Inductor parts

Abstract

The present invention provides a small inductor component. A body (BD) has a main surface (MF). A first inductor wiring (20R) and a second inductor wiring (20L) extend in parallel with the main surface (MF) in the body (BD). The number of turns of the second inductor wiring (20L) is 0.25 turns. The first inductor wiring (20R) includes a first wiring main body (21R) extending linearly. The second inductor wiring (20L) includes a second wiring main body (21L) extending linearly. The wiring length of the second wiring main body (21L) in the second inductor wiring (20L) is 1.2 times or more of the wiring length of the first wiring main body (21R) in the first inductor wiring (20R).

Description

Technical Field

[0001] The present invention relates to inductor components. Background Art

[0002] The inductor component disclosed in Patent Document 1 has a blank including a magnetic layer. A first coil pattern and a second coil pattern having different electrical characteristics are provided in the blank as inductor wiring. The first coil pattern and the second coil pattern both extend in a spiral shape. In addition, the first coil pattern and the second coil pattern are respectively arranged in different layers.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2017-228764

[0004] In the inductor component of Patent Document 1, in order to reduce the size in the thickness direction, it is considered to arrange the first coil pattern and the second coil pattern in the same layer. However, in the inductor component of Patent Document 1, the first coil pattern and the second coil pattern are spiral. Therefore, if the first coil pattern and the second coil pattern are to be arranged in the same layer, it is necessary to ensure a large area sufficient to arrange two spiral patterns as the area of ​​the layer. That is, in exchange for reducing the size in the thickness direction, the size in the direction orthogonal to the thickness direction must be increased, which hinders the miniaturization of the inductor component. Summary of the invention

[0005] In order to solve the above-mentioned problems, one embodiment of the present invention is an inductor component comprising: a body having a main surface; a plurality of inductor wirings arranged on the same plane in the body and extending parallel to the main surface; and a first vertical wiring and a second vertical wiring extending from the inductor wiring in a thickness direction toward the main surface and exposed on the main surface, the inductor wiring comprising: a wiring main body having a turn number of 0.5 or less and extending linearly; a first pad provided at a first end of the wiring main body and connected to the first vertical wiring; and a second pad provided at a second end of the wiring main body and connected to the second vertical wiring, wherein when one of the plurality of inductor wirings is set as the first inductor wiring and another of the inductor wirings is set as the second inductor wiring, a wiring length of the wiring main body in the second inductor wiring is 1.2 times or more of a wiring length of the wiring main body in the first inductor wiring.

[0006] According to the above configuration, a plurality of inductor wirings having different wiring lengths are arranged on the same plane in the body. Therefore, the inductor component is unlikely to become larger in the thickness direction. In addition, since the number of turns of each inductor wiring is 0.5 turns or less, even if a plurality of inductor wirings are arranged on the same plane, the inductor wirings will not expand on the plane, which can contribute to the miniaturization of the inductor component.

[0007] In addition, according to the above configuration, the wiring length of the second inductor wiring is longer than that of the first inductor wiring. Therefore, reflecting the difference in wiring length, the inductance value of the second inductor wiring is larger than the inductance value of the first inductor wiring. Therefore, by selecting the inductor wiring through which the current flows, the inductance value suitable for the use state of the inductor component can be obtained.

[0008] It is possible to suppress an increase in the size of the inductor component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is an exploded perspective view of the inductor components.

[0010] Figure 2 is a perspective top view of the inductor component.

[0011] Figure 3 It is along Figure 2 A cross-sectional view of the inductor component of line 3-3 in FIG.

[0012] Figure 4 It is along Figure 2 A cross-sectional view of a 4-4 line inductor component.

[0013] Figure 5 It is along Figure 2 A cross-sectional view of the 5-5 line inductor component.

[0014] Figure 6 It is a side view showing a first side surface of the inductor component.

[0015] Figure 7 This is a diagram for explaining a method of manufacturing an inductor component.

[0016] Figure 8 This is a diagram for explaining a method of manufacturing an inductor component.

[0017] Fig. 9 This is a diagram for explaining a method of manufacturing an inductor component.

[0018] Fig.10 This is a diagram for explaining a method of manufacturing an inductor component.

[0019] Fig.11 This is a diagram for explaining a method of manufacturing an inductor component.

[0020] Fig.12 This is a diagram for explaining a method of manufacturing an inductor component.

[0021] Fig.13 This is a diagram for explaining a method of manufacturing an inductor component.

[0022] Fig.14This is a diagram for explaining a method of manufacturing an inductor component.

[0023] Fig.15 This is a diagram for explaining a method of manufacturing an inductor component.

[0024] Fig.16 This is a diagram for explaining a method of manufacturing an inductor component.

[0025] Fig.17 This is a diagram for explaining a method of manufacturing an inductor component.

[0026] Fig.18 This is a diagram for explaining a method of manufacturing an inductor component.

[0027] Fig.19 This is a diagram for explaining a method of manufacturing an inductor component.

[0028] Fig. 20 This is a diagram for explaining a method of manufacturing an inductor component.

[0029] Fig.21 It is a perspective plan view of an inductor component according to a modified example.

[0030] Fig. 22 It is a perspective plan view of an inductor component according to a modified example.

[0031] Explanation of the reference numerals: 10…inductor component, 20R…first inductor wiring, 20L…second inductor wiring, 21R…first wiring body, 21L…second wiring body, 22R…first solder pad, 22L…first solder pad, 23R…second solder pad, 50…magnetic layer, 71…first vertical wiring, 72…second vertical wiring, 80…terminal portion, 81…first external terminal, 82…second external terminal, 83…dummy portion, BD…blank, MF…main surface. DETAILED DESCRIPTION

[0032] The inductor component will be described below. In addition, in some drawings, components are enlarged to facilitate understanding. The dimensional ratio of components may be different from the actual dimensional ratio or the dimensional ratio in other drawings.

[0033] like Figure 1 As shown in FIG. 1 , the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In the following description, one side in the thickness direction Td is referred to as the upper side, and the opposite side is referred to as the lower side.

[0034] The first layer L1 includes a first inductor wiring 20R, a second inductor wiring 20L, a first support wiring 41 , a second support wiring 42 , an inner magnetic path portion 51 , and an outer magnetic path portion 52 .

[0035] The first layer L1 is a rectangle when viewed from the thickness direction Td. In addition, the direction along the long side of the rectangle is referred to as the long side direction Ld, and the direction along the short side is referred to as the short side direction Wd.

[0036] The first inductor wiring 20R includes a first wiring body 21R, a first pad 22R provided at a first end of the first wiring body 21R, and a second pad 23R provided at a second end of the first wiring body 21R. The first wiring body 21R extends linearly along the long side direction Ld of the first layer L1. In the first wiring body 21R, the first pad 22R is connected to the first end on the first end side of the long side direction Ld. The dimension of the first pad 22R in the short side direction Wd is larger than the dimension of the first wiring body 21R in the short side direction Wd. When viewed from the thickness direction Td, the first pad 22R is substantially square. In addition, in the first wiring body 21R, the second pad 23R is connected to the second end on the second end side of the long side direction Ld. The dimension of the second pad 23R in the short side direction Wd is larger than the dimension of the first wiring body 21R in the short side direction Wd. When viewed from the thickness direction Td, the second pad 23R is substantially square like the first pad 22R. Furthermore, the first inductor wiring 20R is arranged closer to the second end side in the short-side direction Wd of the first layer L1 .

[0037] The second inductor wiring 20L includes a second wiring main body 21L, a first pad 22L provided at a first end of the second wiring main body 21L, and the above-described second pad 23R provided at a second end of the second wiring main body 21L.

