A constant temperature destruction electronic tag

Abstract

The present invention provides a constant temperature destruction electronic tag, which relates to the technical field of electronic tags. The constant temperature destruction electronic tag provided by the present invention comprises: a substrate, the substrate having a first melting point; a radiator circuit, the radiator circuit is located on the first surface of the substrate, the radiator circuit comprises a liquid metal circuit, the liquid metal circuit comprises a liquid metal having a second melting point, the second melting point is lower than the first melting point; an external package, the external package covers the substrate and the radiator circuit. The technical solution of the present invention can monitor whether the product fails due to over-temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tags, and in particular to a constant temperature destruction electronic tag. Background Art

[0002] Cold Chain Logistics refers to a systematic project that keeps refrigerated and frozen products in a specified low-temperature environment throughout the production, storage, transportation, sales, and before consumption to ensure product quality and reduce losses. With the development of social needs, cold chain logistics is being used more and more widely.

[0003] The objects of cold chain logistics mainly include medicines, vaccines, and various fresh and quick-frozen foods that need to be stored at low temperatures. These products are highly sensitive to temperature. If the specified temperature is exceeded during the logistics process, they are prone to failure, deterioration, and other problems. At present, domestic cold chain logistics often have over-temperature problems due to technical and management problems. For example, intermittent refrigeration during storage and transportation, or refrigeration equipment failure, the product is still at a low temperature when it reaches the consumer / user, but it has reached above the specified temperature during storage and transportation. Therefore, it is necessary to monitor the temperature of the entire cold chain logistics process. Summary of the invention

[0004] The present invention provides a constant-temperature destruction electronic tag, which can monitor whether a product fails due to over-temperature.

[0005] The present invention provides a constant temperature destruction electronic tag, which adopts the following technical solution:

[0006] The constant temperature destruction electronic tag includes:

[0007] a substrate having a first melting point;

[0008] a radiator circuit, the radiator circuit being located on the first surface of the substrate, the radiator circuit comprising a liquid metal circuit, the liquid metal circuit comprising a liquid metal having a second melting point, the second melting point being lower than the first melting point;

[0009] An external package covers the substrate and the radiator circuit.

[0010] Optionally, the substrate has a property of being repellent to liquid metal.

[0011] Furthermore, the substrate is a paraffin sheet.

[0012] Furthermore, the thickness of the substrate is 0.2 mm to 0.5 mm.

[0013] Optionally, the liquid metal circuit includes liquid metal and metal powder mixed with each other.

[0014] Furthermore, the liquid metal is a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-indium-tin-zinc or a gallium-tin alloy, and the metal powder is a silver powder or a silver-coated copper powder.

[0015] Optionally, the outer packaging adopts a vacuum packaging method.

[0016] Furthermore, the outer packaging is a PET film or a nylon film.

[0017] Optionally, the constant temperature destructive electronic tag also includes: a chip and a covering layer; the chip is located on the first surface of the substrate, and the chip is connected to the radiator circuit, the covering layer covers the film layer where the chip and the radiator circuit are located, the covering layer has the first melting point, and the covering layer has an opening for exposing the chip.

[0018] Furthermore, the covering layer and the substrate have the same material and thickness.

[0019] The present invention provides a constant temperature destruction electronic tag. After the constant temperature destruction electronic tag is fixed on a product, when the ambient temperature of the product is lower than a first melting point, the substrate of the constant temperature destruction electronic tag is solid and has a stable structure. The radiator circuit on the constant temperature destruction electronic tag can work normally, that is, the constant temperature destruction electronic tag can be identified. When the ambient temperature of the product is equal to or higher than the first melting point, the substrate will melt into liquid and then flow. During the flow process, the liquid metal in liquid state will be driven to move, thereby disconnecting the radiator circuit and making the constant temperature destruction electronic tag unidentifiable. Even if the ambient temperature drops below the first melting point thereafter and the substrate solidifies again, the radiator circuit will not return to its original state. Therefore, the constant temperature destruction electronic tag can accurately and irreversibly reflect the ambient temperature change of the product, thereby monitoring whether the product fails due to over-temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a first constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the structure of the first constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the structure of a second constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of the structure of the second constant temperature destruction electronic tag after being destroyed provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0027] The embodiment of the present invention provides a constant temperature destruction electronic tag, specifically, Figure 1 As shown, Figure 1 Schematic diagram of the structure of the constant temperature destruction electronic tag provided by the embodiment of the present invention Figure 1 The constant temperature destruction electronic tag includes:

