Server heat dissipation method and device

Abstract

The present application discloses a method and device for heat dissipation of a server, which includes obtaining a temperature change curve of each component within a preset operating time period; calculating the slope of the temperature change curve corresponding to each component; grouping multiple components according to the slope value; matching a heat dissipation unit of the same structure to the components in each group, and the corresponding heat dissipation unit structures are different between different groups; monitoring the real-time temperature value of each component and comparing it with the corresponding threshold value; when the real-time temperature value of the component is greater than the corresponding threshold value, turning on the heat dissipation unit corresponding to it to dissipate heat for the component. The present application groups multiple components according to the slope value of the temperature change curve corresponding to the components, and different groups correspond to heat dissipation units of different structures. When dissipating heat, a heat dissipation unit matching the heat dissipation situation is selected according to the heat dissipation situation of different components, so that the corresponding heat dissipation unit dissipates heat for them, thereby improving the heat dissipation efficiency of the server.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a server heat dissipation method and device. Background Art

[0002] Whether the server runs normally is one of the important indicators to measure the enterprise network management technology, and good heat dissipation function is the basic condition to ensure the normal operation of the server. The existing heat dissipation method of the server is to install a cooling fan at the central processing unit of the server, and adjust the speed of the cooling fan according to the temperature value of the central processing unit to dissipate the heat of the server. However, the operation of the server will not only be affected by the temperature of the central processing unit, but also by other components such as the power supply, motherboard, memory, and hard disk. The existing heat dissipation method can only dissipate heat locally on the server, but cannot dissipate heat for the server as a whole, and cannot adjust the heat dissipation power of different components in the server according to the heating conditions of different components in the server. Therefore, the existing heat dissipation method has a poor heat dissipation effect on the server, which is easy to affect the normal operation of the server or even cause damage to the server.

[0003] Therefore, how to provide a heat dissipation method and device that can dissipate heat for different components according to the heating conditions of different components in the server to improve the heat dissipation efficiency of the server has become an urgent problem to be solved in the field. Summary of the invention

[0004] The purpose of the present application is to provide a server heat dissipation method, which can adjust the heat dissipation of different components according to the heating conditions of different components in the server to improve the heat dissipation efficiency of the server.

[0005] Another object is to provide a server cooling device.

[0006] In a first aspect, an embodiment of the present application provides a method for heat dissipation of a server, wherein the server includes a housing and a plurality of components located inside the housing, and the method includes:

[0007] Obtain the temperature change curve of each component within a preset operating time period;

[0008] Calculate the slope of the temperature change curve corresponding to each component; group multiple components according to the slope value;

[0009] The components in each group are matched with heat dissipation units of the same structure, and the heat dissipation unit structures corresponding to different groups are different;

[0010] The real-time temperature value of each component is monitored and compared with the corresponding threshold value; when the real-time temperature value of the component is greater than the corresponding threshold value, the corresponding heat dissipation unit is turned on to dissipate the heat of the component.

[0011] In a possible implementation, grouping a plurality of components according to slope values ​​includes:

[0012] When the slope value of a component is less than a first preset value, the component is classified into a first group;

[0013] When the slope value of a component is between the first preset value and the second preset value, the component is classified into the second group;

[0014] When the slope value of a component is greater than a second preset value, the component is classified into a third group.

[0015] In a possible implementation, components in each group are matched with heat dissipation units of the same structure, and the heat dissipation unit structures corresponding to different groups are different, including:

[0016] Matching a first heat dissipation unit for the components in the first group, wherein the first heat dissipation unit is a low-power heat dissipation fan;

[0017] A second heat dissipation unit is matched for the components in the second group, and the second heat dissipation unit is a high-power heat dissipation fan;

[0018] A third heat dissipation unit is matched for the components in the third group, and the third heat dissipation unit is a liquid-cooled heat dissipation component; the liquid-cooled heat dissipation component is arranged around the outer surfaces of all the components in the third group.

[0019] In a possible implementation manner, for the second heat dissipation unit corresponding to each component in the second group, a ventilating hole corresponding to its position is provided on the shell.

[0020] In a possible implementation, the third heat dissipation unit further includes a low-power or high-power heat dissipation fan.

[0021] In a possible implementation scheme, when the component is a component in the first group or the second group, the control amount H of the cooling fan corresponding to the component is calculated according to the following formula, and the corresponding cooling fan cools the component according to the control amount H:

[0022]

[0023] Among them, K is a constant; T1 is the temperature value of the component; T0 is the preset value of the component.

