Display device and method for manufacturing the same

Abstract

A display device and a method for manufacturing the display device are provided. The display device includes a display panel and a first flexible printed circuit board bonded to a side surface of the display panel. The display panel includes a first substrate, a first extension line, a first recess, and a first pad, wherein the first extension line is on a top surface of the first substrate, the top surface is parallel to a first direction and a second direction, the second direction is perpendicular to the first direction, the first recess is at a side surface of the first substrate, and the first pad extends from the first extension line in a third direction perpendicular to the first direction and the second direction, the first pad is arranged in the first recess, and the first extension line and the first pad include the same material.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0110794, filed on September 6, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The described technology generally relates to display devices and methods of manufacturing display devices. Background Art

[0004] Various display devices such as a liquid crystal display (LCD), an organic light emitting diode display (OLED), a quantum dot display device, and the like include a display panel formed with pixels that can display an image and a driving circuit that can drive the display panel.

[0005] The display panel includes a display area in which pixels are formed. A frame area as a peripheral area where no image is displayed may be positioned around the display area. Various driving circuits and wirings may be located in the frame area.

[0006] Recently, research and development of a side bonding technology for bonding integrated circuits (ICs), other printed circuits, and wirings to the sides of a display panel to reduce a non-display peripheral area has been actively conducted.

[0007] The above information disclosed in this Background section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art. Summary of the invention

[0008] Embodiments are directed to providing a display device in which wiring at the front side of the display device and pads at the side surface of the display device can be formed together. After cutting a motherboard and forming pads at the side surface of the display device, the wiring and the pads are formed together without an additional process for polishing the side surface of the display panel. In this way, the process is simplified and the manufacturing cost is reduced.

[0009] In addition, the embodiment is directed to providing a display device capable of preventing short circuit of wiring by increasing the contact area of ​​pads located on the side of the display device. Preventing short circuit of wiring prevents occurrence of defects and improves efficiency by reducing contact resistance.

[0010] A display device according to an embodiment includes a display panel and a first flexible printed circuit board bonded to a side surface of the display panel, wherein the display panel includes a first substrate, a first extension line, a first recess and a first pad, wherein the first extension line is on a top surface of the first substrate, the top surface is parallel to a first direction and a second direction, the second direction is perpendicular to the first direction, the first recess is arranged at the side surface of the first substrate, and the first pad extends from the first extension line in a third direction perpendicular to the first direction and the second direction, the first pad is arranged in the first recess, and the first extension line and the first pad include the same material.

[0011] The display panel may further include a data line transmitting a data voltage, and the first extension line may be arranged in the same layer as the data line.

[0012] The display panel may further include a gate line transmitting a gate signal, and the first extension line may be arranged in the same layer as the gate line.

[0013] The first flexible printed circuit board may be coupled to the first recess and connected to the first pad.

[0014] The display device according to an embodiment may further include a second flexible printed circuit board coupled to a side surface of the display panel, wherein the display panel may further include a second recess at the side surface of the first substrate, a second extension line on the top surface of the first substrate, and a second pad extending from the second extension line in a third direction, the second pad being arranged in the second recess, and the second flexible printed circuit board may be coupled to the second recess and may be connected to the second pad.

[0015] The display panel may further include a first protrusion disposed between the first recess and the second recess.

[0016] The display device according to an embodiment may further include an anisotropic conductive film disposed between the first flexible printed circuit board and the first pad.

[0017] The display device according to an embodiment may further include a second flexible printed circuit board coupled to a side surface of the display panel, wherein the second flexible printed circuit board may be coupled to the first concave portion.

[0018] The first flexible printed circuit board may include a driver integrated circuit (IC).

[0019] A manufacturing method of a display device according to an embodiment includes: forming a through hole along a cutting line of a motherboard; forming a conductive layer and a photoresist layer on the motherboard; forming a photoresist pattern by developing and exposing the photoresist layer; forming a conductive pattern by etching the conductive layer; and cutting the motherboard along the cutting line so as to pass through the through hole.