[0028] A substrate 1, the substrate 1 having a first melting point T1;

[0029] The radiator circuit 2 is located on the first surface of the substrate 1, and the radiator circuit 2 includes a liquid metal circuit, and the liquid metal circuit includes a liquid metal having a second melting point T2, and the second melting point T3 is lower than the first melting point T1;

[0030] The external package 3 covers the substrate 1 and the radiator circuit 2 .

[0031] The set destruction temperature range of the above-mentioned fixed temperature destruction electronic tag can be 5°C to 50°C. Those skilled in the art must know that the specific value of the first melting point T1 should be determined according to the temperature corresponding to the high-temperature failure of the product to which the fixed temperature destruction electronic tag is applied. For example, if the high-temperature failure temperature of the product is 30°C, the first melting point T1 should be selected as 30°C. If the high-temperature failure temperature of the product is 5°C, the first melting point T1 should be selected as 5°C, and so on.

[0032] After the constant temperature destruction electronic tag is fixed on the product, Figure 1As shown, when the ambient temperature of the product is lower than the first melting point T1, the substrate 1 of the constant temperature destruction electronic tag is solid and has a stable structure, and the radiator circuit 2 on the constant temperature destruction electronic tag can work normally, that is, the constant temperature destruction electronic tag can be identified, such as Figure 2 As shown, Figure 2 The schematic diagram of the structure of the first type of constant temperature destructible electronic tag after destruction provided in an embodiment of the present invention is that when the ambient temperature of the product is equal to or higher than the first melting point T1, the substrate 1 will melt into liquid and then flow. During the flow, the liquid metal in liquid state will be driven to move, thereby disconnecting the radiator circuit 2, and the constant temperature destructible electronic tag cannot be identified. Even if the ambient temperature drops below the first melting point T1 afterwards, the substrate 1 solidifies again and the radiator circuit 2 will not return to its original state. Therefore, the constant temperature destructible electronic tag can accurately and irreversibly reflect the ambient temperature changes of the product, thereby monitoring whether the product fails due to over-temperature.

[0033] The substrate 1 in the embodiment of the present invention can be selected from fixed-melting-point materials such as paraffin wax and lipids with relatively low melting points. The above-mentioned “fixed-melting-point materials” refer to materials with a specified melting point and a relatively narrow melting range.

[0034] Optionally, the liquid metal in the embodiment of the present invention is a metal element with a melting point below 300°C, an alloy with a melting point below 300°C, or a blend with a melting point below 300°C, the blend including at least two of the metal element, the alloy and the functional powder, that is, the blend includes the metal element and the alloy, or the blend includes the alloy and the functional powder, or the blend includes the metal element and the functional powder, or the blend includes the metal element, the alloy and the functional powder.

[0035] For example, the metal element may be mercury element, gallium element, indium element or tin element.

[0036] Exemplarily, the alloy can be one of a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-tin alloy, a gallium-zinc alloy, a gallium-indium-zinc alloy, a gallium-tin-zinc alloy, a gallium-indium-tin-zinc alloy, a gallium-tin-cadmium alloy, a gallium-zinc-cadmium alloy, a bismuth-indium alloy, a bismuth-tin alloy, a bismuth-indium-tin alloy, a bismuth-indium-zinc alloy, a bismuth-tin-zinc alloy, a bismuth-indium ...lead alloy, a bismuth-tin-cadmium alloy, a bismuth-lead-tin alloy, a bismuth-tin-lead-cadmium alloy, a tin-lead alloy, a tin-copper alloy, a tin-zinc alloy, a tin-zinc-copper alloy, and a tin-silver-copper alloy.

