Optical device structure and manufacturing method thereof

Abstract

The present invention discloses an optical device structure and a manufacturing method thereof. In the optical device structure and the manufacturing method thereof provided by the present invention, the optical device structure includes: a housing; an optical device and a printed circuit board arranged on the housing, wherein the printed circuit board is stepped toward one end of the optical device, and the lower surface of the stepped surface faces the optical device, and the top surface of the optical device is lower than the top surface of the printed circuit board; and a metal wire connecting the optical device and the lower surface of the printed circuit board. Thus, by making the printed circuit board into a stepped structure, the height difference between one end of the printed circuit board and the optical device can be reduced, and even the two can be flush, so as to achieve a shorter metal wire, thereby reducing the transmission loss of the signal in the gold wire.

Description

Technical Field

[0001] The present invention relates to the display field, and in particular to an optical device structure and a manufacturing method thereof. Background Art

[0002] In optical communication systems, optical modules have become modular units of communication systems. With the diversification of communication services and the improvement of communication reliability, intelligent optical transceiver modules provide an effective means for the realization of a new generation of optical fiber communication systems. Based on the basic functions of electro-optical and photoelectric conversion, optical modules are gradually developing towards high speed, miniaturization, hot pluggability and intelligence. As optical communication systems develop towards high speed and high capacity, the complexity of equipment continues to increase. Therefore, optical modules also put forward higher and higher requirements for printed circuit boards.

[0003] Please refer to Figure 1 , illustrates a schematic diagram of the structure of an optical device in the prior art. The structure 100 includes: a housing 104, an optical device 102 and a printed circuit board 101 arranged on the housing 104, a metal wire 103 respectively realizes electrical connection between the optical device 102 and the printed circuit board 101 through a first wire edge pad 1021 and a second wire edge pad 1011, and the second wire edge pad 1011 is connected to a signal line layer 1012 on the printed circuit board 101.

[0004] But by Figure 1 It can be seen that the two connection plates of the metal wire 103 are not on the same plane, which results in the lengthening of the metal wire 103 used to connect the optical device 102 and the printed circuit board 101, resulting in serious loss of the electrical signal during the transmission process, and the effective transmission of the electrical signal cannot be tested. At present, many optical module manufacturers adjust the overall structure of the optical device to achieve the two connection plates on the same horizontal plane. However, this structure has a large space requirement, which reduces the feasibility of high-density and diversified design to a certain extent. Summary of the invention

[0005] The object of the present invention is to provide an optical device structure and a manufacturing method thereof, so as to shorten metal wires, increase signal transmission speed and reduce signal loss.

[0006] In order to solve the above technical problems, the present invention provides an optical device structure, comprising:

[0007] case;

[0008] An optical device and a printed circuit board are arranged on the housing, wherein one end of the printed circuit board facing the optical device is stepped, and the lower surface of the stepped shape faces the optical device, and the top surface of the optical device is lower than the top surface of the printed circuit board; and

[0009] A metal wire connects the optical device and the lower surface of the printed circuit board.

[0010] Optionally, for the optical device structure, a first wire edge pad is provided on the lower surface of the printed circuit board, a second wire edge pad is provided on the top of the optical device, and the metal wire connects the first wire edge pad and the second wire edge pad.

[0011] Optionally, for the optical device structure, the printed circuit board includes a first printed circuit board material layer and a second printed circuit board material layer, and the second printed circuit board material layer exposes a portion of the first printed circuit board material layer so that one end of the printed circuit board is stepped.

[0012] Optionally, for the optical device structure, the first wire edge pad is arranged on the first printed wiring board material layer, and the second printed wiring board material layer covers a portion of the first wire edge pad.

[0013] Optionally, for the optical device structure, a signal transmission metal layer is provided on the top surface of the printed circuit board.

[0014] Optionally, for the optical device structure, a metal conductor column is provided in the first printed circuit board material layer, and the metal conductor column connects the first wire edge pad and the signal transmission metal layer.