[0020] Forming the conductive pattern includes etching a conductive layer disposed on a top surface of the mother substrate and disposed on an inner wall of the through hole.

[0021] In forming the conductive pattern, the extension line may be formed on the mother board, and the pad may be formed on the inner wall of the through hole.

[0022] In forming the conductive pattern, the data line and the pad may be formed together on the mother board.

[0023] In forming the conductive pattern, the gate line and the pad may be formed together on the mother substrate.

[0024] In cutting the mother board along the cutting lines so as to pass through the through holes, the mother board is cut into a plurality of unit boards, and each of the plurality of unit boards may include a first recess formed by cutting a first through hole among the through holes.

[0025] In cutting the mother board along the cutting line so as to pass through the through holes, the unit board may further include a second recessed portion formed by cutting a second through hole among the through holes.

[0026] The manufacturing method of the display device may further include bonding the flexible printed circuit boards after cutting the mother board, wherein bonding the flexible printed circuit boards may be performed by bonding the first flexible printed circuit board to the first concave portion and bonding the second flexible printed circuit board to the second concave portion.

[0027] In cutting the mother substrate, the protrusion may be formed between the first recess and the second recess.

[0028] The manufacturing method of the display device may further include bonding a flexible printed circuit board to the first concave portion after cutting the mother board.

[0029] Bonding the flexible printed circuit board may be performed by placing an anisotropic conductive film between the flexible printed circuit board and the pad and performing compression at a high pressure or a high temperature.

[0030] According to an embodiment, the wiring at the front side of the display device and the pad at the side surface of the display device can be formed together. After cutting the mother board and forming the pad at the side surface of the display device, the wiring and the pad are formed together without an additional process for polishing the side surface of the display panel. In this way, the process is simplified and the manufacturing cost is reduced.

[0031] In addition, the embodiment is directed to providing a display device capable of preventing short circuit of wiring by increasing the contact area of ​​pads located on the side of the display device. Preventing short circuit of wiring prevents occurrence of defects and improves efficiency by reducing contact resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1is a perspective view of a display device according to an embodiment.

[0033] Figure 2 According to the embodiment, it is taken along line II-II' Figure 1 A cross-sectional view of a display device.

[0034] Figure 3 According to the embodiment, it is taken along line II-II' Figure 1 A cross-sectional view of a display device.

[0035] Figure 4 is a flowchart of a method for manufacturing a display device according to an embodiment.

[0036] Figure 5 is a top plan view of a motherboard according to an embodiment.

[0037] Figure 6 is along Figure 5 VI-VI' is a cross-sectional view of a process of a method for manufacturing a display device according to an embodiment, taken along line VI-VI'.

[0038] Figure 7 is along Figure 5 VI-VI' is a cross-sectional view of a process of a method for manufacturing a display device according to an embodiment, taken along line VI-VI'.

[0039] Figure 8 is along Figure 5 VI-VI' is a cross-sectional view of a process of a method for manufacturing a display device according to an embodiment, taken along line VI-VI'.

[0040] Fig. 9 The process of the method for manufacturing a display device according to the embodiment Figure 5 An enlarged perspective view of portion A in FIG.

[0041] Fig.10 According to the implementation method Fig. 9 An enlarged view of part B.

[0042] Fig.11 It is a perspective view showing the process of the manufacturing method of the embodiment.

[0043] Fig.12 It is a perspective view showing the process of the manufacturing method of the embodiment.

[0044] Fig.13 is a perspective view of a display device according to an embodiment.

[0045] Fig.14 is a top plan view of a motherboard according to an embodiment.

[0046] Fig.15 It is a perspective view showing the process of the manufacturing method of the embodiment.

[0047] Fig.16 It is a perspective view showing the process of the manufacturing method of the embodiment. DETAILED DESCRIPTION

[0048] The inventive concept will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments are shown. As those skilled in the art would appreciate, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the inventive concept.

[0049] The drawings and description are to be regarded as illustrative in nature, and not restrictive.Throughout the specification, like reference numerals designate like elements.