[0024] In a possible implementation scheme, when the component is a component in the third group, the liquid flow rate v of the liquid cooling heat dissipation assembly is calculated according to the following formula, and the liquid cooling heat dissipation assembly dissipates heat for the component according to the liquid flow rate v:

[0025]

[0026] Where, P is the rated power of the component; CP is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component.

[0027] In a possible implementation scheme, when the component is a component in the third group, the liquid flow rate v of the liquid cooling heat dissipation assembly and the control amount H of the heat dissipation fan corresponding to the component are calculated respectively:

[0028]

[0029]

[0030] Among them, K is a constant; P is the rated power of the component; C P is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component; A+B=100%, A is between 10% and 20%, and B is between 80% and 90%.

[0031] In a second aspect, an embodiment of the present application provides a server heat dissipation device, wherein the server includes a housing and a plurality of components located inside the housing, and the device includes:

[0032] Multiple groups, each group includes at least one component, and the range of the slope value of the temperature change curve of the components in the preset operating time period is different between different groups; the components in each group are provided with a heat dissipation module of the same structure, and the heat dissipation module structures corresponding to different groups are different;

[0033] A temperature control device, including a temperature sensor connected to each component in each group, the temperature sensor being used to obtain a real-time temperature value of the corresponding component;

[0034] The control device is connected to the temperature sensor and the heat dissipation module in communication; after receiving the real-time temperature value of a component, the control device compares the real-time temperature value with the corresponding threshold value, and when the real-time temperature value is greater than the corresponding threshold value, turns on the corresponding heat dissipation module to dissipate heat for the component.

[0035] In a possible implementation, the number of groups is three, and the relationship between the slope values ​​of the temperature variation curves of the components in the three groups is: first group < second group < third group.

[0036] Compared with the prior art, the present invention has the following advantages:

[0037] The present application groups multiple components according to the slope value of the temperature change curve of the components within a preset operating time period. The components in each group correspond to heat dissipation units of the same structure, and the heat dissipation units match the heating conditions of the components in the group. Different groups correspond to heat dissipation units of different structures. When a component needs to be cooled, it is only necessary to make the heat dissipation unit corresponding to the component cool it. This method can select a heat dissipation unit that matches the heating condition of different components, so that the corresponding heat dissipation unit cools it, thereby improving the heat dissipation efficiency of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 A schematic diagram of a server heat dissipation method according to an embodiment of the present application;

[0040] Figure 2 It is a schematic diagram of the structure of a server heat dissipation device according to an embodiment of the present application.

[0041] Illustration Description:

[0042] 100 housing; 200 components; 300 temperature sensor; 400 heat dissipation module; 410 first heat dissipation module; 420 second heat dissipation module; 430 third heat dissipation module; 500 control device. DETAILED DESCRIPTION

[0043] The technical solutions of the specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings. These implementation methods are only used to illustrate the present application, but not to limit the present application.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the description of the present application, it should be noted that the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0046] The server includes a housing and multiple components located inside the housing, wherein the components include a central processing unit, a motherboard, a memory, a hard disk, and a power supply. Since the power of each component is different during operation, the heat generation of each component is different during the same operating period. In the prior art, the same heat dissipation unit is used to dissipate heat for different components, which may cause excessive heat dissipation and energy waste; or, it may cause insufficient heat dissipation and poor heat dissipation efficiency for the server.

[0047] Based on the problems existing in the prior art, one aspect of the present application provides a server heat dissipation method. Figure 1 , the method comprises the following steps:

[0048] S1. Obtain the temperature change curve of each component within a preset operating time period.

[0049] In one embodiment, during a preset operating time period, a temperature sensor collects the temperature value of each component at a certain frequency, and draws a temperature change curve of each component during the operating time period based on the temperature value collected by the temperature sensor. The temperature sensor can be a contact temperature sensor such as a pressure thermometer, a thermocouple, or a non-contact temperature sensor such as a photoelectric thermometer, a radiation pyrometer, etc. The temperature change curve can be drawn manually based on the collected temperature values, or it can be automatically drawn by the system based on the collected temperature values. The above-mentioned collected temperature values ​​and temperature change curves are stored in the system.

[0050] S2. Calculate the slope of the temperature change curve corresponding to each component; and group multiple components according to the slope value.

