A multi-PP stacked structure fused buried hole induction identification circuit board

Abstract

The present invention discloses a multi-PP stacked fused-filled hole inductive identification circuit board, which includes a circuit board body, a circuit layer and a PP protective layer. The circuit layer is placed between the circuit board body and the PP protective layer to achieve inner layer conduction and blind buried circuit effects. The circuit conduction is achieved by first drilling through holes and then electroplating copper. The through holes are then filled in a laminating manner, and a layer of PP protective layer is pressed on the circuit layer. The present invention also discloses a preparation method and application of the multi-PP stacked fused-filled hole inductive identification circuit board. The multi-PP stacked fused-filled hole inductive identification circuit board disclosed by the present invention has good comprehensive performance and no circuit contact on the surface. It can effectively increase the number of card uses to avoid contact wear, increase market product diversification, and has strong market promotion.

Description

Technical Field

[0001] The invention belongs to the technical field of induction identification circuit boards, and in particular relates to a multi-PP stacked structure fused-filled hole induction identification circuit board. Background Art

[0002] Preschool education is one of the important contents of preschool education and is part of the scientific system of preschool education. Children are the basic stage of intellectual development in life and the fastest developing period. Appropriate and correct preschool education has a great effect on children's intelligence and their future development. A common way to develop preschool education for young children in the prior art is to use circuit board card symbols and recognize online pronunciation through IPAD to achieve enlightenment teaching before preschool. This way of preschool education is easy to implement, can effectively improve students' learning efficiency, and can allow children to receive knowledge education and have fun, making a combination of intelligence and entertainment. Therefore, it has attracted widespread attention as soon as it appeared, and has become one of the main ways of modern preschool education for young children.

[0003] At present, most of the circuit board cards used in the development of preschool education in kindergartens and primary schools on the market are repeaters or point-reading machines, all of which are contact cards. These cards are prone to wear due to multiple contacts and have a low durability, which increases costs, causes unnecessary waste and environmental problems. These problems have stimulated the interest of researchers in the industry in studying contactless circuit board cards. Contactless circuit board cards usually use inductive identification to reduce card contact wear and increase the number of card uses, effectively reducing energy consumption and costs, and can also help solve environmental problems. How to achieve inductive identification and avoid contact wear has become a hot topic that researchers in the industry are currently competing to solve.

[0004] During the use of the existing induction recognition circuit board, due to the single structure of the circuit board, not only the circuit board does not have the waterproof and dustproof performance during the use, but also the circuit board is easy to warp and deform during the use, and the practicality is poor; at the same time, due to the use of solder mask plugging holes in the processing technology of the existing circuit board, there are cavities in the holes, so the reinforcement board has poor waterproof and dustproof performance after the pressing is completed, and the warping is difficult to control, which not only fails to meet the design requirements of the circuit board for customers, but also wastes the loss in the production process of the product.

[0005] Therefore, how to develop a multi-PP stacked structure fused-filled hole inductive identification circuit board with good comprehensive performance, no surface line contact, which can effectively increase the number of card uses and avoid contact wear, increase market product diversification, and have strong market promotion meets market demand, has broad market value and application prospects, and is of great significance to promoting the development of the inductive identification circuit board industry. Summary of the invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a multi-PP stacked fused-filled hole inductive identification circuit board, which designs the card circuit pattern as a blind buried filling method, and the surface is made without a line to avoid contact wear. It has good comprehensive performance and no line contact on the surface, which can effectively increase the number of card uses to avoid contact wear, increase market product diversification, and have strong market promotion. At the same time, the present invention also provides a preparation method for the multi-PP stacked fused-filled hole inductive identification circuit board, which is simple and easy to implement, has low requirements on equipment and preparation conditions, has high production efficiency and yield, low production cost, and is suitable for continuous large-scale production.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a multi-PP stacked fused-filled hole induction identification circuit board, characterized in that it includes a circuit board body, a circuit layer and a PP protective layer, the circuit layer is placed between the circuit board body and the PP protective layer to achieve inner layer conduction and blind buried circuit effects; the circuit conduction is achieved by first drilling through holes and then electroplating copper; then the through holes are filled by lamination, and a layer of PP protective layer is pressed on the circuit layer.

[0008] Preferably, the thickness of the PP protective layer is 0.5-0.7 mm.

[0009] Preferably, the circuit board body and the circuit layer, and the circuit layer and the PP protective layer are bonded independently by pressure-sensitive adhesive.

