the force generated when closing the side panels 101 and the top panel 103, thereby avoiding hard contact between the side panels 101, the top panel 103 and the main frame 104, and effectively extending the service life of the present invention.

Claims

1. A multifunctional computer case, characterized in that: The invention comprises a housing (1) and a heat dissipation device (2); the housing (1) comprises a side panel (101), a mainboard mounting seat (102), a top panel (103), a main frame (104), a first telescopic rod (105), a second telescopic rod (106), a first fan (107), a second fan (108), a water tank mounting cavity (109) and a cover plate (110); both sides of the main frame (104) are hingedly connected to the side panels (101); the top of the main frame (104) is hingedly connected to the top panel (103); one end of the first telescopic rod (105) is hingedly connected to the side panel (101), and the other end is hingedly connected to the main frame (104); two second telescopic rods (105) are hingedly connected to the side panels (101), and the other end is hingedly connected to the main frame (104); One end of the telescopic rod (106) is hinged in parallel to the top surface of the main frame (104), and the other end is hinged to the lower surface of the top plate (103); a mainboard mounting seat (102) is arranged inside the main frame (104); a first fan (107) and a water tank mounting cavity (109) are arranged in sequence from top to bottom at the rear end of the main frame (104); a cover plate (110) is hinged at the bottom end of the water tank mounting cavity (109); and a second fan (108) is arranged at the front end of the main frame (104); the heat dissipation device (2) comprises a water tank (21), a circulating pump (22), a water cooling pipe (23) and a radiator (24); the water tank (21) is arranged at the water tank In the installation cavity (109), a water cooling tube (23) is arranged in a serpentine shape on the mainboard installation seat (102); one end of the water cooling tube (23) is connected to the upper end of the water tank (21), and the other end is connected to the lower end of the water tank (21) through a circulation pump (22); a radiator (24) is provided on the water cooling tube (23); a heat dissipation end of the radiator (24) is connected to the second fan (108); the radiator (24) comprises a heat sink (241), a heat dissipation tube (242), a fixing plate (243) and a sealing sleeve (244); the two fixing plates (243) are symmetrically fixedly arranged on one side of the second fan (108), and are connected to the second fan (108) through the two heat dissipation tubes (242). The heat dissipation pipe (242) is connected to the main frame (104); a plurality of heat dissipation fins (241) are arranged on the heat dissipation pipe (242); two sealing sleeves (244) are arranged in parallel on the fixing plate (243); the end of the heat dissipation pipe (242) passes through the fixing plate (243) and is connected to the water cooling pipe (23) through the sealing sleeve (244); the side plate (101), the top plate (103) and the cover plate (110) are all provided with magnets (3) that attract each other in a manner opposite to the main frame (104); the heat dissipation pipe (242) is a copper pipe, and the heat dissipation fins (241) are aluminum heat dissipation fins (241); a sealing cover (4) is arranged on the water tank (21); and the water cooling pipe (23) is made of glass.

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