[0051] In one embodiment, the system performs fitting processing on the temperature change curve corresponding to each component, and calculates the slope of the temperature change curve corresponding to each component. The system groups multiple components according to the above slope values. If the slope value of the component is less than the first preset value, the component is divided into the first group; if the slope value of the component is between the first preset value and the second preset value, the component is divided into the second group; if the slope value of the component is greater than the second preset value, the component is divided into the third group. Therefore, the relationship between the slope values ​​of the temperature change curves corresponding to the components between the three groups is: first group < second group < third group, that is, the heating conditions corresponding to the components between the three groups are: first group < second group < third group.

[0052] The first preset value and the second preset value may be obtained by calculation or by experience.

[0053] S3. Match the heat dissipation unit with the same structure for the components in each group, and the heat dissipation unit structures corresponding to different groups are different.

[0054] In one embodiment, a first heat dissipation unit is matched for the components in the first group, and the first heat dissipation unit is a low-power heat dissipation fan; a second heat dissipation unit is matched for the components in the second group, and the second heat dissipation unit is a high-power heat dissipation fan; a third heat dissipation unit is matched for the components in the third group, and the third heat dissipation unit is a liquid cooling heat dissipation assembly; the liquid cooling heat dissipation assembly is arranged around the outer surface of all components in the third group. The liquid cooling heat dissipation assembly includes a liquid cooling pipe and a cooling circulating liquid, and the liquid cooling pipe includes a plurality of sub-pipes corresponding to the components in the third group. When a component in the third group needs to be cooled, the cooling circulating liquid only needs to be pumped into the sub-pipe corresponding to the component at a predetermined flow rate. For the components in the first group and the second group, each component corresponds to a low-power or high-power heat dissipation fan.

[0055] In this embodiment, the heat dissipation unit corresponding to the components in each group is matched with the heating conditions of the components in the group. The heat dissipation unit is used to dissipate heat for the corresponding components, which can reduce energy waste and improve the heat dissipation efficiency of the server while meeting its heat dissipation requirements.

[0056] As an alternative implementation, for the second heat dissipation unit corresponding to each component in the second group, a vent corresponding to its position is provided on the housing, and the vent works together with the high-power heat dissipation fan corresponding to the second group to dissipate heat for the components in the second group.

[0057] As an alternative implementation, the third heat dissipation unit further includes a low-power or high-power heat dissipation fan. The low-power or high-power heat dissipation fan works together with the liquid cooling assembly to dissipate heat for the components in the third group, which can further improve the heat dissipation efficiency of the server.

[0058] S4. Monitor the real-time temperature value of each component and compare it with the corresponding threshold value; when the real-time temperature value of the component is greater than the corresponding threshold value, turn on the corresponding heat dissipation unit to dissipate heat for the component.

[0059] In one implementation, when the component is a component in the first group or the second group, the control amount H of the cooling fan corresponding to the component is calculated according to formula (1), and the corresponding cooling fan cools the component according to the control amount H:

[0060]

[0061] Among them, K is a constant; T1 is the temperature value of the component; T0 is the preset value of the component.

[0062] When the component is a component in the third group and the third heat dissipation unit only includes a liquid cooling heat dissipation component, the liquid flow rate v of the liquid cooling heat dissipation component is calculated according to formula (2), and the liquid cooling heat dissipation component dissipates heat for the component according to the liquid flow rate v:

[0063]

[0064] Where, P is the rated power of the component; C P is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component.

[0065] As an alternative implementation, when the component is a component in the third group and the third heat dissipation unit includes a liquid cooling component and a low-power or high-power cooling fan, the liquid flow rate v of the liquid cooling component and the control amount H of the cooling fan corresponding to the component are calculated respectively:

[0066]

[0067]

[0068] Among them, K is a constant; P is the rated power of the component; C P is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component; A+B=100%, A is between 10% and 20%, and B is between 80% and 90%. A represents the contribution of the cooling fan corresponding to the component to the heat dissipation of the component; B represents the contribution of the liquid cooling component to the heat dissipation of the component; the values ​​of A and B can be obtained by calculation or experience.

