A mask plate and a method for manufacturing the same

Abstract

The present invention belongs to the technical field of mask plates, and in particular, relates to a mask plate and a manufacturing method thereof, including a mask plate body, a mask plate frame and a mask plate base, the mask plate base is stacked on the back of the mask plate body, the mask plate base is bonded to the mask plate body, the side of the mask plate body is embedded with a sticker, and the mask plate body is bonded to the mask plate frame through the sticker; the mask plate frame is divided into a first preparation area and a second preparation area, the length of the first preparation area and the second preparation area is greater than its width, and calibration patterns are engraved on the first preparation area and the second preparation area. The advantage is that the present invention has better controllability when the mask plate is stretched and welded, so that the defective rate of the mask plate as a whole is reduced during operation.

Description

Technical Field

[0001] The invention belongs to the technical field of mask plates, and in particular relates to a mask plate and a manufacturing method thereof. Background Art

[0002] The materials of the organic light-emitting layer are generally divided into large molecular organic materials and small molecular organic materials. In the process of making organic light-emitting devices by vacuum evaporation, an evaporation mold-mask plate is required as a medium to evaporate the organic light-emitting pixel pattern. The material of the mask plate is generally metal or metal alloy, and Invar alloy is commonly used. It is mainly composed of a mask body with a corresponding OLED light-emitting pattern and a mask plate frame.

[0003] The mask plate production process requires processes such as stretching and welding. During the stretching process, the structural strength and precision of the mask plate have a great impact on the subsequent structure. At the same time, due to the different materials, the welding bond strength and actual life are different during welding. Poor welding will directly lead to the overall scrapping of the mask plate, increasing the scrap rate.

[0004] To this end, we propose a mask plate and a manufacturing method thereof to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a mask plate and a method for manufacturing the mask plate which can reduce the defective rate during operation in view of the above problems.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a mask plate, comprising a mask plate body, a mask plate frame and a mask plate base, wherein the mask plate base is stacked on the back of the mask plate body, the mask plate base is bonded to the mask plate body, a strip is embedded on the side of the mask plate body, and the mask plate body is bonded to the mask plate frame through the strip;

[0007] The frame of the mask plate is divided into a first preparation area and a second preparation area. The length of the first preparation area and the second preparation area is greater than their width. Calibration patterns are engraved on the first preparation area and the second preparation area.

[0008] In the above-mentioned mask plate, the mask plate body includes three layers, namely an intermediate layer, a substrate layer and a conductive layer. The intermediate layer, substrate layer and conductive layer are stacked in sequence. There is a covering layer on the top of the intermediate layer. The thickness of the covering layer is 2.0-3.5nm, and the conductive layer is 60.0-90.0nm.

[0009] In the above-mentioned mask plate, the intermediate layer is composed of 35-45 layers of plates, the plates are made of Mo-Si material, and the total thickness of the intermediate layer is controlled to be 24.8nm-32.0nm.

[0010] In the above-mentioned mask plate, the sticker strip is embedded in the center of the side of the mask plate body and is arranged around the entire edge of the mask plate body.

[0011] In the above-mentioned mask plate, the width ratio of the first preparation area to the second preparation area is 2:1.

[0012] In the above-mentioned mask, the calibration pattern is a plurality of calibration point groups, each of the calibration point groups includes two calibration points, and the depth of the calibration points is 1.0-2.0 nm.

[0013] A method for manufacturing a mask plate comprises the following steps:

[0014] S1, combined connection: lay the mask plate body flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame with the mask plate body from top to bottom, and weld and bond them with the sticking strip;

[0015] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask plate body and the mask plate frame in S1;

[0016] S3, template assembly: the mask body is connected to the electroforming template and an ablation material layer is applied, and then the ablation material layer is continuously exposed, and then electroforming is performed;

[0017] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0018] In the above-mentioned mask plate manufacturing method, a cathode sheet and an anode sheet are arranged in the electroforming template, and a closed module is provided on the cathode sheet and the anode sheet. The closed module is provided with a plurality of power-through holes, which are in the shape of protruding conical holes and are disposed at the upper and lower edges of the closed module.

[0019] In the above-mentioned method for manufacturing the mask plate, the continuous exposure time is 1-3s, and the number of exposures is 1-3 times.