[0050] In addition, in the drawings, for better understanding and ease of description, the size and thickness of each element are arbitrarily represented. In the drawings, for clarity, the thickness of layers, films, panels, regions, etc. are exaggerated. In the drawings, for better understanding and ease of description, the thickness of some layers and regions are exaggerated.

[0051] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element, or intervening elements may also be present. Conversely, when an element is referred to as being "directly" "on" another element, there are no intervening elements. Furthermore, throughout the specification, information "on" a target element will be understood as being positioned above or below the target element, and not necessarily as being positioned "at the upper side" based on the opposite direction of gravity.

[0052] In addition, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” or “comprising” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0053] In addition, in the present specification, the phrase "on a plane" means observing the target portion from the top, and the phrase "on a cross section" means observing a cross section formed by vertically cutting the target portion from the side.

[0054] In the following, reference will be made to Figure 1 A display device 10 according to an embodiment is described. Figure 1 is a perspective view of a display device 10 according to an embodiment.

[0055] The display device 10 according to the embodiment includes display panels 100 and 200 and a flexible printed circuit board 300. The display panels 100 and 200 (sometimes referred to as first and second display panels 100 and 200, respectively) face each other.

[0056] The display device 10 according to the embodiment may be a liquid crystal layer 3 (see Figure 2 ) is a liquid crystal display (LCD) positioned between the first display panel 100 and the second display panel 200. Alternatively, the display device 10 according to the embodiment may be an organic light emitting diode display (OLED) including an organic light emitting diode. In this case, at least one of the first display panel 100 and the second display panel 200 may include a touch electrode (not shown) capable of sensing a touch from the outside.

[0057] The display panels 100 and 200 of the display device 10 according to the embodiment include a display area DA displaying an image and a peripheral area PA positioned around the display area DA and not displaying an image. The peripheral area PA may be positioned to surround the display area DA.

[0058] Pixels PX and signal lines are arranged in the display area DA.

[0059] As a unit that can display an image, the pixel PX may include at least one pixel electrode, and emit light having brightness corresponding to a grayscale of an input image signal.

[0060] The signal line includes a gate line 121 and a data line 171. The gate line 121 and the data line 171 may be arranged to intersect each other while being insulated from each other. The gate line 121 extends in a first direction DR1 and is connected to the pixel PX to transmit a gate signal. The data line 171 extends in a second direction DR2 and is connected to the pixel PX to transmit a data voltage corresponding to an image signal. The first direction DR1 and the second direction DR2 intersect and are perpendicular to each other. The first direction DR1 and the second direction DR2 may be parallel to a plane direction including the top surface of the display panel 100 and the display panel 200.

[0061] The recesses 1001 and the protrusions 1002, which are alternately arranged, are positioned at the side surface of the first display panel 100. The recesses 1001 are grooves formed in the side surface of the first display panel 100, and the protrusions 1002 are portions protruding with respect to the recesses 1001.

[0062] The flexible printed circuit board 300 is coupled to the concave portion 1001 of the first display panel 100. Each flexible printed circuit board 300 includes a driver integrated circuit (IC) 350. The protrusion 1002 of the first display panel 100 is arranged between the flexible printed circuit boards 300. The driver IC 350 may be a gate driver IC that generates a gate signal. In this case, the driver IC 350 may be electrically connected to the gate line 121 of the display area DA.

[0063] Unlike this, the driver IC 350 of the flexible printed circuit board 300 may be a data driver IC that generates a data voltage that is a grayscale voltage corresponding to an input image signal. In this case, the driver IC 350 may be electrically connected to the data line 171 of the display area DA.

[0064] According to an embodiment, the gate driver is formed at the same time as the manufacturing process of the transistor driving the pixel PX and is thus installed in the first display panel 100 in the form of an amorphous silicon TFT gate driver circuit (ASG) or an oxide silicon TFT gate driver circuit (OSG).

[0065] exist Figure 1 In the embodiment of the present invention, the flexible printed circuit board 300 is arranged to be closer to the inner side than the protrusion 1002 , but this is not limitative. One side of the flexible printed circuit board 300 may protrude more than the protrusion 1002 .