[0010] Another object of the present invention is to provide a method for preparing the multi-PP stacked structure melt-filled hole induction identification circuit board, characterized in that it includes the following steps:

[0011] Step S1, cutting: cutting a plate of a certain size into substrates to be processed;

[0012] Step S2, drilling through holes: drilling through holes at corresponding positions of the substrate manufactured in step S1 according to the requirements;

[0013] Step S3, electroplating: copper is plated on the surface and inside of the through-holes of the substrate drilled in step S2 by current effect;

[0014] Step S4, inner layer layout: fill the through holes on the substrate that has completed the S3 process with PP resin by laminating under vacuum conditions to ensure that the resin fills the through holes and polishes the surface of the filled holes to make them smooth; then coat the substrate that has completed the S3 process with pressure-sensitive adhesive, and then lay the circuit pattern on the inner layer according to the design requirements to form a circuit layer;

[0015] Step S5, lamination: coating the circuit layer processed in step S4 with a pressure-sensitive adhesive, and then laminating the PP protective layer on the circuit layer;

[0016] Step S6, drilling positioning holes to form an outer layer: drilling positioning holes on the substrate manufactured in step S5 according to design requirements to form an outer layer;

[0017] Step S7, solder mask and text: the outer surface obtained in step S6 is subjected to solder mask treatment, and then text operation is performed to obtain a semi-finished circuit board;

[0018] Step S8, gong shaping: the circuit board processed in step S7 is gong-shaped, and then extruded to make a multi-PP stacked structure melt-filled hole sensing identification circuit board.

[0019] Preferably, during the extrusion molding in step S8, a release film is provided between the extrusion surface and the finished circuit board for easy demolding.

[0020] Preferably, the cooling rate during the extrusion molding process is 0.95°C / min to 1.15°C / min.

[0021] Preferably, the pressure-sensitive adhesive in step S4 and step S5 is independently at least one of epoxy resin pressure-sensitive adhesive, acrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive and silicone pressure-sensitive adhesive.

[0022] Another object of the present invention is to provide an application of the multi-PP stacked fused-filled hole induction identification circuit board in preschool education.

[0023] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a multi-PP stacked fused-filled hole inductive identification circuit board, which designs the card circuit pattern as a blind buried filling method, and the surface is made without a line to avoid contact wear, has good comprehensive performance, and has no line contact on the surface, which can effectively increase the number of card uses to avoid contact wear, increase market product diversification, and has strong market promotion; at the same time, the present invention also provides a preparation method for the multi-PP stacked fused-filled hole inductive identification circuit board, which is simple and easy to implement, has low requirements on equipment and preparation conditions, has high production efficiency and yield, low production cost, and is suitable for continuous large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0025] Figure 1 The present invention is a process flow chart for preparing a multi-PP stacked structure melt-filled hole sensing identification circuit board. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention will be described in detail below.

[0027] A multi-PP stacked fused-filled hole induction identification circuit board, characterized in that it includes a circuit board body, a circuit layer and a PP protective layer, the circuit layer is placed between the circuit board body and the PP protective layer to achieve inner layer conduction and blind buried circuit effects; the circuit conduction is achieved by first drilling through holes and then electroplating copper; then the through holes are filled in a laminating manner, and a layer of PP protective layer is pressed on the circuit layer.

[0028] Preferably, the thickness of the PP protective layer is 0.5-0.7 mm.

[0029] Preferably, the circuit board body and the circuit layer, and the circuit layer and the PP protective layer are bonded independently by pressure-sensitive adhesive.

[0030] Another object of the present invention is to provide a method for preparing the multi-PP stacked structure melt-filled hole induction identification circuit board, characterized in that it includes the following steps:

[0031] Step S1, cutting: cutting a plate of a certain size into substrates to be processed;

[0032] Step S2, drilling through holes: drilling through holes at corresponding positions of the substrate manufactured in step S1 according to the requirements;

[0033] Step S3, electroplating: copper is plated on the surface and inside of the through-holes of the substrate drilled in step S2 by current effect;

[0034] Step S4, inner layer layout: fill the through holes on the substrate that has completed the S3 process with PP resin by laminating under vacuum conditions to ensure that the resin fills the through holes and polishes the surface of the filled holes to make them smooth; then coat the substrate that has completed the S3 process with pressure-sensitive adhesive, and then lay the circuit pattern on the inner layer according to the design requirements to form a circuit layer;

[0035] Step S5, lamination: coating the circuit layer processed in step S4 with a pressure-sensitive adhesive, and then laminating the PP protective layer on the circuit layer;

[0036] Step S6, drilling positioning holes to form an outer layer: drilling positioning holes on the substrate manufactured in step S5 according to design requirements to form an outer layer;

[0037] Step S7, solder mask and text: the outer surface obtained in step S6 is subjected to solder mask treatment, and then text operation is performed to obtain a semi-finished circuit board;

[0038] Step S8, gong shaping: the circuit board processed in step S7 is gong-shaped, and then extruded to make a multi-PP stacked structure melt-filled hole sensing identification circuit board.