[0038] The second wiring body 21L has two straight portions and a portion connecting these straight portions, and as a whole extends in an L shape. Specifically, the second wiring body 21L includes a long straight portion 31 extending in the long side direction Ld, a short straight portion 32 extending in the short side direction Wd, and a connecting portion 33 connecting these straight portions.

[0039] like Figure 2 As shown, when a straight line passing through the center of the short side direction Wd of the first layer L1 and extending in the long side direction Ld is set as the symmetry axis AX, the long straight portion 31 is arranged at a position symmetrical to the first wiring body 21R with respect to the symmetry axis AX. In addition, the length of the long straight portion 31 extending in the long side direction Ld is slightly longer than the length of the first wiring body 21R extending in the long side direction Ld. In addition, the dimension of the long straight portion 31 in the short side direction Wd is equal to the dimension of the short side direction Wd of the first wiring body 21R. The first end of the long straight portion 31 on the first end side of the long side direction Ld is connected to the first pad 22R. The second end of the long straight portion 31 on the second end side of the long side direction Ld is connected to the first end of the connecting portion 33.

[0040] The second end of the connection portion 33 not connected to the long straight portion 31 faces the second end in the short direction Wd. That is, the connection portion 33 is bent 90 degrees from the first end in the long direction Ld to the second end in the short direction Wd in the second wiring body 21L.

[0041] The second end of the connection portion 33 facing the second end side in the short-side direction Wd is connected to the first end of the short straight portion 32. The dimension of the short straight portion 32 in the long-side direction Ld is equal to the dimension of the long straight portion 31 in the short-side direction Wd. The second end of the short straight portion 32 facing the second end side in the short-side direction Wd is connected to the second pad 23R connected to the first wiring body 21R. That is, the second pad 23R in the first inductor wiring 20R and the second pad 23R in the second inductor wiring 20L are the same pad.

[0042] The number of turns of the second inductor wiring 20L is determined based on the virtual vector. The starting point of the virtual vector is arranged on the central axis C2 that passes through the center of the wiring width of the second wiring body 21L and extends in the extending arrangement direction of the second wiring body 21L. Moreover, regarding the virtual vector, when the starting point of the second wiring body 21L is moved from the state of being arranged at the first end to the second end of the central axis C2 when viewed from the thickness direction Td, the number of turns is determined to be 1.0 turns when the angle of rotation of the direction of the virtual vector is 360 degrees. However, in the case of winding multiple times in the direction of the virtual vector, the number of turns increases in the case of continuous winding in the same direction. In the case of winding in the direction of the virtual vector in a direction different from the direction of the previous winding, the number of turns is counted again from 0 turns. For example, in the case of winding 180 degrees clockwise and then winding 180 degrees counterclockwise, the number of turns is 0.5 turns. In the present embodiment, the direction of the virtual vector virtually arranged on the second wiring body 21L is rotated 90 degrees at the connection portion 33. Therefore, the number of turns of the second wiring main body 21L is 0.25 turns. In addition, the central axis C2 of the second wiring main body 21L is a line along the middle point of the second wiring main body 21L in a direction orthogonal to the direction in which the second wiring main body 21L extends. That is, the central axis C2 of the second wiring main body 21L is substantially L-shaped when viewed from the thickness direction Td.

[0043] like Figure 2 As shown in FIG. 1 , a first pad 22L is connected to a first end of a first end side of a long straight portion 31 of a second wiring main body 21L in a long side direction Ld. The first pad 22L has the same shape as the first pad 22R connected to the first wiring main body 21R. That is, when viewed from the thickness direction Td, the first pad 22L is substantially square. In addition, the first pad 22L is arranged to be line symmetrical with the first pad 22R connected to the first wiring main body 21R with respect to the symmetry axis AX.

[0044] In the first layer L1, the first support wiring 41 extends from the opposite side of the first wiring body 21R sandwiching the first pad 22R. That is, the first support wiring 41 extends from the edge of the first end side of the long side direction Ld in the first pad 22R. The first support wiring 41 extends linearly parallel to the long side direction Ld. The first support wiring 41 extends to the first side surface 91 of the first end side of the long side direction Ld of the first layer L1, and is exposed at the first side surface 91. Similarly, in the first layer L1, the first support wiring 41 also extends from the opposite side of the second wiring body 21L sandwiching the first pad 22L.

[0045] In the first layer L1, the second support wiring 42 extends from the opposite side of the first wiring body 21R sandwiching the second pad 23R. That is, the second support wiring 42 extends from the edge of the second end side of the long side direction Ld in the second pad 23R. The second support wiring 42 extends linearly parallel to the long side direction Ld. The second support wiring 42 extends to the second side surface 92 of the second end side of the long side direction Ld of the first layer L1, and is exposed at the second side surface 92. In addition, in the present embodiment, no support wiring is provided on the opposite side of the short straight line portion 32 of the second wiring body 21L sandwiching the second pad 23R.

[0046] The first inductor wiring 20R and the second inductor wiring 20L are made of a conductive material. In the present embodiment, the first inductor wiring 20R and the second inductor wiring 20L may have a composition of 99 wt % or more of copper and 0.1 wt % or more and 1.0 wt % or less of sulfur.

[0047] The material of the first support wiring 41 and the second support wiring 42 is the same conductive material as the first inductor wiring 20R and the second inductor wiring 20L. However, a portion of the first support wiring 41 included in the exposed surface 41A exposed at the first side surface 91 is Cu oxide. Similarly, a portion of the second support wiring 42 included in the exposed surface 42A exposed at the second side surface 92 is Cu oxide.

[0048] like Figure 1 As shown, in the first layer L1, the area between the first inductor wiring 20R and the second inductor wiring 20L becomes the inner magnetic circuit portion 51. The material of the inner magnetic circuit portion 51 is an organic resin containing metal magnetic powder. In this embodiment, the metal magnetic powder is a metal magnetic powder containing an Fe-based alloy or an amorphous alloy thereof. More specifically, the metal magnetic powder is a FeSiCr-based metal powder containing iron. In addition, the average particle size of the metal magnetic powder can be about 5 microns.

[0049] In this embodiment, the particle size of the metal magnetic powder refers to the longest length of a line segment extending from edge to edge of the cross-sectional shape of the metal magnetic powder appearing in the cross-sectional shape of the inner magnetic circuit portion 51. Furthermore, the average particle size refers to the average of the particle sizes of the metal magnetic powder at three or more random points in the cross-sectional shape of the metal magnetic powder appearing in the cross-sectional shape of the inner magnetic circuit portion 51.

[0050] In the first layer L1, when viewed in the thickness direction Td, the region closer to the second end of the first inductor wiring 20R in the short-side direction Wd and the region closer to the first end of the second inductor wiring 20L in the short-side direction Wd are the outer magnetic path portion 52. The outer magnetic path portion 52 is made of the same magnetic material as the inner magnetic path portion 51.

[0051] In the present embodiment, the dimension of the first layer L1 in the thickness direction Td, that is, the dimension of the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 in the thickness direction Td can be approximately 40 micrometers.

[0052] A second layer L2 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the lower surface of the first layer L1 in the thickness direction Td. The second layer L2 includes two insulating resins 61 and an insulating resin magnetic layer 53 .