[0020] In the above-mentioned method for manufacturing the mask plate, the positions of the power-passing holes on the two groups of closed modules are the same and correspond to each other, and the ratio of the small aperture to the large aperture of the conical power-passing holes is 1:3.

[0021] Compared with the existing technology, the advantages of the mask plate and the manufacturing method thereof are:

[0022] The present invention can perform synchronous selection by combining the electroforming method and the welding method, so that different processing methods can be selected according to needs during the processing of the mask plate. At the same time, the first preparation area and the second preparation area on the sticker and the mask plate frame can preferentially achieve a calibration effect, so that it has high precision whether it is operated in welding or electroforming, so as to improve the yield rate of the mask plate during production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a mask plate provided by the present invention;

[0024] Figure 2 yes Figure 1 Cross-sectional view of the middle layer and substrate layer;

[0025] Figure 3 yes Figure 1 A top view schematic diagram of the frame of the middle mask plate;

[0026] Figure 4 yes Figure 1 A cross-sectional view of the middle layer;

[0027] Figure 5 yes Figure 1 A partial enlarged view of the middle A;

[0028] Figure 6 It is a schematic diagram of the process of a method for manufacturing a mask plate of the present invention.

[0029] In the figure, 1 is a mask body, 2 is a mask frame, 3 is a mask substrate, 4 is a sticker, 5 is a first preparation area, 6 is a second preparation area, 7 is an intermediate layer, 8 is a substrate layer, 9 is a conductive layer, and 10 is a covering layer. DETAILED DESCRIPTION

[0030] The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0031] Example 1

[0032] like Figure 1-6 As shown, a mask plate includes a mask plate body 1, a mask plate frame 2 and a mask plate substrate 3. The mask plate substrate 3 is stacked on the back of the mask plate body 1. The mask plate substrate 3 is a frame structure and is attached to the edge of the mask plate body 1.

[0033] The mask body 1 includes three layers, namely, an intermediate layer 7, a substrate layer 8 and a conductive layer 9. The intermediate layer 7, the substrate layer 8 and the conductive layer 9 are stacked in sequence. A covering layer 10 is provided on the top of the intermediate layer 7, which is RU. The upper end of the covering layer 10 is covered with an absorption layer, which is AR-TaN. The thickness of the covering layer 10 is 2.0-3.5nm. The intermediate layer 7 is composed of 35 sheets, which are tightly bonded to each other. The sheets are made of Mo-Si material. The total thickness of the intermediate layer 7 is controlled at 24.8nm, and the conductive layer 9 is 60.0-90.0nm.

[0034] The mask plate substrate 3 is bonded to the mask plate body 1, and a strip 4 is embedded in the side of the mask plate body 1. The strip 4 is embedded in the center of the side of the mask plate body 1. The strip 4 is made of chromium film iron oxide molybdenum silicide, and is insulated from the mask plate body 1. It is arranged around the overall edge of the mask plate body 1, and the mask plate body 1 is bonded to the mask plate frame 2 through the strip 4;

[0035] The mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6. The first preparation area 5 and the second preparation area 6 are used for calibration and verification. The welding accuracy can be checked before welding, and then the mask plate is actually operated. The length of the first preparation area 5 and the second preparation area 6 is greater than its width. The first preparation area 5 and the second preparation area 6 are engraved with calibration figures. The width ratio of the first preparation area 5 and the second preparation area 6 is 2:1. The calibration figure is a plurality of calibration point groups, each calibration point group includes two calibration points, and the depth of the calibration point is 1.0-2.0nm. The accuracy of the welding point is matched by the calibration calculation error with the calibration point.

[0036] A method for manufacturing a mask plate comprises the following steps:

[0037] S1, combined connection: lay the mask plate body 1 flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame 2 with the mask plate body 1 from top to bottom, and weld and bond them with the sticking strip 4;

[0038] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask body 1 and the mask frame 2 in S1;

[0039] S3, template assembly: the mask body 1 is butted with the electroforming template and an ablation material layer is coated. A cathode sheet and an anode sheet are arranged in the electroforming template. A closed module is arranged on the cathode sheet and the anode sheet. A plurality of power-through holes are opened on the closed module. The power-through holes are in the shape of protruding cone holes. The power-through holes are arranged at the upper and lower edges of the closed module. The power-through holes on the two groups of closed modules are in the same position and correspond to each other. The ratio of the small aperture to the large aperture of the cone-shaped power-through holes is 1:3. Subsequently, the ablation material layer is continuously exposed. The continuous exposure time is 1-3s and the number of exposures is 1-3 times. Then, electroforming is performed.