[0066] In the following, reference will be made to Figure 2 A display device 10 according to an embodiment is described. Figure 2 It is taken along the II-II' line Figure 1 A cross-sectional view of the Figure 2 In the example, Figure 1 The display device 10 is a liquid crystal display (LCD).

[0067] Reference Figure 2 , the first display panel 100 includes a first substrate 110. A first wiring layer including a gate line 121 and a gate electrode 124 is disposed on the first substrate 110. The first wiring layer may include a metal such as molybdenum, aluminum, silver, copper, chromium, tantalum, titanium, or an alloy of one or more of the metals.

[0068] A gate insulating layer 140 is disposed on the first wiring layer. A semiconductor layer 154 is disposed on the gate insulating layer 140. The semiconductor layer 154 may include amorphous silicon, an oxide semiconductor, and the like.

[0069] A second wiring layer including a data line 171, a source electrode 173, and a drain electrode 175 is disposed on the semiconductor layer 154. An ohmic contact 163 is disposed between the semiconductor layer 154 and the data line 171, between the semiconductor layer 154 and the source electrode 173, and between the semiconductor layer 154 and the drain electrode 175. The second wiring layer may include a metal such as molybdenum, chromium, copper, aluminum, tantalum, titanium, or an alloy of one or more of the plurality of metals.

[0070] The second wiring layer also includes a first extension line 51a and a first pad 52a arranged in the peripheral area PA. The first extension line 51a may be positioned on the top surface of the first substrate 110 and may be connected to the first wiring layer or the second wiring layer of the display area DA. When the first extension line 51a is connected to the first wiring layer, the first extension line 51a may be connected to the first wiring layer through an opening (not shown) positioned in the gate insulating layer 140.

[0071] The first pad 52a extends from the first extension line 51a and extends in the third direction DR3 from the recess 1001 positioned in the side surface of the first display panel 100. The third direction DR3 is perpendicular to the first direction DR1 and the second direction DR2. In this case, the first pad 52a may extend along the side surface of the gate insulating layer 140 or the first substrate 110. The first pad 52a may be formed together with the second wiring layer, and thus may include the same material as the first extension line 51a and the data line 171.

[0072] The gate electrode 124 , the source electrode 173 , and the drain electrode 175 form a thin film transistor (TFT) together with the semiconductor layer 154 , and a channel of the thin film transistor may be disposed in the semiconductor layer 154 between the source electrode 173 and the drain electrode 175 .

[0073] A first insulating layer 160 is disposed on the gate insulating layer 140 , the source electrode 173 , and the drain electrode 175 .

[0074] A color filter 170 is disposed on the first insulating layer 160. The color filter 170 may include a red color filter, a green color filter, and a blue color filter. Figure 2 The color filter 170 may be included in the first display panel 100 , but the color filter 170 may be included in the second display panel 200 .

[0075] An organic insulator 180 is disposed on the color filter 170. An opening 81 extending to the drain electrode 175 and exposing the drain electrode 175 is disposed in the first insulating layer 160, the color filter 170, and the organic insulator 180.

[0076] A pixel electrode 191 is positioned on the organic insulator 180 in the display area DA. The pixel electrode 191 is connected to the drain electrode 175 through the opening 81.

[0077] The pixel electrode 191 may include a transparent conductive material such as ITO or IZO.

[0078] A sealant 35 is positioned on the organic insulator 180 in the peripheral area PA. The sealant 35 may be positioned to surround the display area DA in the peripheral area PA and seal liquid crystal molecules 31 of the liquid crystal layer 3 to be described later.

[0079] Hereinafter, the second display panel 200 will be described.

[0080] The second display panel 200 includes a second substrate 210. A common electrode 270 is disposed below the second substrate 210. The common electrode 270 is connected to a common voltage line (not shown) and receives a common voltage. The common electrode 270 may include a transparent conductive material such as ITO and IZO.