[0039] Preferably, during the extrusion molding in step S8, a release film is provided between the extrusion surface and the finished circuit board for easy demolding.

[0040] Preferably, the cooling rate during the extrusion molding process is 0.95°C / min to 1.15°C / min.

[0041] Preferably, the pressure-sensitive adhesive in step S4 and step S5 is independently at least one of epoxy resin pressure-sensitive adhesive, acrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive and silicone pressure-sensitive adhesive.

[0042] Another object of the present invention is to provide an application of the multi-PP stacked fused-filled hole induction identification circuit board in preschool education.

[0043] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a multi-PP stacked fused-filled hole inductive identification circuit board, which designs the card circuit pattern as a blind buried filling method, and the surface is made without a line to avoid contact wear, has good comprehensive performance, and has no line contact on the surface, which can effectively increase the number of card uses to avoid contact wear, increase market product diversification, and has strong market promotion; at the same time, the present invention also provides a preparation method for the multi-PP stacked fused-filled hole inductive identification circuit board, which is simple and easy to implement, has low requirements on equipment and preparation conditions, has high production efficiency and yield, low production cost, and is suitable for continuous large-scale production.

[0044] The present invention will be further described below in conjunction with specific embodiments, but the protection scope of the present invention is not limited thereto:

[0045] Example 1

[0046] Embodiment 1 provides a multi-PP stacked fused-filled hole sensing identification circuit board, characterized in that it includes a circuit board body, a circuit layer and a PP protective layer, the circuit layer is placed between the circuit board body and the PP protective layer to achieve inner layer conduction and blind buried circuit effects; the circuit conduction is achieved by first drilling through holes and then electroplating copper; then the through holes are filled by lamination, and a layer of PP protective layer is pressed on the circuit layer.

[0047] The thickness of the PP protective layer is 0.5 mm; the circuit board body and the circuit layer, and the circuit layer and the PP protective layer are independently bonded by pressure-sensitive adhesive.

[0048] A method for preparing the multi-PP stacked melt-filled hole induction identification circuit board is characterized by comprising the following steps:

[0049] Step S1, cutting: cutting a plate of a certain size into substrates to be processed;

[0050] Step S2, drilling through holes: drilling through holes at corresponding positions of the substrate manufactured in step S1 according to the requirements;

[0051] Step S3, electroplating: copper is plated on the surface and inside of the through-holes of the substrate drilled in step S2 by current effect;

[0052] Step S4, inner layer layout: fill the through holes on the substrate that has completed the S3 process with PP resin by laminating under vacuum conditions to ensure that the resin fills the through holes and polishes the surface of the filled holes to make them smooth; then coat the substrate that has completed the S3 process with pressure-sensitive adhesive, and then lay the circuit pattern on the inner layer according to the design requirements to form a circuit layer;

[0053] Step S5, lamination: coating the circuit layer processed in step S4 with a pressure-sensitive adhesive, and then laminating the PP protective layer on the circuit layer;

[0054] Step S6, drilling positioning holes to form an outer layer: drilling positioning holes on the substrate manufactured in step S5 according to design requirements to form an outer layer;

[0055] Step S7, solder mask and text: the outer surface obtained in step S6 is subjected to solder mask treatment, and then text operation is performed to obtain a semi-finished circuit board;

[0056] Step S8, gong shaping: the circuit board processed in step S7 is gong-shaped, and then extruded to make a multi-PP stacked structure melt-filled hole sensing identification circuit board.

[0057] Preferably, during the extrusion molding in step S8, a release film is provided between the extrusion surface and the finished circuit board for easy demolding.

[0058] Preferably, the cooling rate during the extrusion molding process is 0.95° C. / min; the pressure-sensitive adhesives in step S4 and step S5 are independently epoxy resin pressure-sensitive adhesives.