[0037] The inventors have discovered that when the substrate 1 has a better effect of adhering to the liquid metal, during the process of the substrate 1 melting and then flowing in liquid form, there is a possibility that the liquid metal adheres to it and undergoes the same deformation as it. When the two deform in the same way, the liquid metal circuit only changes in length / cross-sectional area / shape, and no circuit breakage occurs. There is a risk that the fixed-temperature destruction label cannot be completely destroyed when the ambient temperature of the product is equal to or higher than the first melting point T1.

[0038] Based on this, in the embodiment of the present invention, it is selected that the substrate 1 has the property of being repellent to liquid metal. At this time, during the process of the substrate 1 melting into liquid and flowing, the liquid metal will not adhere to it and undergo the same deformation as it, which can effectively ensure that the constant temperature destruction electronic tag is prepared to respond to the environmental temperature changes of the product.

[0039] It should be noted that whether liquid metal adheres to substrate 1 can be determined by making liquid metal circuits thereon, or by the following simpler method: substrate 1 is placed on a test bench at an angle of 20°, and liquid metal droplets (volume is 80 μL to 120 μL, taking 80 μL as an example) are dripped onto the surface of substrate 1 from a certain height (2 cm to 5 cm, taking 2 cm as an example). If there is no liquid metal residue on the surface of substrate 1, it means that liquid metal does not adhere to the surface of substrate 1. If there is liquid metal residue on the surface of substrate 1, it means that liquid metal adheres to substrate 1.

[0040] After a lot of experiments and research, it is found that paraffin can better meet the requirements of isolating liquid metal and setting the melting point at the same time. Therefore, the substrate 1 in the embodiment of the present invention is selected as a paraffin sheet. For example, the melting point and melting range of the paraffin sheet can be adjusted by changing the preparation process of paraffin and adjusting the molecular weight and polymer chain length of the synthetic polymer, thereby meeting the requirements of the fixed temperature destruction electronic tag in the embodiment of the present invention for the first melting point T1 of the substrate 1 in different application scenarios.

[0041] Furthermore, if the thickness of the substrate 1 is too large, the melting process will be slower, the melting time will be longer, and the reliability will be poor. If the thickness of the substrate is too small, it will not provide sufficient support when it is solid, and the amount of liquid after melting will be smaller, and the flow range will be gentler. After fully considering the above content, the thickness of the substrate 1 selected in the embodiment of the present invention is 0.2mm~0.5mm.

[0042] Optionally, when the substrate 1 is a substrate 1 that is isolated from liquid metal, in order to form a better liquid metal circuit on the substrate 1, the embodiment of the present invention selects a mixed material of liquid metal and metal powder to make the liquid metal circuit. The above material is in a paste state and has higher adhesion on the substrate 1 than the liquid metal, but the adhesion is still low, which can meet the requirement of disconnecting the liquid metal circuit after the substrate 1 is melted, that is, the liquid metal circuit includes liquid metal and metal powder mixed with each other.

[0043] Optionally, the liquid metal in the mixed material is a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-indium-tin-zinc or a gallium-tin alloy, and the metal powder is a silver powder or a silver-coated copper powder. The mass fraction of the metal powder in the mixed material is 8% to 40% to ensure that the mixed material has a suitable viscosity. The particle size of the metal powder ranges from 50nm to 50μm, so that the mixed material is more delicate and less granular, and it is easy to make liquid metal circuits by screen printing and other methods.

[0044] The aforementioned “radiator circuit 2 includes a liquid metal circuit” can be implemented in a variety of ways, such as the entire radiator circuit 2 is a liquid metal circuit, or a portion of the radiator circuit 2 is a liquid metal circuit.