[0081] The liquid crystal layer 3 is disposed between the first display panel 100 and the second display panel 200. The liquid crystal layer 3 includes liquid crystal molecules 31. The plurality of liquid crystal molecules 31 may be oriented by an electric field generated by a voltage applied to the pixel electrode 191 and the common electrode 270, and thus may represent a gray scale by adjusting the polarization of incident light. The liquid crystal molecules 31 may have negative dielectric anisotropy, and in a state where there is no electric field in the liquid crystal layer 3, the plurality of liquid crystal molecules 31 may be oriented so that the plurality of long axes of the plurality of liquid crystal molecules 31 are generally tilted perpendicularly to the surface of the first substrate 110, or tilted perpendicularly to the surface of the first substrate 110 at a predetermined angle.

[0082] An alignment layer (not shown) may be positioned between the pixel electrode 191 and the liquid crystal layer 3 and between the common electrode 270 and the liquid crystal layer 3 .

[0083] The flexible printed circuit board 300 is positioned to face the first pad 52a in the recess 1001 of the first display panel 100. An anisotropic conductive film 400 is positioned between the flexible printed circuit board 300 and the first display panel 100. The anisotropic conductive film 400 may include conductive balls and may electrically connect the flexible printed circuit board 300 and the first pad 52a of the first display panel 100.

[0084] In the following, reference will be made to Figure 3 A display device 10 according to an embodiment is described. Figure 3 is a cross-sectional view of a display device 10 according to an embodiment. Specifically, Figure 3 It is based on the interception along line II-II' Figure 1 A cross-sectional view of a display device 10 according to an embodiment of the present invention.

[0085] Reference Figure 3 , the first wiring layer further includes a second extension line 51b and a second pad 52b arranged in the peripheral area PA. The second extension line 51b is positioned on the top surface of the first substrate 110 and may be connected to the first wiring layer or the second wiring layer of the display area DA. When the second extension line 51b is connected to the second wiring layer, the second extension line 51b may be connected to the second wiring layer through an opening (not shown) positioned in the gate insulating layer 140.

[0086] The second pad 52b extends from the second extension line 51b and extends in the third direction DR3 from the recess 1001 positioned in the side surface of the first display panel 100. In this case, the second pad 52b may extend along the side surface of the first substrate 110. The second pad 52b may be formed together when the first wiring layer is formed, and thus may include the same material as the second extension line 51b and the gate line 121.

[0087] In the following, reference will be made to Figures 4 to 12 A method of manufacturing the display device 10 according to the embodiment is described. Figure 4 is a flowchart of a method for manufacturing the display device 10 according to the embodiment. Figures 5 to 12 Processing stages of a method for manufacturing the display device 10 according to the embodiment are shown.

[0088] Specifically, Figure 5 is a top plan view of the motherboard 11 . Figures 6 to 8 is along Figure 5 1 is a cross-sectional view of various processing stages of a method for manufacturing the display device 10 according to an embodiment, taken along line VI-VI′. Fig. 9 is a process step in a method for manufacturing the display device 10 according to an embodiment. Figure 5 An enlarged perspective view of portion A in FIG. Fig.10 yes Fig. 9 An enlarged view of part B. Fig.11 and Fig.12 are perspective views of various processing stages of the manufacturing method of the embodiment.

[0089] First, refer to Figure 4 and Figure 5 , in operation S101, a through hole 1001a is formed in the motherboard 11. The motherboard 11 includes a cutting line CL extending in the first direction DR1 and the second direction DR2, and includes unit boards 110' separated by the cutting line CL. Each unit board 110' may correspond to the first substrate 110 included in a single display device 10 after cutting of the motherboard 11. The cutting line CL may be a line actually arranged in the motherboard 11, but this is not restrictive. The cutting line CL may be a virtual line. Alternatively, the cutting line CL may be displayed on the motherboard 11 in a form other than a line, and may have any shape indicating a cutting position.