[0053] The insulating resin 61 covers the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 from the lower side in the thickness direction Td. When viewed from the thickness direction Td, the insulating resin 61 has a shape that covers a slightly wider range than the outer edges of the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42. As a result, one insulating resin 61 has a straight strip shape. The other insulating resin 61 has a strip shape extending in a substantially L shape. The material of the insulating resin 61 is an insulating resin, and in this embodiment, for example, a polyimide resin can be used. The insulating property of the insulating resin 61 is higher than that of the first inductor wiring 20R and the second inductor wiring 20L. Two insulating resins 61 are arranged side by side in the short-side direction Wd in accordance with the number and arrangement of the first inductor wiring 20R and the second inductor wiring 20L, and are connected to each other at the end.

[0054] In the second layer L2, the portion other than the two insulating resins 61 is the insulating resin magnetic layer 53. The insulating resin magnetic layer 53 is made of the same magnetic material as the inner magnetic path portion 51 and the outer magnetic path portion 52 described above.

[0055] The third layer L3 having the same rectangular shape as the second layer L2 when viewed from the thickness direction Td is stacked on the lower surface of the second layer L2 in the thickness direction Td. The third layer L3 is the first magnetic layer 54. Therefore, the first magnetic layer 54 is arranged below the first inductor wiring 20R and the second inductor wiring 20L. The material of the first magnetic layer 54 is an organic resin containing the same metal magnetic powder as the above-mentioned inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the insulating resin magnetic layer 53.

[0056] On the other hand, a fourth layer L4 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the upper surface of the first layer L1 in the thickness direction Td. The fourth layer L4 includes two first vertical wirings 71 , one second vertical wiring 72 , and a second magnetic layer 55 .

[0057] The first vertical wiring 71 is directly connected to the upper surfaces of the first pads 22R and 22L in the first inductor wiring 20R and the second inductor wiring 20L without passing through other layers. That is, the first vertical wiring 71, the first end of the first wiring body 21R, and the first support wiring 41 are connected to the first pad 22R. The first vertical wiring 71, the first end of the second wiring body 21L, and the first support wiring 41 are connected to the first pad 22L. The two first vertical wirings 71 are arranged at positions that are line-symmetrical with respect to the symmetry axis AX. The material of the first vertical wiring 71 is the same as that of the first inductor wiring 20R and the second inductor wiring 20L. The first vertical wiring 71 is in the shape of a regular quadrangular prism, and the axial direction of the regular quadrangular prism coincides with the thickness direction Td.

[0058] like Figure 2 As shown, when viewed from the thickness direction Td, the size of each side of the square first vertical wiring 71 is slightly smaller than the size of each side of the square first pads 22R, 22L. Therefore, the area of ​​the first pads 22R, 22L is larger than the area of ​​the first vertical wiring 71 at the connection position with the first pads 22R, 22L. In addition, when viewed from the upper side of the thickness direction Td, the central axis CV1 of the first vertical wiring 71 coincides with the geometric center of the substantially square first pads 22R, 22L. Two first vertical wirings 71 are provided corresponding to the number of the first pads 22R, 22L.

[0059] like Figure 1As shown in FIG. 1 , the second vertical wiring 72 is directly connected to the upper surface of the second pad 23R in the first inductor wiring 20R without passing through other layers. That is, the second vertical wiring 72, the second end of the first wiring body 21R, the second end of the second wiring body 21L, and the second supporting wiring 42 are connected to the second pad 23R. The material of the second vertical wiring 72 is the same as that of the first inductor wiring 20R. The second vertical wiring 72 is in the shape of a regular quadrangular prism, and the axial direction of the regular quadrangular prism coincides with the thickness direction Td.

[0060] like Figure 2 As shown, when viewed from the thickness direction Td, the size of each side of the square second vertical wiring 72 is slightly smaller than the size of each side of the square second pad 23R. Therefore, the area of ​​the second pad 23R is larger than the area of ​​the second vertical wiring 72 at the connection position with the second pad 23R. In addition, when viewed from the upper side of the thickness direction Td, the central axis CV2 of the second vertical wiring 72 coincides with the geometric center of the substantially square second pad 23R. One second vertical wiring 72 is provided corresponding to the number of second pads 23R.

[0061] like Figure 1 As shown, in the fourth layer L4, the portion other than the two first vertical wirings 71 and the one second vertical wiring 72 becomes the second magnetic layer 55. Therefore, the second magnetic layer 55 is stacked on the upper surfaces of the first inductor wiring 20R, the second inductor wiring 20L, and the supporting wirings 41 and 42. The material of the second magnetic layer 55 is the same magnetic material as the first magnetic layer 54 described above.

[0062] In the inductor component 10, the magnetic layer 50 is constituted by the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55. The inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are connected and surround the first inductor wiring 20R and the second inductor wiring 20L. In this way, the magnetic layer 50 constitutes a closed magnetic circuit with respect to the first inductor wiring 20R and the second inductor wiring 20L. Therefore, the first inductor wiring 20R and the second inductor wiring 20L extend inside the magnetic layer 50. In addition, although the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are shown separately, there is a case where they are integrated as the magnetic layer 50 and the boundary cannot be confirmed.

[0063] The fifth layer L5 having the same rectangular shape as the fourth layer L4 when viewed from the thickness direction Td is stacked on the upper surface of the fourth layer L4 on the upper side in the thickness direction Td. The fifth layer L5 includes four terminal portions 80 and an insulating layer 90. Two of the four terminal portions 80 are first external terminals 81 electrically connected to the first inductor wiring 20R or the second inductor wiring 20L via the first vertical wiring 71. In addition, one of the four terminal portions 80 is a second external terminal 82 electrically connected to the first inductor wiring 20R and the second inductor wiring 20L via the second vertical wiring 72. The remaining one of the four terminal portions 80 other than the first external terminal 81 and the second external terminal 82 is a dummy portion 83 not electrically connected to any of the first inductor wiring 20R and the second inductor wiring 20L.

[0064] like Figure 2 As shown, when an imaginary straight line BX is drawn that passes through the center of the long side direction Ld of the fifth layer L5 and is parallel to the short side direction Wd, the point on the upper surface of the fifth layer L5 where the above-mentioned symmetry axis AX intersects the imaginary straight line BX is the geometric center G of the fifth layer L5. The four terminal portions 80 are arranged at positions that are secondarily symmetrical with respect to the geometric center G of the fifth layer L5 when viewed from the thickness direction Td.

[0065] The first external terminal 81 is directly connected to the upper surface of the first vertical wiring 71 without passing through other layers. The first external terminal 81 is rectangular when viewed from the thickness direction Td, and is also located on the second magnetic layer 55. The area of ​​the first external terminal 81 in contact with the first vertical wiring 71 is less than half of the entire area of ​​the first external terminal 81. The long side of the rectangle of the first external terminal 81 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5. Two first external terminals 81 are provided corresponding to the number of first vertical wirings 71.

[0066] The second external terminal 82 is directly connected to the upper surface of the second vertical wiring 72 without passing through other layers. The area where the second external terminal 82 contacts the second vertical wiring 72 is less than half of the entire area of ​​the second external terminal 82. The second external terminal 82 is rectangular when viewed from the thickness direction Td, and is also located on the second magnetic layer 55. The long sides of the rectangle of the second external terminal 82 extend parallel to the long side direction Ld of the fifth layer L5, and the short sides extend parallel to the short side direction Wd of the fifth layer L5.

[0067] One of the four terminal portions 80 is a dummy portion 83. Figure 3 As shown, the dummy portion 83 is directly connected to the upper surface of the second magnetic layer 55 of the fourth layer L4 without passing through other layers. Figure 2As shown, the dummy portion 83 has a shape different from the first external terminal 81 and the second external terminal 82 when viewed from the thickness direction Td. In the present embodiment, the dummy portion 83 is an ellipse when viewed from the thickness direction Td. On the other hand, the shape of the dummy portion 83 is not limited thereto, and for example, it may be a rectangle or a circle different from the first external terminal 81 and the second external terminal 82. The major axis of the ellipse of the dummy portion 83 extends parallel to the long side direction Ld of the fifth layer L5, and the minor axis extends parallel to the short side direction Wd of the fifth layer L5.