[0015] The present invention also provides a method for manufacturing an optical device structure, comprising:

[0016] Providing a first printed circuit board material layer, wherein a first wire edge pad is disposed on the first printed circuit board material layer;

[0017] Providing a second printed circuit board material layer on the first printed circuit board material layer and covering the first wire edge pad, wherein a signal transmission metal layer is provided on the second printed circuit board material layer;

[0018] Processing the second printed wiring board material layer to form a hole-shaped structure, exposing the first wire edge pad on the first printed wiring board material layer;

[0019] forming a conductive column in the hole-like structure;

[0020] Processing the second printed circuit board material layer to expose a portion of the first wire edge pad to form a printed circuit board with one end in a stepped shape;

[0021] providing a housing;

[0022] placing the first printed circuit board material layer on the housing;

[0023] An optical device is arranged on the housing, with the stepped lower surface facing the optical device; and

[0024] A metal wire is provided to connect the optical device and the first wire edge pad.

[0025] Optionally, in the method for manufacturing the optical device structure, an isolation film is provided on the first wire edge pad.

[0026] Optionally, in the method for manufacturing the optical device structure, the step of forming a conductive column in the hole-shaped structure includes an electrochemical plating process.

[0027] Optionally, the method for manufacturing the optical device structure further includes: after forming a conductive column in the hole-shaped structure; and before processing the second printed circuit board material layer to expose a portion of the first wire edge pad to form a printed circuit board with one end in a stepped shape:

[0028] The printed circuit board material layer is etched to form a conductive line layer.

[0029] In the optical device structure and manufacturing method provided by the present invention, the optical device structure includes: a housing; an optical device and a printed circuit board arranged on the housing, wherein one end of the printed circuit board facing the optical device is in a stepped shape, and the lower surface of the stepped shape faces the optical device, and the top surface of the optical device is lower than the top surface of the printed circuit board; and a metal wire connecting the optical device and the lower surface of the printed circuit board. Thus, by making the printed circuit board into a stepped structure, the height difference between one end of the printed circuit board and the optical device can be reduced, and even the two can be flush, so as to achieve a shorter metal wire, thereby reducing the transmission loss of the signal in the gold wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of an optical device structure in the prior art;

[0031] Figure 2 is a flow chart of a method for manufacturing an optical device structure in one embodiment of the present invention;

[0032] Figure 3 A cross-sectional schematic diagram of forming a printed circuit board material layer in one embodiment of the present invention;

[0033] Figure 4 It is a cross-sectional schematic diagram of etching a printed circuit board material layer in one embodiment of the present invention;

[0034] Figure 5 It is a cross-sectional schematic diagram of forming a second wire edge pad in one embodiment of the present invention;

[0035] Figure 6It is a cross-sectional schematic diagram of forming a signal transmission metal layer in one embodiment of the present invention;

[0036] Figure 7 A cross-sectional schematic diagram of a housing is provided in one embodiment of the present invention;

[0037] Figure 8 It is a cross-sectional schematic diagram of placing a first printed circuit board material layer on a housing in one embodiment of the present invention;

[0038] Fig. 9 FIG. 4 is a cross-sectional schematic diagram of an optical device structure formed in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The optical device structure and the manufacturing method thereof of the present invention will be described in more detail below in conjunction with the schematic diagram, wherein the preferred embodiment of the present invention is shown. It should be understood that those skilled in the art can modify the present invention described herein and still achieve the advantageous effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art and not as a limitation of the present invention.

[0040] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description and claims. It should be noted that the drawings are in very simplified form and in non-precise proportions, and are only used to facilitate and clearly assist in illustrating the purpose of the embodiments of the present invention.

[0041] In the following description, it should be understood that when a layer (or film), region, pattern or structure is referred to as being "on" a housing (or substrate), layer (or film), region and / or pattern, it may be directly on another layer or substrate, and / or there may be an intervening layer. In addition, it should be understood that when a layer is referred to as being "under" another layer, it may be directly under another layer, and / or there may be one or more intervening layers. In addition, references to being "on" and "under" each layer may be made based on the accompanying drawings.

[0042] like Figures 2 to 9 As shown, an embodiment of the present invention provides an optical device structure, including:

[0043] Housing 205;

[0044] An optical device 203 and a printed circuit board are arranged on the housing 205, wherein one end of the printed circuit board facing the optical device 203 is stepped, and the lower surface of the stepped shape faces the optical device 203, and the top surface of the optical device is lower than the top surface of the printed circuit board; and

[0045] The metal wire 204 connects the optical device 203 and the lower surface of the printed circuit board.

[0046] Therefore, by making the printed circuit board into a stepped structure, the height difference between one end of the printed circuit board and the optical device can be reduced, or even the two can be flush, so as to achieve a shorter metal wire and reduce the signal transmission loss in the gold wire.