[0090] Each through hole 1001a may be formed to penetrate the mother board 11 in the thickness direction of the mother board 11. The through holes 1001a may be formed in lines along the cutting lines CL. The through holes 1001a may be formed to overlap the cutting lines CL. Fig. 9 and Fig.10Since the through hole 1001a is formed along the cutting line CL, the cutting line CL is positioned on the inner wall of the through hole 1001a formed in the mother board 11 and may also extend in the thickness direction of the mother board 11. A portion of one through hole 1001a may be positioned in one of two adjacent unit boards 110', and the remaining portion of the through hole 1001a may be formed in the other of the two unit boards 110'.

[0091] Next, refer to Figure 4 and Figure 6 In operation S102, a conductive layer 50' and a photoresist layer PRL are formed on the mother board 11. The conductive layer 50' and the photoresist layer PRL are also formed on the inner wall of the through hole 1001a. The photoresist layer PRL may be made of a positive resist or a negative resist.

[0092] Next, refer to Figure 4 and Figure 7 , in operation S103, the photoresist layer PRL is exposed and developed to form a photoresist pattern PRP. When forming the photoresist pattern PRP, a photomask may be used. A photomask having a transmission portion and a blocking portion may be arranged on the photoresist layer PRL, and light may be set on the photomask to expose and develop the photoresist layer PRL to form the photoresist pattern PRP. The photomask may be a halftone mask including a transflective portion. The photomask may be used to control the transmittance of each zone, and the photoresist layer PRL positioned on the top surface of the mother board 11 and the inner wall of the through hole 1001a may be exposed and developed together.

[0093] When the photoresist layer PRL is made of a positive resist, the exposed portion of the photoresist layer PRL is removed. In this case, the photomask has a blocking portion in an area corresponding to an area where wiring is to be formed. On the other hand, when the photoresist layer PRL is made of a negative resist, the exposed portion of the photoresist layer PRL remains. In this case, the photomask has a transmissive portion in an area corresponding to an area where wiring is to be formed.

[0094] Next, refer to Figure 4 , Figure 8 , Fig. 9 and Fig.10 In operation S104, the conductive layer 50' is etched to form the conductive patterns 50, 51, and 52 and the photoresist pattern PRP is removed. At this time, the conductive layer 50' positioned on the inner wall of the through hole 1001a is also etched. The conductive patterns 50, 51, and 52 may be Figure 2 and Figure 3The conductive pattern 50, the conductive pattern 51 and the conductive pattern 52 include the wiring pattern 50, the extension line 51 and the pad 52. When the conductive pattern 50, the conductive pattern 51 and the conductive pattern 52 are Figure 3 When the first wiring layer is formed, the extension line 51 and the pad 52 may include Figure 3 When the conductive pattern 50, the conductive pattern 51 and the conductive pattern 52 are Figure 2 When the second wiring layer is formed, the extension line 51 and the pad 52 may include Figure 2 The first extension line 51a and the first pad 52a of the display device 10 are shown.

[0095] Next, refer to Figure 4 and Fig.11 In operation S105, the motherboard 11 is cut along the cutting line CL. The motherboard 11 may be cut along the cutting line CL in the thickness direction of the motherboard 11. The motherboard 11 is cut so as to pass through the through holes 1001a arranged in a line, and the side surface of the first display panel 100 around the through holes 1001a forms a concave portion 1001, and the cut surface forms a protrusion 1002. The pad 52 is arranged in the concave portion 1001 of the first display panel 100.

[0096] The manufacturing method may further include bonding the second display panel 200 before cutting the mother substrate 11 .

[0097] Next, refer to Figure 4 and Fig.12 , in operation S106, the flexible printed circuit board 300 is bonded to the concave portion 1001 of the first display panel 100. The anisotropic conductive film 400 is positioned between the concave portion 1001 of the first display panel 100 and the flexible printed circuit board 300. The flexible printed circuit board 300 is compressed by pressing at a high pressure or a high temperature, and thus the flexible printed circuit board 300 is bonded to the first display panel 100, and the pad 52 and the flexible printed circuit board 300 may be electrically connected to the first display panel 100. The protrusion 1002 of the first display panel 100 is arranged between the bonded flexible printed circuit boards 300.