[0069] According to one aspect of the present application, a server heat dissipation device is provided. The server includes a housing 100 and a plurality of components 200 located inside the housing 100. Figure 2 , the server heat dissipation device includes multiple groups, a temperature control device and a control device 500. Each group includes at least one component 200, and the range of the slope value of the temperature change curve of the component 200 in the preset operating time period is different between different groups. The components 200 in each group are provided with a heat dissipation module 400 of the same structure, and the corresponding heat dissipation modules 400 between different groups have different structures. The temperature control device includes a temperature sensor 300 connected to each component 200 in each group, and the temperature sensor 300 is used to obtain the real-time temperature value of the corresponding component. The control device 500 is connected to the temperature sensor 300 and the heat dissipation module 400 in communication. After receiving the real-time temperature value of a component, the control device 500 compares the real-time temperature value with the corresponding threshold value, and when the real-time temperature value is greater than the corresponding threshold value, the heat dissipation module 400 corresponding to it is turned on to dissipate heat for the component.

[0070] The temperature sensor 300 is a contact temperature sensor such as a pressure thermometer or a thermocouple, or a non-contact temperature sensor such as a photoelectric thermometer or a radiation pyrometer.

[0071] The components 200 include a central processing unit, a mainboard, a memory, a hard disk, a power supply and other components.

[0072] In one embodiment, the number of groups is three. The slope values ​​of the components in the first group are all less than the first preset value; the slope values ​​of the components in the second group are all between the first preset value and the second preset value; the slope values ​​of the components in the third group are all greater than the second preset value. Therefore, the slope value relationship of the temperature change curve corresponding to the components 200 in the three groups is: first group < second group < third group, that is, the heating conditions corresponding to the components 200 in the three groups are: first group < second group < third group.

[0073] It should be noted that the number of groups is only exemplary, and the present application does not impose any specific limitation on the number of groups. Any number that can achieve grouping according to the heating conditions of the components 200 falls within the scope of protection of the present application.

[0074] In one embodiment, the components 200 in the first group correspond to the first heat dissipation module 410, which is a low-power heat dissipation fan; the components 200 in the second group correspond to the second heat dissipation module 420, which is a high-power heat dissipation fan; the components 200 in the third group correspond to the third heat dissipation module 430, which is a liquid cooling heat dissipation component arranged around the outer surface of all components in the third group. The liquid cooling heat dissipation component includes a liquid cooling pipe and a cooling circulating liquid, and the liquid cooling pipe includes a plurality of sub-pipes corresponding to the components in the third group, respectively. When a component in the third group needs to be cooled, it is only necessary to pump the cooling circulating liquid into the sub-pipe corresponding to the component at a predetermined flow rate. For the components 200 in the first group and the second group, each component 200 corresponds to a low-power or high-power heat dissipation fan.

[0075] In this embodiment, the heat dissipation module corresponding to the component 200 in each group matches the heat generation condition of the component 200 in the group. The heat dissipation module is used to dissipate heat to the corresponding component 200, which can reduce energy waste and improve the heat dissipation efficiency of the server while meeting its heat dissipation requirements.

[0076] As an alternative embodiment, for the second heat dissipation unit 420 corresponding to each component 200 in the second group, a ventilation hole corresponding to its position is provided on the shell 100 (not shown in the figure), and the ventilation hole works together with the high-power cooling fan corresponding to the second group to dissipate heat for the components in the second group.

[0077] As an alternative implementation, the third heat dissipation module 430 further includes a low-power or high-power heat dissipation fan, which is used in conjunction with the liquid cooling assembly to dissipate heat for the components in the third group.

[0078] When it is necessary to dissipate heat for the component 200, if the component 200 belongs to the first group or the second group, the cooling fans in the first group and the second group calculate the control amount H of the cooling fans according to the method involved in the above-mentioned server cooling method, and the corresponding cooling fans dissipate heat for the component 200 according to the control amount H.

[0079] If the component 200 belongs to the third group and the third heat dissipation module 430 only includes a liquid-cooled heat dissipation component, the liquid-cooled heat dissipation component in the third group calculates the liquid flow rate v of the liquid-cooled heat dissipation component according to the method involved in the above-mentioned server heat dissipation method, and the liquid-cooled heat dissipation component dissipates heat for the component 200 according to the liquid flow rate v.

[0080] If the component 200 belongs to the third group, and the third heat dissipation module 430 includes a liquid-cooled heat dissipation component and a low-power or high-power cooling fan, the liquid flow rate v of the liquid-cooled heat dissipation component and the control quantity H of the cooling fan corresponding to the component are calculated respectively according to the method involved in the above-mentioned server heat dissipation method, so that the liquid-cooled heat dissipation component and the low-power or high-power cooling fan can dissipate heat to the component 200.