[0068] When viewed from the thickness direction Td, most of the dummy portion 83 overlaps with the second inductor wiring 20L. In addition, when viewed from the thickness direction Td, the area of ​​the dummy portion 83 is the same as the area of ​​the first external terminal 81 and the second external terminal 82. In this embodiment, "the same area" means that manufacturing errors are allowed. Therefore, if the difference between the area of ​​the dummy portion 83 and the first external terminal 81 and the second external terminal 82 is within ±10%, the areas are considered to be the same.

[0069] The four terminal portions 80 are composed of a plurality of conductive layers. Specifically, they are a three-layer structure of copper, nickel, and gold. In addition, when viewed from the thickness direction Td, the second magnetic layer 55 and the first vertical wiring 71 on the lower side in the thickness direction Td can be seen through the first external terminal 81. The area where the first vertical wiring 71 can be seen through the first external terminal 81 is an area less than half of the first external terminal 81 when viewed from the thickness direction Td.

[0070] Similarly, the second magnetic layer 55 and the second vertical wiring 72 provided on the lower side in the thickness direction Td may be seen through the second external terminal 82. The area where the second vertical wiring 72 can be seen through the second external terminal 82 is an area less than half of the second external terminal 82 when viewed in the thickness direction Td.

[0071] In the dummy portion 83, the second magnetic layer 55 provided on the lower side in the thickness direction Td can be seen through. On the other hand, the area of ​​the second magnetic layer 55 that can be seen through the first external terminal 81 is an area of ​​more than half of the first external terminal 81. The area of ​​the second magnetic layer 55 that can be seen through the second external terminal 82 is an area of ​​more than half of the second external terminal 82. That is, when viewed from the thickness direction Td, the entire dummy portion 83 and the areas of more than half of the first external terminal 81 and the second external terminal 82 are optically the same color. For the same color here, for example, when using a color difference meter, the same color is considered when the difference in the numerical values ​​representing RGB is within a specified range. In addition, the specified range is, for example, 10%.

[0072] In the fifth layer L5, the portion other than the terminal portion 80 is an insulating layer 90. In other words, the range of the upper surface of the fourth layer L4 that is not covered by the two first external terminals 81, the one second external terminal 82, and the one dummy portion 83 is covered by the insulating layer 90 of the fifth layer L5. The insulating property of the insulating layer 90 is higher than that of the magnetic layer 50. In the present embodiment, the insulating layer 90 is a solder resist. The dimension of the insulating layer 90 in the thickness direction Td is smaller than the dimension of any of the terminal portions 80 in the thickness direction Td.

[0073] In the present embodiment, the green body BD is formed by the magnetic layer 50, the insulating resin 61, and the insulating layer 90. That is, the green body BD is rectangular when viewed in the thickness direction Td. In the present embodiment, the dimension of the green body BD in the thickness direction Td can be approximately 0.2 mm.

[0074] The surface of the base body BD that is on the upper side of the insulating layer 90 in the thickness direction Td is the main surface MF. Therefore, the first inductor wiring 20R and the second inductor wiring 20L extend in parallel with the main surface MF of the base body BD. Moreover, the first vertical wiring 71 extends from the first pad 22R of the first inductor wiring 20R toward the main surface MF along the thickness direction Td. Similarly, the first vertical wiring 71 extends from the first pad 22L of the second inductor wiring 20L toward the main surface MF. The first vertical wiring 71 is exposed on the main surface MF. The first vertical wiring 71 extends from the first pad 22L of the second inductor wiring 20L toward the main surface MF along the thickness direction Td. The first vertical wiring 71 is exposed on the main surface MF.

[0075] The second vertical wiring 72 extends from the second pad 23R toward the main surface MF along the thickness direction Td. The second vertical wiring 72 is exposed on the main surface MF. The upper surface of the terminal portion 80 is exposed on the main surface MF and is located on the upper side of the thickness direction Td compared to the main surface MF. That is, the outer edge of each terminal portion 80 including the dummy portion 83 is in contact with the insulating layer 90. In addition, as in the present embodiment, there is also a case where at least a portion of the surface of the first vertical wiring 71 and the second vertical wiring 72 exposed on the main surface MF is covered by the first external terminal 81 and the second external terminal 82.

[0076] The blank BD has a first side surface 93 perpendicular to the main surface MF. In addition, the first side surface 91 of the first layer L1 is a part of the first side surface 93 of the blank BD. In addition, the blank BD has a side surface perpendicular to the main surface MF and a second side surface 94 parallel to the first side surface 93. In addition, the second side surface 92 of the first layer L1 is a part of the second side surface 94 of the blank BD. That is, the first support wiring 41 extends from the first inductor wiring 20R in parallel with the main surface MF, and the end portion is exposed at the first side surface 93 of the blank BD. Similarly, the second support wiring 42 extends from the first inductor wiring 20R in parallel with the main surface MF, and the end portion is exposed at the second side surface 94 of the blank BD.

[0077] In the present embodiment, when viewed from the thickness direction Td, the geometric center G of the fifth layer L5 coincides with the geometric center G of the main surface MF. In addition, the geometric center G of the main surface MF coincides with the geometric center G of the body BD.

[0078] like Figure 2 As shown, on the main surface MF, no dummy portion 83 is provided on the first end side closer to the long side direction Ld than the geometric center G in the short side direction Wd extending from the imaginary straight line BX. In addition, on the main surface MF, the same number of dummy portions 83 as the number of second external terminals 82 are provided on the second end side closer to the long side direction Ld than the geometric center G in the short side direction Wd extending from the imaginary straight line BX.

[0079] Next, each wiring is described in detail.

[0080] like Figure 2 As shown, the center axis C1 of the first wiring body 21R extends in the longitudinal direction Ld when viewed from the thickness direction Td. The center axis C1 of the first wiring body 21R is a line along the midpoint of the first wiring body 21R in the lateral direction Wd, which is perpendicular to the direction in which the first wiring body 21R extends.

[0081] As described above, the central axis C2 of the second wiring main body 21L of the second inductor wiring 20L extends substantially in an L shape. Here, the wiring length of the long straight portion 31 of the second wiring main body 21L is longer than the wiring length of the first wiring main body 21R. In addition, the second wiring main body 21L has a connecting portion 33 and a short straight portion 32. Therefore, the wiring length of the second wiring main body 21L is longer than the wiring length of the first wiring main body 21R. Specifically, the wiring length of the second wiring main body 21L is 1.2 times or more of the wiring length of the first wiring main body 21R.

[0082] Reflecting the above-mentioned difference in wiring length, the inductance value of the second inductor wiring 20L is 1.1 times or more the inductance value of the first inductor wiring 20R. In addition, in the present embodiment, the inductance value of the first inductor wiring 20R can be approximately 2.5 nH.

[0083] The first wiring body 21R of the first inductor wiring 20R extends along one side of the outer edge in the longitudinal direction Ld of the base body BD. The first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at positions symmetrical with respect to the geometric center G of the base body BD. In the present embodiment, the first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at positions twice symmetrical with respect to the geometric center G.

[0084] The first inductor wiring 20R has a parallel portion extending parallel to the second inductor wiring 20L. Specifically, the long straight portion 31 of the first wiring main body 21R and the second wiring main body 21L corresponds to the parallel portion. In the first layer L1, the first wiring main body 21R and the long straight portion 31 are arranged side by side in the short-side direction Wd. In addition, the parallel portion only needs to be substantially parallel, and manufacturing errors are allowed.