[0040] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0041] Example 2

[0042] like Figure 1-6 As shown, a mask plate includes a mask plate body 1, a mask plate frame 2 and a mask plate substrate 3. The mask plate substrate 3 is stacked on the back of the mask plate body 1. The mask plate substrate 3 is a frame structure and is attached to the edge of the mask plate body 1.

[0043] The mask body 1 comprises three layers, namely, an intermediate layer 7, a substrate layer 8 and a conductive layer 9. The intermediate layer 7, the substrate layer 8 and the conductive layer 9 are stacked in sequence. A covering layer 10 is provided on the top of the intermediate layer 7, which is RU. The upper end of the covering layer 10 is covered with an absorption layer, which is AR-TaN. The thickness of the covering layer 10 is 2.0-3.5nm. The intermediate layer 7 is composed of 38 layers of sheets, which are tightly bonded to each other. The sheets are made of Mo-Si material. The total thickness of the intermediate layer 7 is controlled at 27.0nm, and the conductive layer 9 is 60.0-90.0nm.

[0044] The mask plate substrate 3 is bonded to the mask plate body 1, and a strip 4 is embedded in the side of the mask plate body 1. The strip 4 is embedded in the center of the side of the mask plate body 1. The strip 4 is made of chromium film iron oxide molybdenum silicide, and is insulated from the mask plate body 1. It is arranged around the overall edge of the mask plate body 1, and the mask plate body 1 is bonded to the mask plate frame 2 through the strip 4;

[0045] The mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6. The first preparation area 5 and the second preparation area 6 are used for calibration and verification. The welding accuracy can be checked before welding, and then the mask plate is actually operated. The length of the first preparation area 5 and the second preparation area 6 is greater than its width. The first preparation area 5 and the second preparation area 6 are engraved with calibration figures. The width ratio of the first preparation area 5 and the second preparation area 6 is 2:1. The calibration figure is a plurality of calibration point groups, each calibration point group includes two calibration points, and the depth of the calibration point is 1.0-2.0nm. The accuracy of the welding point is matched by the calibration calculation error with the calibration point.

[0046] A method for manufacturing a mask plate comprises the following steps:

[0047] S1, combined connection: lay the mask plate body 1 flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame 2 with the mask plate body 1 from top to bottom, and weld and bond them with the sticking strip 4;

[0048] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask body 1 and the mask frame 2 in S1;

[0049] S3, template assembly: the mask body 1 is butted with the electroforming template and an ablation material layer is coated. A cathode sheet and an anode sheet are arranged in the electroforming template. A closed module is arranged on the cathode sheet and the anode sheet. A plurality of power-through holes are opened on the closed module. The power-through holes are in the shape of protruding cone holes. The power-through holes are arranged at the upper and lower edges of the closed module. The power-through holes on the two groups of closed modules are in the same position and correspond to each other. The ratio of the small aperture to the large aperture of the cone-shaped power-through holes is 1:3. Subsequently, the ablation material layer is continuously exposed. The continuous exposure time is 1-3s and the number of exposures is 1-3 times. Then, electroforming is performed.

[0050] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0051] Example 3

[0052] like Figure 1-6 As shown, a mask plate includes a mask plate body 1, a mask plate frame 2 and a mask plate substrate 3. The mask plate substrate 3 is stacked on the back of the mask plate body 1. The mask plate substrate 3 is a frame structure and is attached to the edge of the mask plate body 1.

[0053] The mask body 1 comprises three layers, namely, an intermediate layer 7, a substrate layer 8 and a conductive layer 9. The intermediate layer 7, the substrate layer 8 and the conductive layer 9 are stacked in sequence. A covering layer 10 is provided on the top of the intermediate layer 7, which is RU. The upper end of the covering layer 10 is covered with an absorption layer, which is AR-TaN. The thickness of the covering layer 10 is 2.0-3.5nm. The intermediate layer 7 is composed of 40 sheets, which are tightly bonded to each other. The sheets are made of Mo-Si material. The total thickness of the intermediate layer 7 is controlled at 28.4nm, and the conductive layer 9 is 60.0-90.0nm.