[0081] It can be seen from the above technical solutions that the method in the present application groups multiple components according to the slope value of the temperature change curve of the components within a preset operating time period. Each grouped component corresponds to a heat dissipation unit of the same structure, and the heat dissipation unit matches the heating conditions of the components in the group. Different groups correspond to heat dissipation units of different structures. When a component needs to be cooled, it is only necessary to make the heat dissipation unit corresponding to the component cool it. This method can select a heat dissipation unit that matches the heating conditions of different components, so that the corresponding heat dissipation unit cools it, thereby improving the heat dissipation efficiency of the server.

[0082] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present application. These improvements and substitutions should also be regarded as the scope of protection of the present application.

Claims

1. A method for heat dissipation of a server, the server comprising a housing and a plurality of components located inside the housing, characterized in that: The method comprises: Obtaining a temperature variation curve of each of the components within a preset operating time period; Calculating the slope of the temperature change curve corresponding to each component; grouping the multiple components according to the slope value, including: when the slope value of the component is less than a first preset value, the component is divided into a first group; when the slope value of the component is between the first preset value and the second preset value, the component is divided into a second group; when the slope value of the component is greater than the second preset value, the component is divided into a third group; A heat dissipation unit with the same structure is matched for the components in each group, and the structures of the heat dissipation units corresponding to different groups are different, including: matching a first heat dissipation unit for the components in the first group, the first heat dissipation unit is a low-power heat dissipation fan; matching a second heat dissipation unit for the components in the second group, the second heat dissipation unit is a high-power heat dissipation fan; matching a third heat dissipation unit for the components in the third group, the third heat dissipation unit is a liquid-cooled heat dissipation component; the liquid-cooled heat dissipation component is arranged around the outer surfaces of all components in the third group; Monitor the real-time temperature value of each component and compare it with the corresponding threshold value; when the real-time temperature value of the component is greater than the corresponding threshold value, turn on the corresponding heat dissipation unit to dissipate heat for the component; When the component is a component in the third group, the liquid flow rate v of the liquid cooling component and the control amount H of the cooling fan corresponding to the component are calculated respectively: Among them, K is a constant; P is the rated power of the component; C P is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component; A+B=100%, A is between 10% and 20%, and B is between 80% and 90%.

2. The server heat dissipation method according to claim 1, characterized in that: For the second heat dissipation unit corresponding to each component in the second group, the shell is provided with a ventilation hole corresponding to its position.

3. The server heat dissipation method according to claim 1, characterized in that: The third heat dissipation unit also includes a low-power or high-power heat dissipation fan.

4. The server heat dissipation method according to claim 1, 2 or 3, characterized in that: When the component is a component in the first group or the second group, the control amount H of the cooling fan corresponding to the component is calculated according to the following formula, and the cooling fan cools the component according to the control amount H: Among them, K is a constant; T1 is the temperature value of the component; T0 is the preset value of the component.

5. A server heat dissipation device, the server comprising a housing and a plurality of components located inside the housing, characterized in that: The device comprises: A plurality of groups, each of which includes at least one of the components, and the range of the slope value of the temperature change curve of the components in the preset operation time period is different between different groups; the components in each group are provided with a heat dissipation module of the same structure, and the corresponding heat dissipation module structures are different between different groups; the number of the groups is three, and the relationship between the slope values ​​of the corresponding temperature change curves of the components between the three groups is: the first group < the second group < the third group; the heat dissipation module structure of the components in the third group includes a liquid cooling heat dissipation component; the liquid cooling heat dissipation component is arranged around the outer surface of all the components in the third group; A temperature control device, comprising a temperature sensor connected to each component in each of the groups, the temperature sensor being used to obtain a real-time temperature value of the corresponding component; A control device is communicatively connected with the temperature sensor and the heat dissipation module; after receiving the real-time temperature value of a component, the control device compares the real-time temperature value with a corresponding threshold value, and when the real-time temperature value is greater than the corresponding threshold value, turns on the heat dissipation module corresponding to the component to dissipate heat; wherein, when the component is a component in the third group, the liquid flow rate v of the liquid cooling heat dissipation assembly and the control amount H of the heat dissipation fan corresponding to the component are respectively calculated: Among them, K is a constant; P is the rated power of the component; C P is the specific heat capacity of the liquid; ρ is the density of the liquid; T1 is the temperature value of the component; T0 is the preset value of the component; A+B=100%, A is between 10% and 20%, and B is between 80% and 90%.

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