[0085] In the following description, the distance between the central axis C1 of the first wiring body 21R and the central axis C2 of the long straight portion 31 of the second wiring body 21L in the short side direction Wd perpendicular to the direction in which the parallel portions extend and in which the parallel portions are arranged side by side is referred to as the spacing X1 between the wiring bodies. That is, the spacing between the wiring bodies is the spacing between adjacent parallel portions.

[0086] In addition, the interval between adjacent parallel parts, i.e. Figure 2 The distance between the first end side of the short side direction Wd of the first wiring main body 21R and the second end side of the long straight portion 31 of the second wiring main body 21L in the short side direction Wd is, for example, approximately 200 micrometers.

[0087] like Figure 2 As shown, the distance from the parallel portion located at the second end side of the short side direction Wd, that is, the central axis C1 of the first wiring body 21R, to the end of the base body BD in the short side direction Wd closest to the first wiring body 21R, that is, the end side of the second end side is set as the first distance Y1.

[0088] The distance from the central axis C2 of the long straight portion 31, which is a parallel portion located at the first end side in the short side direction Wd, to the end of the blank BD in the short side direction Wd closest to the long straight portion 31, which is the end side of the first end side, is set as the second distance Y2. In the present embodiment, the first distance Y1 is the same size as the second distance Y2.

[0089] In the short side direction Wd, the size of the spacing X1 between the wiring bodies is different from both the first distance Y1 and the second distance Y2. Specifically, the spacing X1 between the wiring bodies can be approximately "250 microns". The first distance Y1 and the second distance Y2 can be approximately "175 microns". In this way, it is preferred that the first distance Y1 and the second distance Y2 are slightly larger than half of the spacing X1.

[0090] In addition, in the present embodiment, the average value of the pitch X1, the first distance Y1, and the second distance Y2 is "200 micrometers". The ratio of the pitch X1 to the above average value is "125%". In addition, the ratio of the first distance Y1 and the second distance Y2 to the above average value is "87.5%". Therefore, the ratios of the pitch X1, the first distance Y1, and the second distance Y2 to the above average value are all 50% or more and 150% or less.

[0091] The central axis A1 of the first support wiring 41 connected to the first pad 22R of the first inductor wiring 20R extends in the longitudinal direction Ld. The central axis A1 of the first support wiring 41 is a line along the midpoint of the first support wiring 41 in the lateral direction Wd, which is a direction perpendicular to the direction in which the first support wiring 41 extends.

[0092] The central axis A1 of the first support wiring 41 is located outside the central axis C1 of the first wiring body 21R in the short-side direction Wd. That is, the central axis A1 of the first support wiring 41 connected to the first inductor wiring 20R and the central axis C1 of the first wiring body 21R are located on different straight lines.

[0093] Furthermore, the extension line of the central axis A1 of the first support wiring 41 passes through the central axis CV1 of the first vertical wiring 71. That is, the extension line of the central axis A1 of the first support wiring 41 passes through the center of the connection surface between the first vertical wiring 71 and the first pad 22R.

[0094] The central axis A1 of the first support wiring 41 connected to the first pad 22L of the second inductor wiring 20L extends in the longitudinal direction Ld. The central axis A1 of the first support wiring 41 is a line along the midpoint of the first support wiring 41 in the lateral direction Wd, which is a direction perpendicular to the direction in which the first support wiring 41 extends.

[0095] The central axis A1 of the first support wiring 41 is located outside the central axis C2 of the second wiring body 21L in the short-side direction Wd. That is, the extension line of the central axis A1 of the first support wiring 41 connected to the second inductor wiring 20L and the central axis C2 of the second wiring body 21L are located on different straight lines.

[0096] Furthermore, the extension line of the central axis A1 of the first support wiring 41 passes through the central axis CV1 of the first vertical wiring 71. That is, the extension line of the central axis A1 of the first support wiring 41 passes through the center of the connection surface between the first vertical wiring 71 and the first pad 22L.

[0097] Furthermore, the first support wiring 41 to which the first inductor wiring 20R is connected and the first support wiring 41 to which the second inductor wiring 20L is connected are arranged at positions that are line-symmetrical with respect to the symmetry axis AX.

[0098] The central axis A2 of the second support wiring 42 extends in the longitudinal direction Ld. The central axis A2 of the second support wiring 42 is a line along the midpoint of the second support wiring 42 in the lateral direction Wd, which is a direction perpendicular to the direction in which the second support wiring 42 extends.

[0099] The central axis A2 of the second support wiring 42 is located outside the central axis C1 of the first wiring main body 21R in the short-side direction Wd. That is, the central axis A2 of the second support wiring 42 and the central axis C1 of the first wiring main body 21R are located on different straight lines.

[0100] In addition, the second vertical wiring 72 is arranged on the central axis A2 of the second support wiring 42. Moreover, the extension line of the central axis A2 of the second support wiring 42 passes through the central axis CV2 of the second vertical wiring 72. That is, the extension line of the central axis A2 of the second support wiring 42 passes through the center of the connection surface between the second vertical wiring 72 and the second pad 23R.

[0101] The first support wiring 41 and the second support wiring 42 extending from the first inductor wiring 20R are arranged at the same position in the short-side direction Wd. That is, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 are located on the same straight line. In addition, based on the minimum line width of the first inductor wiring 20R and the second inductor wiring 20L, if the deviation is within 10%, it is considered to be located on the same straight line. Specifically, the minimum line width of the first inductor wiring 20R and the second inductor wiring 20L in this embodiment can be the line width of the first wiring body 21R and the second wiring body 21L, that is, 50 microns. Therefore, "on the same straight line" in this embodiment refers to the case where the shortest distance between the two axes is within 5 microns, and "on different straight lines" refers to the case where the shortest distance between the two axes exceeds 5 microns.

[0102] As described above, in the first layer L1, the first supporting wirings 41 are arranged to be line-symmetrical with respect to the symmetry axis AX. Figure 2As shown, the distance Q1 from the end of the second end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the first inductor wiring 20R is the same as the distance Q2 from the end of the first end side in the short side direction Wd of the blank BD to the center axis A1 of the first support wiring 41 extending from the second inductor wiring 20L.

[0103] On the other hand, in the short-side direction Wd, the distance P1 from the central axis A1 of the first support wiring 41 extending from the first inductor wiring 20R to the central axis A1 of the first support wiring 41 extending from the second inductor wiring 20L is greater than the distance Q1 and the distance Q2 described above. Specifically, the distance P1 is approximately twice the length of the distance Q1 and the distance Q2.

[0104] like Figure 4 As shown, the wiring width H1 of the first wiring body 21R in the short-side direction Wd is equal to the wiring width H2 of the second wiring body 21L. In addition, since the first inductor wiring 20R and the second inductor wiring 20L are arranged in the same first layer L1, the dimensions of the first wiring body 21R and the second wiring body 21L in the thickness direction Td are also the same. Therefore, the cross-sectional area of ​​the first wiring body 21R in the cross section orthogonal to the central axis C1 of the first wiring body 21R is equal to the cross-sectional area of ​​the second wiring body 21L. In addition, in the present application, if the deviation of the cross-sectional area of ​​the first wiring body 21R and the second wiring body 21L is within 10%, they are considered to be equal.