[0054] The mask plate substrate 3 is bonded to the mask plate body 1, and a strip 4 is embedded in the side of the mask plate body 1. The strip 4 is embedded in the center of the side of the mask plate body 1. The strip 4 is made of chromium film iron oxide molybdenum silicide, and is insulated from the mask plate body 1. It is arranged around the overall edge of the mask plate body 1, and the mask plate body 1 is bonded to the mask plate frame 2 through the strip 4;

[0055] The mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6. The first preparation area 5 and the second preparation area 6 are used for calibration and verification. The welding accuracy can be checked before welding, and then the mask plate is actually operated. The length of the first preparation area 5 and the second preparation area 6 is greater than its width. The first preparation area 5 and the second preparation area 6 are engraved with calibration figures. The width ratio of the first preparation area 5 and the second preparation area 6 is 2:1. The calibration figure is a plurality of calibration point groups, each calibration point group includes two calibration points, and the depth of the calibration point is 1.0-2.0nm. The accuracy of the welding point is matched by the calibration calculation error with the calibration point.

[0056] A method for manufacturing a mask plate comprises the following steps:

[0057] S1, combined connection: lay the mask plate body 1 flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame 2 with the mask plate body 1 from top to bottom, and weld and bond them with the sticking strip 4;

[0058] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask body 1 and the mask frame 2 in S1;

[0059] S3, template assembly: the mask body 1 is butted with the electroforming template and an ablation material layer is coated. A cathode sheet and an anode sheet are arranged in the electroforming template. A closed module is arranged on the cathode sheet and the anode sheet. A plurality of power-through holes are opened on the closed module. The power-through holes are in the shape of protruding cone holes. The power-through holes are arranged at the upper and lower edges of the closed module. The power-through holes on the two groups of closed modules are in the same position and correspond to each other. The ratio of the small aperture to the large aperture of the cone-shaped power-through holes is 1:3. Subsequently, the ablation material layer is continuously exposed. The continuous exposure time is 1-3s and the number of exposures is 1-3 times. Then, electroforming is performed.

[0060] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0061] Example 4

[0062] like Figure 1-6 As shown, a mask plate includes a mask plate body 1, a mask plate frame 2 and a mask plate substrate 3. The mask plate substrate 3 is stacked on the back of the mask plate body 1. The mask plate substrate 3 is a frame structure and is attached to the edge of the mask plate body 1.

[0063] The mask body 1 comprises three layers, namely, an intermediate layer 7, a substrate layer 8 and a conductive layer 9. The intermediate layer 7, the substrate layer 8 and the conductive layer 9 are stacked in sequence. A covering layer 10 is provided on the top of the intermediate layer 7, which is RU. The upper end of the covering layer 10 is covered with an absorption layer, which is AR-TaN. The thickness of the covering layer 10 is 2.0-3.5nm. The intermediate layer 7 is composed of 40 sheets, which are tightly bonded to each other. The sheets are made of Mo-Si material. The total thickness of the intermediate layer 7 is controlled at 30.0nm, and the conductive layer 9 is 60.0-90.0nm.

[0064] The mask plate substrate 3 is bonded to the mask plate body 1, and a strip 4 is embedded in the side of the mask plate body 1. The strip 4 is embedded in the center of the side of the mask plate body 1. The strip 4 is made of chromium film iron oxide molybdenum silicide, and is insulated from the mask plate body 1. It is arranged around the overall edge of the mask plate body 1, and the mask plate body 1 is bonded to the mask plate frame 2 through the strip 4;

[0065] The mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6. The first preparation area 5 and the second preparation area 6 are used for calibration and verification. The welding accuracy can be checked before welding, and then the mask plate is actually operated. The length of the first preparation area 5 and the second preparation area 6 is greater than its width. The first preparation area 5 and the second preparation area 6 are engraved with calibration figures. The width ratio of the first preparation area 5 and the second preparation area 6 is 2:1. The calibration figure is a plurality of calibration point groups, each calibration point group includes two calibration points, and the depth of the calibration point is 1.0-2.0nm. The accuracy of the welding point is matched by the calibration calculation error with the calibration point.