[0047] The following lists preferred embodiments of the optical device structure and its manufacturing method to clearly illustrate the content of the present invention. It should be clear that the content of the present invention is not limited to the following embodiments, and other improvements through conventional technical means of ordinary technicians in this field are also within the scope of the concept of the present invention.

[0048] like Figure 2 As shown, an embodiment of the present invention provides a method for preparing an optical device structure, comprising the following steps:

[0049] Step S11, providing a first printed circuit board material layer 2025, wherein a first wire edge pad 2021 is provided on the first printed circuit board material layer 2025;

[0050] Step S12, providing a second printed circuit board material layer 2024 on the first printed circuit board material layer 2025 and covering the first wire edge pad 2021, and a signal transmission metal layer 2023 is provided on the second printed circuit board material layer 2024;

[0051] Step S13, processing the second printed circuit board material layer 2024 to form a hole structure 207, exposing the first wire edge pad 2021 on the first printed circuit board material layer 2025;

[0052] Step S14, forming a conductive column 2022 in the hole structure 207;

[0053] Step S15, processing the second printed circuit board material layer 2024 to expose a portion of the first wire edge pad 2021 to form a printed circuit board with one end in a stepped shape;

[0054] Step S16, providing a housing 205;

[0055] Step S17, placing the first printed circuit board material layer 2025 on the housing 205;

[0056] Step S18, arranging the optical device 203 on the housing 205, with the stepped lower surface facing the optical device 203; and

[0057] Step S19 , setting a metal wire 204 to connect the optical device 203 and the first wire edge pad 2021 .

[0058] In step S11, please refer to Figure 3As shown, a first printed wiring board material layer 2025 is provided, and a first wire edge pad 2021 is arranged on the first printed wiring board material layer 2025.

[0059] Specifically, the formation of the first printed circuit board material layer 2025 can be completed by using existing technology, and it can include at least one layer, which will not be described in detail here.

[0060] The first wire edge connecting plate 2021 is mainly made of metal material, such as copper.

[0061] Furthermore, in order to prevent the first wire edge pad 2021 from adhering to other subsequent film layers, an isolation film 206 may be formed on the first wire edge pad 2021 .

[0062] For step S12, please refer to Figure 4 , a second printed circuit board material layer 2024 is provided on the first printed circuit board material layer 2025 and covers the first wire edge pad 2021 , and a signal transmission metal layer 2023 is provided on the second printed circuit board material layer 2024 .

[0063] The first printed circuit board material layer 2024 can be disposed on the first printed circuit board material layer 2025 by lamination, so as to achieve better bonding.

[0064] Next, please refer to Figure 5 For step S13 , the second printed wiring board material layer 2024 is processed to form a hole structure 207 , exposing the first wire edge pad 2021 on the first printed wiring board material layer 2025 .

[0065] In the embodiment of the present invention, for example, drilling can be performed by mechanical processing. In another example, laser etching can be selected to form the hole structure.

[0066] Please refer to Figure 6 For step S14 , a conductive column 2022 is formed in the hole structure 207 .

[0067] In the embodiment of the present invention, for example, an electrochemical plating process is adopted. In addition, for example, other processes such as sputtering and evaporation may be adopted.

[0068] One end of the formed conductive column 2022 is connected to the first wire edge pad 2021, and the other end is connected to the signal transmission metal layer 2023, thereby achieving conductivity.

[0069] During the formation of the conductive pillar 2022, without shielding, the thickness of the signal transmission metal layer 2023 will also increase accordingly. Therefore, the thickness of the signal transmission metal layer 2023 can be appropriately reduced when pre-forming the signal transmission metal layer 2023 according to the actual thickness of the required signal transmission metal layer 2023.

[0070] Then please continue to refer to Figure 6 For step S15, the second printed circuit board material layer 2024 is processed to expose a portion of the first wire edge pad 2021 to form a printed circuit board with one end in a stepped shape.

[0071] Since an isolation film may be provided on the first wire edge pad 2021, partial peeling of the second printed circuit board material layer 2024 becomes simple, and processing can be performed quickly and efficiently.

[0072] For example, mechanical processing may be used to remove part of the second printed wiring board material layer 2024. In addition, for example, dry etching may be used for bombardment removal.