[0105] like Figure 4 as well as Figure 5 As shown, the wiring width W1 of the first support wiring 41 in the short side direction Wd is smaller than the wiring width H1 of the first wiring body 21R in the short side direction Wd. Here, the first support wiring 41 and the first wiring body 21R are provided in the same first layer L1, and the dimensions in the thickness direction Td are substantially the same. Therefore, reflecting the difference in wiring width, the cross-sectional area of ​​each first support wiring 41 is smaller than the cross-sectional area of ​​the first wiring body 21R.

[0106] Likewise, if Figure 2 as well as Figure 4 As shown, the wiring width W2 of the second support wiring 42 in the short side direction Wd is smaller than the wiring width H1 of the first wiring body 21R in the short side direction Wd. Therefore, reflecting the difference in wiring width, the cross-sectional area of ​​the second support wiring 42 is smaller than that of the first wiring body 21R.

[0107] like Figure 6As shown in FIG. 1 , the ends of the two first support wirings 41 are exposed from the first side surface 93 on the first end side in the long-side direction Ld of the base body BD. In each of the first support wirings 41, the shape of the exposed surface 41A exposed on the first side surface 93 is a shape obtained by slightly stretching the cross-sectional shape of the first support wiring 41 orthogonal to the central axis A1. As a result, the area of ​​the exposed surface 41A of the first support wiring 41 is larger than the cross-sectional area of ​​the first support wiring 41 located inside the base body BD in the cross section orthogonal to the central axis A1. Similarly, the second support wiring 42 is exposed on the second side surface 94 on the second end side in the long-side direction Ld of the base body BD. In the second support wiring 42, the area of ​​the exposed surface 42A exposed on the second side surface 94 is larger than the cross-sectional area of ​​the second support wiring 42 located inside the base body BD in the cross section orthogonal to the central axis A2. As a result, the contact area of ​​the first support wiring 41 and the second support wiring 42 with the first side surface 93 and the second side surface 94 of the base body BD is increased, and the close contact between them is improved. In addition, as long as the size of the cross-sectional area satisfies the above relationship, for example, the exposed surface 41A may be in a shape in which one side is stretched and the other side is covered by the stretched portion of the blank BD.

[0108] Furthermore, two first support wirings 41 are exposed on the first side surface 93 , and one second support wiring 42 is exposed on the second side surface 94 , and the number of exposed support wirings is different.

[0109] Next, a method for manufacturing the inductor component 10 will be described.

[0110] like Figure 7 As shown, first, a base component preparation step is performed. Specifically, a plate-shaped base component 101 is prepared. The material of the base component 101 is ceramic. The base component 101 is a quadrilateral when viewed from the thickness direction Td. The size of each side is a size that can accommodate a plurality of inductor components 10. In the following description, the direction perpendicular to the surface direction of the base component 101 is set as the thickness direction Td for description.

[0111] Next, if Figure 8 As shown, the dummy insulating layer 102 is applied to the entire upper surface of the base member 101. Next, when viewed in the thickness direction Td, the insulating resin 61 is patterned by photolithography in a range slightly wider than the range where the first inductor wiring 20R and the second inductor wiring 20L are arranged.

[0112] Next, a seed layer forming step is performed to form the seed layer 103. Specifically, the copper seed layer 103 is formed on the upper surfaces of the insulating resin 61 and the dummy insulating layer 102 from the upper surface side of the base member 101 by sputtering. In the drawings, the seed layer 103 is shown with bold lines.

[0113] Next, if Fig. 9 As shown, a first covering step is performed to form a first covering portion 104 covering a portion of the upper surface of the seed layer 103 where the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 are not formed. Specifically, first, a photosensitive dry film resist is applied to the entire upper surface of the seed layer 103. Next, the entire upper surface of the dummy insulating layer 102 and the upper surface of the outer edge portion of the upper surface of the insulating resin 61 covered by the insulating resin 61 are exposed to be cured. Thereafter, the uncured portion of the applied dry film resist is removed by stripping with a liquid chemical. Thus, the cured portion of the applied dry film resist is formed as the first covering portion 104. On the other hand, the portion of the seed layer 103 that is removed by the liquid chemical and not covered by the first covering portion 104 is exposed. The dimension of the first covering portion 104 in the thickness direction Td, that is, the thickness ratio of the first covering portion 104 Figure 4 The first inductor wiring 20R and the second inductor wiring 20L of the inductor component 10 shown in the figure are slightly thick. In addition, the photolithography in other steps described later is also the same step, so the detailed description is omitted.

[0114] Next, if Fig.10 As shown, a wiring processing step is performed to form the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 on the portion of the upper surface of the insulating resin 61 that is not covered by the first covering portion 104 by electrolytic plating. Specifically, electrolytic copper plating is performed to cause copper to grow from the portion of the upper surface of the insulating resin 61 exposed from the seed layer 103. Thus, the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 are formed. Therefore, in this embodiment, the step of forming a plurality of inductor wirings is the same step as the step of forming a plurality of first support wirings 41 and the second support wiring 42 between pads connecting different inductor wirings. In addition, the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 are formed on the same plane. In addition, in Fig.10 In FIG. 1 , the first inductor wiring 20R and the second inductor wiring 20L are shown, but the supporting wirings are not shown.

[0115] Next, if Fig.11As shown in FIG. 1 , a second covering step of forming the second covering portion 105 is performed. The range in which the second covering portion 105 is formed is the entire upper surface of the first covering portion 104, the entire upper surface of each supporting wiring, and the upper surface of the first inductor wiring 20R and the second inductor wiring 20L where the first vertical wiring 71 and the second vertical wiring 72 are not formed. In this range, the second covering portion 105 is formed by the same photolithography as the method of forming the first covering portion 104. In addition, the dimension of the second covering portion 105 in the thickness direction Td is the same as that of the first covering portion 104.

[0116] Next, a vertical wiring processing step of forming each vertical wiring is performed. Specifically, the first vertical wiring 71 and the second vertical wiring 72 are formed by electrolytic copper plating in the portion of the first inductor wiring 20R and the second inductor wiring 20L that is not covered by the second covering portion 105. In the vertical wiring processing step, the upper end of the grown copper is set to be slightly lower than the upper surface of the second covering portion 105. Specifically, the dimension of the thickness direction Td of each vertical wiring before cutting described later is set to be the same as the dimension of the thickness direction Td of each inductor wiring.

[0117] Next, if Fig.12 As shown in FIG. 1 , a covering portion removal step of removing the first covering portion 104 and the second covering portion 105 is performed. Specifically, the first covering portion 104 and the second covering portion 105 are wet-etched using chemicals to peel off the first covering portion 104 and the second covering portion 105. Fig.12 In FIG. 1 , the first vertical wiring 71 is shown, but the second vertical wiring 72 is not shown.

[0118] Next, a seed layer etching step is performed to etch the seed layer 103. The exposed seed layer 103 is removed by etching the seed layer 103. In this way, each inductor wiring and each supporting wiring are formed by SAP (Semi Additive Process).

[0119] Next, if Fig.13 As shown, the second magnetic layer processing step of laminating the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 is performed. Specifically, first, the material of the magnetic layer 50, that is, the resin containing magnetic powder is applied to the upper surface side of the base member 101. At this time, the resin containing magnetic powder is applied so as to also cover the upper surface of each vertical wiring. Next, the resin containing magnetic powder is cured by stamping, and the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 are formed on the upper surface side of the base member 101.

[0120] Next, if Fig.14As shown, the upper side portion of the second magnetic layer 55 is cut until the upper surface of each vertical wiring is exposed. In addition, although the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 are formed integrally, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 are also shown separately in the drawings.