[0098] In the following, reference is made to Fig.13 , a display device 10 according to an embodiment will be described. Fig.13 is a perspective view of a display device 10 according to an embodiment.

[0099] Reference Fig.13, the first display panel 100 includes recesses 1003 positioned along a side surface of the first display panel 100 and protrusions 1002 arranged at opposite sides of the recesses 1003. Each recess 1003 is a groove formed in a side surface of the first display panel 100, and the protrusion 1002 is a portion protruding relative to the recess 1003.

[0100] The flexible printed circuit board 300 is coupled to the concave portion 1003 of the first display panel 100. The concave portion 1003 of the first display panel 100 may extend from a region where the flexible printed circuit board 300 is coupled at one end to a region where the flexible printed circuit board 300 is coupled at the other end. That is, the protrusion 1002 may not be included between the flexible printed circuit boards 300.

[0101] In the following, reference will be made to Figures 14 to 16 A method for manufacturing the display device 10 according to the embodiment is described. Figures 4 to 12 The contents of the descriptions are similar, and thus duplicate descriptions will be omitted.

[0102] Fig.14 is a top plan view of the motherboard 11 . Fig.15 and Fig.16 is a perspective view of a process stage of a method for manufacturing the display device 10 according to the embodiment.

[0103] First, refer to Figure 4 and Fig.14 In operation S101, a through hole 1003a is formed in the mother board 11. The through hole 1003a is formed to extend along one side of the unit substrate 110'. Next, in operation S102, a conductive layer and a photoresist layer are formed on the mother board 11, in operation S103, the photoresist layer is exposed and developed to form a photoresist pattern, and in operation S104, the conductive layer is etched to form a conductive pattern 50, a conductive pattern 51, and a conductive pattern 52, and then the photoresist pattern is removed.

[0104] Then, refer to Figure 4 and Fig.15 , in operation S105 , the mother substrate 11 is cut along the cutting lines CL.

[0105] The mother board 11 is cut through the through hole 1003a in the extending direction of the through hole 1003a, and the side surface of the first display panel 100 around the through hole 1003a forms a recess 1003, and the cut surface forms a protrusion 1002. The pad 52 is arranged in the recess 1003 of the first display panel 100.

[0106] The manufacturing method may further include bonding the second display panel 200 before cutting the mother substrate 11 .

[0107] Next, refer to Figure 4 and Fig.16 , in operation S106, the flexible printed circuit board 300 is bonded to the concave portion 1003 of the first display panel 100. The anisotropic conductive film 400 is positioned between the concave portion 1003 of the first display panel 100 and the flexible printed circuit board 300. The flexible printed circuit board 300 is compressed by pressing at a high pressure or a high temperature, and thus the flexible printed circuit board 300 is bonded to the first display panel 100, and the pad 52 and the flexible printed circuit board 300 may be electrically connected to the display panel 100. One or more flexible printed circuit boards 300 may be bonded to a single concave portion 1003.

[0108] While the present disclosure has been described in conjunction with what are currently considered to be practical embodiments, it will be understood that the inventive concept is not limited to the disclosed embodiments. Instead, the inventive concept is intended to cover various modifications and equivalents included within the spirit and scope of the appended claims.