[0059] An application of the multi-PP stacked structure fused-filled hole induction recognition circuit board in preschool education.

[0060] Example 2

[0061] Example 2 provides a multi-PP stacked melt-filled hole sensing identification circuit board, which is basically the same as Example 1, except that the thickness of the PP protective layer is 0.55 mm; the cooling rate during the extrusion molding process is 0.98°C / min; the pressure-sensitive adhesives in step S4 and step S5 are independently acrylic pressure-sensitive adhesives.

[0062] Example 3

[0063] Example 3 provides a multi-PP stacked melt-filled hole sensing identification circuit board, which is basically the same as Example 1, except that the thickness of the PP protective layer is 0.6 mm; the cooling rate during the extrusion molding process is 1°C / min; the pressure-sensitive adhesives in step S4 and step S5 are independently polyurethane pressure-sensitive adhesives.

[0064] Example 4

[0065] Example 4 provides a multi-PP stacked melt-filled hole sensing identification circuit board, which is basically the same as Example 1, except that the thickness of the PP protective layer is 0.65 mm; the cooling rate during the extrusion molding process is 1.1°C / min; the pressure-sensitive adhesives in step S4 and step S5 are independently silicone pressure-sensitive adhesives.

[0066] Example 5

[0067] Example 5 provides a multi-PP stacked melt-filled hole sensing identification circuit board, which is basically the same as Example 1, except that the thickness of the PP protective layer is 0.7 mm; the cooling rate in the extrusion molding process is 1.15°C / min; the pressure-sensitive adhesives in step S4 and step S5 are independently epoxy resin pressure-sensitive adhesives, acrylate pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives, and silicone pressure-sensitive adhesives mixed in a mass ratio of 1:2:3:1.

[0068] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-PP stacked structure fused buried hole induction identification circuit board, characterized in that: It includes a circuit board body, a circuit layer and a PP protective layer. The circuit layer is placed between the circuit board body and the PP protective layer to achieve inner layer conduction and blind buried circuit effect. It is made by drilling through holes first and then electroplating copper to achieve circuit conduction. Then, the through holes are filled by lamination, and a PP protective layer is pressed on the circuit layer. The thickness of the PP protective layer is 0.5-0.7 mm; The circuit board body and the circuit layer, and the circuit layer and the PP protective layer are bonded independently by pressure-sensitive adhesive; The method for preparing the multi-PP stacked melt-filled hole induction identification circuit board is characterized by comprising the following steps: Step S1, cutting: cutting a plate of a certain size into substrates to be processed; Step S2, drilling through holes: drilling through holes at corresponding positions of the substrate manufactured in step S1 according to the requirements; Step S3, electroplating: copper is plated on the surface and inside of the through-holes of the substrate drilled in step S2 by current effect; Step S4, inner layer layout: fill the through holes on the substrate that has completed the S3 process with PP resin by laminating under vacuum conditions to ensure that the resin fills the through holes and polishes the surface of the filled holes to make them smooth; then coat the substrate that has completed the S3 process with pressure-sensitive adhesive, and then lay the circuit pattern on the inner layer according to the design requirements to form a circuit layer; Step S5, lamination: coating the circuit layer processed in step S4 with a pressure-sensitive adhesive, and then laminating the PP protective layer on the circuit layer; Step S6, drilling positioning holes to form an outer layer: drilling positioning holes on the substrate manufactured in step S5 according to design requirements to form an outer layer; Step S7, solder mask and text: the outer surface obtained in step S6 is subjected to solder mask treatment, and then text operation is performed to obtain a semi-finished circuit board; Step S8, gong shape: the circuit board processed in step S7 is gong-shaped, and then extruded to make a multi-PP stacked structure melt-filled hole sensing identification circuit board; The cooling rate during the extrusion molding process is between 0.95°C / min and 1.15°C / min; The pressure-sensitive adhesives in step S4 and step S5 are independently at least one of epoxy resin pressure-sensitive adhesive, acrylate pressure-sensitive adhesive, polyurethane pressure-sensitive adhesive, and silicone pressure-sensitive adhesive.

2. According to claim 1, a multi-PP stacked structure fused buried hole induction identification circuit board is characterized in that: During the extrusion molding in step S8, a release film is provided between the extrusion surface and the finished circuit board for easy demoulding.

3. An application of a multi-PP stacked fused-filled hole sensing identification circuit board according to any one of claims 1-2 in preschool education.

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