[0121] Next, if Fig.15 As shown, an insulating layer processing step is performed. Specifically, on the upper surface of the second magnetic layer 55 and the portion of the upper surface of each vertical wiring where the terminal portion 80 is not formed, a solder resist that functions as an insulating layer 90 is patterned by photolithography. In addition, in this embodiment, the direction orthogonal to the upper surface of the insulating layer 90, that is, the main surface MF of the blank BD is the thickness direction Td.

[0122] Next, if Fig.16 Specifically, the base member 101 and the dummy insulating layer 102 are completely removed by cutting. In addition, as a result of completely cutting the dummy insulating layer 102, the lower side of each insulating resin is also partially removed by cutting, but each inductor wiring is not removed.

[0123] Next, if Fig.17 As shown in FIG. 1 , the first magnetic layer processing step of laminating the first magnetic layer 54 is performed. Specifically, first, a resin containing magnetic powder, which is the material of the first magnetic layer 54, is applied to the lower side of the base member 101. Next, a press process is performed to harden the resin containing magnetic powder, thereby forming the first magnetic layer 54 on the lower side of the base member 101.

[0124] Next, the lower end portion of the first magnetic layer 54 is cut. For example, the lower end portion of the first magnetic layer 54 is cut so that the dimension from the upper surface of each external terminal to the lower surface of the first magnetic layer 54 becomes a desired value.

[0125] Next, if Fig.18 As shown, the terminal processing step is performed. Specifically, the first external terminal 81, the second external terminal 82, and the dummy portion 83 are formed on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring 71, 72 in the portion not covered by the insulating layer 90. These metal layers are formed by electroless plating of copper, nickel, and gold, respectively. In addition, there may be a catalyst layer such as palladium between copper and nickel. Thus, the first external terminal 81, the second external terminal 82, and the dummy portion 83 of the three-layer structure are formed. In addition, in Fig.18 In FIG. 8 , the first external terminal 81 is shown, and the second external terminal 82 and the dummy portion 83 are not shown.

[0126] Next, if Fig.19As shown in FIG. 1 , a singulation process is performed. Specifically, the singulation is performed by cutting along the break lines DL. Thus, the inductor component 10 can be obtained.

[0127] In the state before cutting, for example Fig. 20 As shown in FIG. 1 , a plurality of inductor components are arranged side by side in the long side direction Ld and the short side direction Wd, and the respective inductor components are connected through the base body BD, the first support wiring 41, and the second support wiring 42. Specifically, the first support wirings 41 are connected to each other through the first support wiring 41, and the second support wirings 42 are connected to each other through the second support wiring 42. By cutting the first support wiring 41 and the second support wiring 42 included in the break line DL in the thickness direction Td, the cross section of the first support wiring 41 is exposed as the exposed surface 41A on the first side surface 93. In addition, the cross section of the second support wiring 42 is exposed as the exposed surface 42A on the second side surface 94.

[0128] After the individualization process, each inductor component 10 is left in an oxygen-existing environment for a certain period of time, thereby causing a portion of the exposed surface 41A including the first support wiring 41 and a portion of the exposed surface 42A including the second support wiring 42 to oxidize and become Cu oxide.

[0129] Next, the operation of this embodiment will be described.

[0130] When current is supplied to any one of the external terminals 81 and 82 of the inductor component 10, the current flows from the external terminal 81 and 82 sequentially through the vertical wiring and the inductor wiring connected to the external terminal 81 and 82. At this time, the inductance value that can be obtained varies depending on the length of the inductor wiring path through which the current flows.

[0131] For example, it is assumed that the external terminal on the input side of the current is the first external terminal 81 connected to the first pad 22R of the first inductor wiring 20R, and the external terminal on the output side of the current is the second external terminal 82 connected to the second pad 23R of the first inductor wiring 20R, and the current is supplied. The state of supplying the current as described above is referred to as the first state. In the first state, the path length of the inductor wiring through which the current flows is equivalent to the wiring length of the first inductor wiring 20R. As described above, the inductance value of the first inductor wiring 20R can be approximately 2.5nH.

[0132] In addition, it is assumed that the external terminal on the input side of the current is the first external terminal 81 connected to the first pad 22L of the second inductor wiring 20L, and the external terminal on the output side of the current is the second external terminal 82 connected to the second pad 23R of the first inductor wiring 20R, so that the current is supplied. The state in which the current is supplied as described above is set as the second state. In the second state, the path length of the inductor wiring through which the current flows is equivalent to the wiring length of the second inductor wiring 20L. That is, compared with the first state, the wiring length through which the current flows is longer, so the inductance value that can be obtained in the second state is larger than the inductance value of the first state. Specifically, the inductance value of the second state is more than 1.1 times that of the first state, and can be approximately 3.1nH in this embodiment.

[0133] In addition, it is assumed that the external terminal on the input side of the current is the first external terminal 81 connected to the first pad 22R of the first inductor wiring 20R, and the external terminal on the output side of the current is the first external terminal 81 connected to the first pad 22L of the second inductor wiring 20L, and the current is supplied. The state in which the current is supplied as described above is set as the third state. In the third state, the path length of the inductor wiring through which the current flows is the length obtained by adding the wiring length of the first wiring body 21R, the wiring length of the second wiring body 21L, and the wiring length of the first pad 22L. That is, in the third state, the wiring length through which the current flows is longer than that in the first state and the second state. Therefore, the inductance value that can be obtained in the third state is larger than the inductance values ​​in the first state and the second state. The inductance value of the third state can be approximately 4.9nH in this embodiment.

[0134] Next, the effects of this embodiment will be described.

[0135] (1) In the above embodiment, the first inductor wiring 20R and the second inductor wiring 20L are arranged on the same plane in the base body BD. Therefore, compared with arranging the inductor wirings 20R and 20L at different positions in the thickness direction Td, it is possible to contribute to the thinning of the inductor component 10 in the thickness direction Td. In addition, the fewer the number of stacked first inductor wirings 20R and second inductor wirings 20L, the greater the influence of the positions of the first wiring main body 21R and the second wiring main body 21L and the first support wiring 41 and the second support wiring 42, so the configuration of the present application is more effective.

[0136] In the above embodiment, the inductance values ​​in the first state, the second state, and the third state can be obtained in one inductor component 10. Different inductance values ​​can be obtained depending on the use status of the inductor component 10.

[0137] In the above embodiment, the number of turns of the first wiring main body 21R of the first inductor wiring 20R is 0, and the number of turns of the second wiring main body 21L of the second inductor wiring 20L is 0.25. Since the number of turns of the inductor wiring is small and the wiring is less wound, the DC resistance in each wiring is small, and it is easy to ensure the inductance acquisition efficiency.

[0138] (2) The inductance value of the first inductor wiring 20R is approximately 2.5 nH, and the inductance value of the second inductor wiring 20L is approximately 3.1 nH. In a converter that performs high-frequency switching, in order to suppress ripple current, the inductance value of the inductor wiring is preferably 1 nH or more. In addition, if the inductance value of each inductor wiring is 10 nH or more, the tracking performance of the voltage change obtained in the high-frequency switching operation deteriorates. Therefore, it is preferred that the inductance value of each inductor wiring is 1 nH or more and 10 nH or less, and the inductance value of the inductor wiring in this embodiment is within the above range.

[0139] (3) In the above embodiment, the second pad 23R in the first inductor wiring 20R and the second pad 23R in the second inductor wiring 20L are the same pad. In the inductor component 10 of the above embodiment, the volume of the magnetic layer 50 is increased by one pad and one vertical wiring, compared with the inductor component in which each inductor wiring has two different pads. Since the volume of the magnetic layer 50 is large, the efficiency of obtaining the inductance is easily increased. In addition, by connecting the second inductor wiring 20L to the second pad 23R of the first inductor wiring 20R, as described above, it is also possible to function as an inductor in which the first wiring body 21R and the second wiring body 21L are the entire wiring length.