[0073] Please continue to refer to Figure 7 , for step S16, provide a housing 205. In one embodiment, the housing 205 may be a rigid material, such as a glass substrate, a silicon substrate, a metal substrate, etc. In one embodiment, the housing 205 may also be a flexible material, and the material of the housing 205 may be, but is not limited to, acrylic, polymethyl methacrylate (PMMA), polyacrylonitrile-butadiene-styrene (ABS), polyamide (PA), polyimide (PI), etc. In this embodiment, the housing 205 is, for example, a metal substrate, etc. The housing 205 described in the present invention is not limited to the above examples, and may also be made of other materials.

[0074] It is understandable that, in a preferred embodiment, the substrate 1 is pre-treated to remove impurities such as particles, organic matter and metal ions thereon.

[0075] Please refer to Figure 8 , for step S17, the first printed wiring board material layer 2025 is placed on the housing 205. It can be understood that, since structures such as the second printed wiring board material layer 2024 are arranged on the first printed wiring board material layer 2025, these corresponding structures are also arranged on the housing 205 along with the first printed wiring board material layer 2025.

[0076] Then, please refer to Fig. 9 , for step S18, the optical device 203 is disposed on the housing 205, with the stepped lower surface facing the optical device 203; and

[0077] Step S19 , setting a metal wire 204 to connect the optical device 203 and the first wire edge pad 2021 . Specifically, the electrical connection between the optical device 203 and the printed circuit board is achieved through the first wire edge pad 2021 and the second wire edge pad 2031 .

[0078] After the above process, the present invention obtains an optical device structure, including:

[0079] Housing 205;

[0080] An optical device 203 and a printed circuit board are arranged on the housing 205, wherein one end of the printed circuit board facing the optical device 203 is stepped, and the lower surface of the stepped shape faces the optical device 203, and the top surface of the optical device is lower than the top surface of the printed circuit board; and

[0081] The metal wire 204 connects the optical device 203 and the lower surface of the printed circuit board.

[0082] Specifically, by Figure 7 It can be seen that a first wire edge connection plate 2021 is disposed on the top of the optical device 203. A second wire edge connection plate 2031 is disposed on the lower surface.

[0083] The metal wire 204 connects the first wire edge pad 2021 and the second wire edge pad 2031 .

[0084] In one embodiment, the metal wire 204 is made of gold. In addition, materials with higher conductivity, such as silver and copper, can also be selected.

[0085] In one embodiment, a signal transmission metal layer is provided on the top surface of the printed circuit board, and the metal layer realizes signal interaction with external structures.

[0086] In one embodiment, a metal conductor column 2022 is provided in the printed circuit board, and the metal conductor column 2022 connects the second wire edge pad 2031 and the signal transmission metal layer 2023 .

[0087] Compare Figure 1 and Figure 7 It can be seen that the present invention realizes the metal wire by Figure 1 The pattern of the metal wire 103 is shortened to Figure 7 The style of the metal wire 204 and the shortened length are greatly affected by the step groove 206. The length of the metal wire is a key parameter for signal transmission. For example, if the depth of the step groove 206 is 200 microns, the metal wire 204 can be shortened by at least 200 microns, which has a decisive influence on signal transmission.

[0088] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for manufacturing an optical device structure, characterized in that: include: Providing a first printed circuit board material layer (2025), wherein a first wire edge pad (2021) is provided on the first printed circuit board material layer; Providing a second printed circuit board material layer (2024) on the first printed circuit board material layer (2025) and covering the first wire edge pad, wherein a signal transmission metal layer (2023) is provided on the second printed circuit board material layer; Processing the second printed wiring board material layer to form a hole-shaped structure (207) to expose the first wire edge pad on the first printed wiring board material layer; forming a conductive column in the hole-like structure; Processing the second printed circuit board material layer to expose a portion of the first wire edge pad to form a printed circuit board with one end in a stepped shape; providing a housing; Placing the first printed circuit board material layer (2025) on the housing; An optical device is arranged on the housing, with the stepped lower surface facing the optical device; and A metal wire is provided to connect the optical device and the first wire edge pad.

2. The method for manufacturing an optical device structure according to claim 1, characterized in that: An isolation film (206) is provided on the first wire edge connection plate.

3. The method for manufacturing an optical device structure according to claim 1, characterized in that: The step of forming the conductive pillars in the hole structure includes an electrochemical plating process.

4. The method for manufacturing an optical device structure according to claim 1, characterized in that: After forming a conductive pillar in the hole-like structure; An optical device is arranged on the housing, and the stepped lower surface faces the optical device, and further comprises: The printed circuit board material layer is etched to form a conductive line layer.

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