[0109] Description of Reference Numerals

[0110] 10: Display device 100: First display panel

[0111] 1001, 1003: concave portion 1002: protruding portion

[0112] 1001a, 1003a: Through hole 11: Motherboard

[0113] 110: first substrate 110': unit board

[0114] 121: Gate line 124: Gate electrode

[0115] 140: Gate insulating layer 154: Semiconductor layer

[0116] 160: first insulating layer 170: color filter

[0117] 171: Data line 180: Organic insulator

[0118] 191: pixel electrode 200: second display panel

[0119] 210: Second substrate 270: Common electrode

[0120] 3: Liquid crystal layer 300: Flexible printed circuit board

[0121] 35: Sealant 350: Driver IC

[0122] 400: Anisotropic conductive film 50: Wiring pattern

[0123] 50': Conductive layer 51: Extension line

[0124] 51a: first extension line 51b: second extension line

[0125] 52: pad 52a: first pad

[0126] 52b: Second pad CL: Cutting line

[0127] DA: Display area PA: Peripheral area

Claims

1. A display device, comprising: Display panel; as well as a first flexible printed circuit board, the first flexible printed circuit board being bonded to a side surface of the display panel, Wherein, the display panel comprises: a first substrate; A first extension line, the first extension line is on a top surface of the first substrate, the top surface is parallel to a first direction and a second direction, and the second direction is perpendicular to the first direction; a first recess at a side surface of the first substrate; and a first pad extending from the first extension line in a third direction perpendicular to the first direction and the second direction, the first pad being arranged in the first recess, and The first extension line and the first pad include the same material, Wherein, the first flexible printed circuit board is coupled to the first recess and connected to the first pad.

2. The display device according to claim 1, wherein: The display panel further includes: a data line that transmits a data voltage, and The first extension line is arranged in the same layer as the data line.

3. The display device according to claim 1, wherein: The display panel further includes: a gate line, the gate line transmitting a gate signal, and The first extension line is arranged in the same layer as the gate line.

4. The display device according to claim 1, in, The display device further includes: a second flexible printed circuit board, the second flexible printed circuit board being bonded to the side surface of the display panel, wherein the display panel further comprises: a second recess, the second recess being at the side surface of the first substrate; a second extension line on the top surface of the first substrate; and a second pad extending from the second extension line in the third direction, the second pad being arranged in the second recess, and wherein the second flexible printed circuit board is coupled to the second recess and connected to the second pad; and A first protrusion is disposed between the first recess and the second recess.

5. The display device according to claim 1, further comprising: a second flexible printed circuit board, the second flexible printed circuit board being bonded to the side surface of the display panel, Wherein, the second flexible printed circuit board is coupled to the first recess.

6. A method for manufacturing a display device, comprising: forming through holes along the cutting lines of the motherboard; forming a conductive layer and a photoresist layer on the mother board; forming a photoresist pattern by developing and exposing the photoresist layer; forming a conductive pattern by etching the conductive layer; and cutting the motherboard along the cutting line so as to pass through the through hole, and cutting the through hole to form a first recess, Wherein, in forming the conductive pattern, An extension line is formed on the top surface of the mother board, and a pad is formed on the inner wall of the through hole and extends from the extension line, and the extension line and the pad include the same material, and Wherein, a first flexible printed circuit board is coupled to the first recess and connected to the pad.

7. The method for manufacturing a display device according to claim 6, wherein: Forming the conductive pattern includes etching the conductive layer disposed on the top surface of the mother board and on the inner wall of the through hole.

8. The method for manufacturing a display device according to claim 7, wherein: In the forming of the conductive pattern, the data line and the pad are formed together on the motherboard, and Wherein, in forming the conductive pattern, the gate line and the pad are formed together on the motherboard.

9. The method for manufacturing a display device according to claim 7, wherein: In the cutting of the motherboard along the cutting line so as to pass through the through-hole, the motherboard is cut into a plurality of unit boards, and each of the plurality of unit boards includes the first recess formed by cutting a first through-hole among the through-holes, Wherein, in the step of cutting the motherboard along the cutting line so as to pass through the through hole, the unit board further comprises a second recess formed by cutting a second through hole among the through holes, and The manufacturing method of the display device further includes: After cutting the mother board, the flexible printed circuit board is combined, The combining of the flexible printed circuit boards is performed by combining the first flexible printed circuit board to the first concave portion and combining the second flexible printed circuit board to the second concave portion.

10. The method for manufacturing a display device according to claim 7, wherein: In the cutting of the motherboard along the cutting line so as to pass through the through-hole, the motherboard is cut into a plurality of unit boards, and each of the plurality of unit boards includes the first recess formed by cutting a first through-hole among the through-holes, The manufacturing method of the display device further includes: After cutting the mother board, the first flexible printed circuit board is bonded to the first recess.

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