[0045] Typically, when an electronic tag includes a chip, the antenna of the electronic tag is composed of an electromagnetic coupling circuit and an electromagnetic reflection circuit. The former determines whether the chip in the electronic tag is working, and the latter determines the distance of signal transmission. Based on this, the embodiment of the present invention selects that when part of the radiator circuit 2 is a liquid metal circuit, the liquid metal circuit is located at the connection between the radiator circuit 2 and the chip, and / or at the position of the electromagnetic coupling circuit. Such a setting can ensure that the chip cannot work after the liquid metal circuit is disconnected, and on the other hand, it can also avoid significant changes in the impedance of the radiator circuit 2 caused by the liquid metal circuit being connected to the radiator circuit 2 in other ways, and will not have an adverse effect on the communication distance.

[0046] When the entire radiator circuit 2 is a liquid metal circuit, the radiator circuit 2 can be made on the substrate 1 using a mixed material of liquid metal and metal powder by printing (screen printing, steel screen printing, flexographic printing), printing, pad printing, transfer printing, etc.

[0047] Optionally, the outer package 3 adopts a vacuum packaging method. Such a setting can make the outer package 3 provide a certain stress to the liquid metal and the substrate 1 after packaging (the stress is caused by the inevitable stress difference between the upper and lower layers of packaging materials during vacuum packaging). When the substrate 1 is not melted and is in a solid state, the stress will not cause damage to the substrate 1. When the substrate 1 melts into liquid, the stress will promote the flow of the substrate 1 and the liquid metal, thereby improving the reliability of the constant temperature destruction label.

[0048] Furthermore, when vacuum packaging is adopted, the outer packaging 3 may be a PET film or a nylon film.

[0049] Alternatively, if Figure 3 As shown, Figure 3The present invention is a schematic structural diagram of a second type of constant-temperature-destruction electronic tag provided in an embodiment of the present invention. The constant-temperature-destruction electronic tag in the embodiment of the present invention also includes: a chip 4 and a covering layer 5; the chip 4 is located on the first surface of the substrate 1, and the chip 4 is connected to the radiator circuit 2, the covering layer 5 covers the film layer where the chip 4 and the radiator circuit 2 are located, and the covering layer 5 has a first melting point T1.

[0050] Since the covering layer 5 also has the first melting point T1, when the ambient temperature of the product is lower than the first melting point T1, the covering layer 5 is solid, which can protect the radiator circuit 2 and the chip 4 to a certain extent, and improve the stability of the constant temperature destruction electronic tag. Figure 4 As shown, Figure 4 The schematic diagram of the structure of the second constant-temperature destructible electronic tag after destruction provided in an embodiment of the present invention shows that when the ambient temperature of the product is equal to or higher than the first melting point T1, the substrate 1 and the covering layer 5 will melt into liquid at the same time, so that the amount of liquid is larger and its flow will be more obvious, which will make the radiator circuit 2 easier to disconnect, so that the constant-temperature destructible electronic tag is destroyed and cannot be identified, thereby improving the reliability of the constant-temperature destructible electronic tag.

[0051] Furthermore, if Figure 3 As shown, the covering layer 5 has an opening for exposing the chip 4. The setting of the opening allows the covering layer 5 to better contact the liquid metal circuit, and the flow of the chip after melting into liquid has a more obvious impact on the liquid metal circuit, and also makes the surface of the entire constant temperature destruction electronic tag smoother.

[0052] Since the melting points of the covering layer 5 and the substrate 1 are both the first melting point T1, the material and thickness of the covering layer 5 can be the same as those of the substrate 1, and will not be described in detail here.

[0053] To facilitate understanding and implementation by those skilled in the art, the following embodiments of the present invention provide two specific constant temperature destruction electronic tags, as follows:

[0054] Example 1

[0055] The constant temperature destruction electronic tag is composed of a substrate 1, a radiator circuit 2 and an external package 3. The radiator circuit 2 is located on the substrate 1, and the external package 3 encapsulates the substrate 1 and the radiator circuit 2 as a whole.

[0056] The substrate 1 has a first melting point of 37° C. and is specifically a paraffin sheet with a thickness of 0.4 mm.