[0066] A method for manufacturing a mask plate comprises the following steps:

[0067] S1, combined connection: lay the mask plate body 1 flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame 2 with the mask plate body 1 from top to bottom, and weld and bond them with the sticking strip 4;

[0068] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask body 1 and the mask frame 2 in S1;

[0069] S3, template assembly: the mask body 1 is butted with the electroforming template and an ablation material layer is coated. A cathode sheet and an anode sheet are arranged in the electroforming template. A closed module is arranged on the cathode sheet and the anode sheet. A plurality of power-through holes are opened on the closed module. The power-through holes are in the shape of protruding cone holes. The power-through holes are arranged at the upper and lower edges of the closed module. The power-through holes on the two groups of closed modules are in the same position and correspond to each other. The ratio of the small aperture to the large aperture of the cone-shaped power-through holes is 1:3. Subsequently, the ablation material layer is continuously exposed. The continuous exposure time is 1-3s and the number of exposures is 1-3 times. Then, electroforming is performed.

[0070] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0071] Example 5

[0072] like Figure 1-6 As shown, a mask plate includes a mask plate body 1, a mask plate frame 2 and a mask plate substrate 3. The mask plate substrate 3 is stacked on the back of the mask plate body 1. The mask plate substrate 3 is a frame structure and is attached to the edge of the mask plate body 1.

[0073] The mask body 1 comprises three layers, namely, an intermediate layer 7, a substrate layer 8 and a conductive layer 9. The intermediate layer 7, the substrate layer 8 and the conductive layer 9 are stacked in sequence. A covering layer 10 is provided on the top of the intermediate layer 7, which is RU. The upper end of the covering layer 10 is covered with an absorption layer, which is AR-TaN. The thickness of the covering layer 10 is 2.0-3.5nm. The intermediate layer 7 is composed of 42 layers of sheets, which are tightly bonded to each other. The sheets are made of Mo-Si material. The total thickness of the intermediate layer 7 is controlled at 32.0nm, and the conductive layer 9 is 60.0-90.0nm.

[0074] The mask plate substrate 3 is bonded to the mask plate body 1, and a strip 4 is embedded in the side of the mask plate body 1. The strip 4 is embedded in the center of the side of the mask plate body 1. The strip 4 is made of chromium film iron oxide molybdenum silicide, and is insulated from the mask plate body 1. It is arranged around the overall edge of the mask plate body 1, and the mask plate body 1 is bonded to the mask plate frame 2 through the strip 4;

[0075] The mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6. The first preparation area 5 and the second preparation area 6 are used for calibration and verification. The welding accuracy can be checked before welding, and then the mask plate is actually operated. The length of the first preparation area 5 and the second preparation area 6 is greater than its width. The first preparation area 5 and the second preparation area 6 are engraved with calibration figures. The width ratio of the first preparation area 5 and the second preparation area 6 is 2:1. The calibration figure is a plurality of calibration point groups, each calibration point group includes two calibration points, and the depth of the calibration point is 1.0-2.0nm. The accuracy of the welding point is matched by the calibration calculation error with the calibration point.

[0076] A method for manufacturing a mask plate comprises the following steps:

[0077] S1, combined connection: lay the mask plate body 1 flat and clamp it, the clamping position is at its bottom, and then gradually align the mask plate frame 2 with the mask plate body 1 from top to bottom, and weld and bond them with the sticking strip 4;

[0078] S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask body 1 and the mask frame 2 in S1;

[0079] S3, template assembly: the mask body 1 is butted with the electroforming template and an ablation material layer is coated. A cathode sheet and an anode sheet are arranged in the electroforming template. A closed module is arranged on the cathode sheet and the anode sheet. A plurality of power-through holes are opened on the closed module. The power-through holes are in the shape of protruding cone holes. The power-through holes are arranged at the upper and lower edges of the closed module. The power-through holes on the two groups of closed modules are in the same position and correspond to each other. The ratio of the small aperture to the large aperture of the cone-shaped power-through holes is 1:3. Subsequently, the ablation material layer is continuously exposed. The continuous exposure time is 1-3s and the number of exposures is 1-3 times. Then, electroforming is performed.