[0057] The material of the radiator circuit 2 is gallium-indium eutectic alloy mixed with silver-coated copper powder, wherein the mass percentage of the silver-coated copper powder is 8% and the particle size is 2 μm.

[0058] The radiator circuit 2 is drawn on the substrate 1 by screen printing.

[0059] The material of the outer package 3 is PET film, and is packaged in a vacuum packaging manner.

[0060] At present, some biologically active vaccines use cold chain logistics below 37°C. The above-mentioned constant temperature destruction electronic tag can be pasted in the vaccine packaging box. When the ambient temperature reaches or exceeds 37°C, the substrate 1 melts, the radiator circuit 2 breaks and fails, and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding vaccine has over-temperature failure in the cold chain logistics process.

[0061] Example 2

[0062] The constant temperature destruction electronic tag is composed of a substrate 1, a radiator circuit 2, an external package 3, a chip 4 and a covering layer 5. The radiator circuit 2 is located on the substrate 1, and the chip 4 is also located on the substrate 1 and connected to the radiator circuit 2. The covering layer 5 covers the radiator circuit 2 and the chip 4 and has an opening corresponding to the chip 4. The external package 3 encapsulates the substrate 1, the radiator circuit 2, the chip 4 and the covering layer 5 as a whole.

[0063] The substrate 1 has a first melting point of 8° C. and is specifically a paraffin sheet with a thickness of 0.25 mm.

[0064] The material of the radiator circuit 2 is a gallium-indium-tin-zinc alloy mixed with silver powder, wherein the mass percentage of the silver powder is 15% and the particle size is 20 μm.

[0065] The radiator circuit 2 is printed on the substrate 1 by roller printing.

[0066] The outer package 3 is made of nylon film and is packaged in a vacuum packaging manner.

[0067] The material and thickness of the cover layer 5 are the same as those of the substrate 1 .

[0068] At present, cold chain logistics below 8°C is widely used in the storage and transportation of medicines, vaccines, and fresh foods. The constant temperature destruction electronic tag can be pasted in the product packaging box. When the ambient temperature reaches or exceeds 8°C, the substrate 1 melts, the radiator circuit 2 is broken and fails, and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag that cannot read data, it means that the corresponding vaccine has over-temperature failure in the cold chain logistics process.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A constant temperature destruction electronic tag, characterized in that: include: A substrate, wherein the substrate has a first melting point; the substrate is paraffin or lipid; the substrate has a property of being repellent to liquid metal, and the thickness of the substrate is 0.2 mm to 0.5 mm; a radiator circuit, the radiator circuit being located on the first surface of the substrate, the radiator circuit comprising a liquid metal circuit, the liquid metal circuit comprising a liquid metal having a second melting point, the second melting point being lower than the first melting point; An external package, the external package covering the substrate and the radiator circuit; The liquid metal circuit includes liquid metal and metal powder mixed with each other.

2. The constant temperature destruction electronic tag according to claim 1, characterized in that: The substrate is a paraffin sheet.

3. The constant temperature destruction electronic tag according to claim 1, characterized in that: The liquid metal is gallium-indium alloy, gallium-indium-tin alloy, gallium-indium-tin-zinc or gallium-tin alloy, and the metal powder is silver powder or silver-coated copper powder.

4. The constant temperature destruction electronic tag according to claim 1, characterized in that: The outer packaging adopts a vacuum packaging method.

5. The constant temperature destruction electronic tag according to claim 4, characterized in that: The outer packaging is a PET film or a nylon film.

6. The constant temperature destruction electronic tag according to claim 1, characterized in that: Also includes: Chips and overlays; The chip is located on the first surface of the substrate and is connected to the radiator circuit. The covering layer covers the film layer where the chip and the radiator circuit are located. The covering layer has the first melting point and has an opening for exposing the chip.

7. The constant temperature destruction electronic tag according to claim 6, characterized in that: The covering layer and the substrate have the same material and thickness.

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