[0080] S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

[0081] Table 1: Effect of the number and thickness of the middle layer on the connection strength

[0082] Group Middle layer number thickness Connection strength Yield 1 35 24.8nm 121％ 98.8％ 2 38 27.0nm 127％ 99.1％ 3 40 28.4nm 134％ 98.0％ 4 40 30.0nm 151％ 99.3％ 5 42 32.0nm 167％ 99.8％

[0083] It can be seen from the above experimental data that the mask plate connection structure obtained under the parameters of Example 5 has the best strength and the highest yield rate.

[0084] Although the terms such as mask body 1, mask frame 2, mask substrate 3, sticker 4, first preparation area 5, second preparation area 6, intermediate layer 7, substrate layer 8, conductive layer 9, and cover layer 10 are used more frequently in this article, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

Claims

1. A mask plate, comprising a mask plate body (1), a mask plate frame (2) and a mask plate base (3), wherein the mask plate base (3) is stacked on the back of the mask plate body (1), characterized in that: The mask plate base (3) is bonded to the mask plate body (1), a sticker (4) is embedded on the side of the mask plate body (1), and the mask plate body (1) is bonded to the mask plate frame (2) via the sticker (4); The mask plate frame (2) is divided into a first preparation area (5) and a second preparation area (6); the length of the first preparation area (5) and the second preparation area (6) is greater than their width; and calibration patterns are engraved on the first preparation area (5) and the second preparation area (6); The mask plate body (1) comprises an intermediate layer (7), a substrate layer (8) and a conductive layer (9), wherein the intermediate layer (7), the substrate layer (8) and the conductive layer (9) are stacked in sequence, and a covering layer (10) is provided on the top of the intermediate layer (7); The middle layer (7) is composed of 35-45 layers of sheets, and the sheets are made of Mo-Si material.

2. The mask plate according to claim 1, characterized in that: The thickness of the covering layer (10) is 2.0-3.5 nm, and the thickness of the conductive layer (9) is 60.0-90.0 nm.

3. The mask plate according to claim 2, characterized in that: The total thickness of the intermediate layer (7) is controlled within a range of 24.8 nm to 32.0 nm.

4. The mask plate according to claim 1, characterized in that: The sticker strip (4) is embedded in the center of the side of the mask plate body (1) and is arranged around the entire edge of the mask plate body (1).

5. The mask plate according to claim 1, characterized in that: The width ratio of the first preparation area (5) to the second preparation area (6) is 2:

1.

6. The mask plate according to claim 5, characterized in that: The calibration pattern is a plurality of calibration point groups, each of which includes two calibration points, and the depth of the calibration points is 1.0-2.0 nm.

7. A method for manufacturing a mask plate, applied to the method for manufacturing a mask plate according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1, combined connection: the mask plate body (1) is laid flat and clamped, with the clamping position being at its bottom, and the mask plate frame (2) is gradually aligned with the mask plate body (1) from top to bottom, and welded and bonded by means of a sticking strip (4); S2, pressing and leveling: pressing and leveling the upper end surfaces of the mask plate body (1) and the mask plate frame (2) in S1; S3, template assembly: the mask plate body (1) is connected to the electroforming template and an ablative material layer is coated, and then the ablative material layer is continuously exposed, and then electroforming is performed; S4, splitting: separating the electroforming layer in S3 from the electroforming template to obtain a mask plate.

8. The method for manufacturing a mask plate according to claim 7, characterized in that: The electroforming template is provided with a cathode sheet and an anode sheet, and a closed module is provided on the cathode sheet and the anode sheet. The closed module is provided with a plurality of power-through holes, which are in the shape of protruding cone holes and are disposed at the upper and lower edges of the closed module.

9. The method for manufacturing a mask plate according to claim 7, characterized in that: The continuous exposure time is 1-3s, and the number of exposures is 1-3 times.

10. The method for manufacturing a mask plate according to claim 8, characterized in that: The positions of the power-passing holes on the two groups of closed modules are the same and correspond to each other, and the ratio of the small aperture to the large aperture of the conical power-passing holes is 1:3.

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