[0140] (4) In the above embodiment, the first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at symmetrical positions with respect to the geometric center G of the base body BD. Therefore, it is easy to design the distance from the first pad 22L to the second pad 23R in the base body BD to be long. In other words, it is easy to design the wiring length of the second wiring body 21L to be long. By making the wiring length of the second wiring body 21L longer, it is easy to make a difference between the wiring length of the first wiring body 21R, and thus it is easy to increase the difference in inductance value between the first state and the second state.

[0141] (5) In the above embodiment, the average value of the pitch X1, the first distance Y1, and the second distance Y2 is "200 micrometers". The ratio of the pitch X1 to the above average value is "125%". In addition, the ratio of the first distance Y1 and the second distance Y2 to the above average value is "87.5%".

[0142] If the above ratios are deviated, the arrangement of the inductor wiring in the blank BD will be deviated. If the arrangement of the inductor wiring in the blank BD is deviated, the weight balance of the blank BD will also be deviated, and there is a concern that the inductor component may be mounted on the substrate at an angle. Therefore, it is preferable to arrange the inductor wiring in the blank BD without a large deviation. Specifically, it is preferable that the above ratios are greater than 50% and less than 150%. In the present embodiment, the values ​​of the ratios are limited to the above ranges, which is a preferable state.

[0143] (6) In the above embodiment, the pitch X1 is longer than the first distance Y1 and the second distance Y2. When the pitch X1 is longer than the first distance Y1 and the second distance Y2, it is easier to lengthen the short straight portion 32 of the second wiring body 21L, and it is easier to design the wiring length of the second inductor wiring 20L to be longer.

[0144] (7) In the above embodiment, the wiring widths of the first wiring main body 21R and the second wiring main body 21L are equal. In addition, the dimensions of the first wiring main body 21R and the second wiring main body 21L in the thickness direction Td are also equal, so the cross-sectional areas of the first wiring main body 21R and the second wiring main body 21L are equal. Since the two inductor wirings have the same cross-sectional area, it is easy to form the inductor wirings in the same process. That is, when manufacturing the inductor component 10, it is possible to suppress an increase in the number of processes and complication.

[0145] (8) In the above embodiment, the interval between adjacent parallel wiring bodies is 200 micrometers. From the viewpoint of suppressing the interference of magnetic flux between inductor wirings, the minimum interval is preferably 50 micrometers or more, and more preferably about 100 micrometers or more.

[0146] (9) In the above embodiment, the dimension Td of the green body BD in the thickness direction is about 0.2 mm. The smaller the dimension Td of the green body BD in the thickness direction is, the smaller the dimension of the inductor component 10 protruding from the substrate when the inductor component 10 is mounted on the substrate. Therefore, the inductor component 10 of the above embodiment can be mounted in a position that cannot be mounted when the dimension Td in the thickness direction is large.

[0147] (10) In the above embodiment, the area of ​​the first pads 22R and 22L is larger than the area of ​​the first vertical wiring 71 at the connection position with the first pads 22R and 22L. Therefore, even if the position of the first vertical wiring 71 is shifted due to manufacturing errors, the entire contact surface of the first vertical wiring 71 with the first pads 22R and 22L is easy to contact with the first pads 22R and 22L. This is also the same for the second vertical wiring 72.

[0148] (11) In the above embodiment, the first magnetic layer 54 and the second magnetic layer 55 are organic resins containing metal magnetic powder. The average particle size of the metal magnetic powder is about 5 microns. By using magnetic powder with a particle size of 10 microns or less, the iron loss can be reduced while ensuring the specific permeability of the first magnetic layer 54 and the second magnetic layer 55.

[0149] (12) In the above embodiment, the first inductor wiring 20R, the second inductor wiring 20L, the first support wiring 41, and the second support wiring 42 are present in the first layer L1. In a state where a plurality of inductor components 10 are arranged side by side, in other words, in a state before cutting, a configuration can be adopted in which the plurality of inductor wirings are connected by the first support wiring 41 and the second support wiring 42. If the plurality of first inductor wirings 20R and the plurality of second inductor wirings 20L are connected by the first support wiring 41 and the second support wiring 42, the inductor wirings can be supported and positioned even without requiring an insulating substrate or the like for supporting the inductor wirings. Therefore, since an insulating substrate or the like for supporting the inductor wirings is not required, it can contribute to a reduction in the thickness of the inductor component 10.

[0150] (13) In the above embodiment, the pitch P1 is approximately twice the length of the distance Q1 and the distance Q2. Fig. 20 As shown in FIG. 1 , before forming the inductor component 10, a plurality of inductor components are arranged side by side in the long side direction Ld and the short side direction Wd, and the inductor components are connected by the blank BD and the support wirings 41 and 42. Here, in the state where the inductor components are connected, the intervals in the short side direction Wd between the adjacent first support wirings 41 are all the intervals P1. According to the relationship between the distances Q1 and Q2 and the interval P1 as described above, the first support wirings 41 are arranged at equal intervals with respect to the entire length of the mother substrate along the short side direction Wd of each inductor component. If the mother substrate is cut along the break line DL, since the first support wirings 41 are arranged at equal intervals, the load during cutting is easily evenly distributed. Since the load is evenly distributed, the deformation of the inductor component 10 generated during cutting can be suppressed.

[0151] (14) In the above embodiment, the exposed surface 41A of the first support wiring 41 is Cu oxide in this embodiment. Since the exposed surface 41A is Cu oxide, the conductivity of the exposed surface 41A is low. Therefore, even if other electrical components are in contact with the exposed surface 41A, it is possible to suppress the flow of current through the exposed surface 41A. This is also the same for the second support wiring 42.

[0152] (15) In the above embodiment, the first support wiring 41 and the second support wiring 42 are in close contact with the magnetic layer 50. Since the magnetic layer 50 is in close contact with the first support wiring 41 and the second support wiring 42, the volume of the magnetic layer 50 can be ensured, and the efficiency of obtaining the inductance of the inductor component 10 can be easily ensured.

[0153] (16) In the above embodiment, the dummy portion 83 is provided in the fifth layer L5. When the inductor component 10 is mounted on a substrate or the like, the terminal portion 80 and the substrate are sometimes mounted by soldering. Therefore, by providing the dummy portion 83, the inductor component 10 and the substrate can be fixed at four locations, and the inductor component 10 is not easily separated from the substrate.

[0154] (17) In the above embodiment, when viewed from the thickness direction Td, the area of ​​the dummy portion 83 is equal to that of the first external terminal 81 and the second external terminal 82. Therefore, when the dummy portion 83 is soldered to a substrate or the like in the same manner as the first external terminal 81 and the second external terminal 82, the amount of solder applied to the four terminal portions 80 can be made uniform. Therefore, it is possible to prevent the inductor component 10 from being mounted on a substrate or the like at an angle.

[0155] (18) In the above embodiment, when viewed from the thickness direction Td, the shape of the dummy portion 83 is different from that of the first external terminal 81 and the second external terminal 82. In addition, in the present embodiment, since there is only one dummy portion 83 provided in the inductor component 10, the dummy portion 83 is provided asymmetrically on the main surface MF of the inductor component 10. Therefore, the direction of the inductor component 10 can be easily determined based on the dummy portion 83. If the direction of the inductor component 10 can be identified, it is easy to correctly set the inductor component 10 when mounting it on a substrate, for example.

[0156] The above-mentioned embodiment can be implemented by being modified as follows. The above-mentioned embodiment and the following modified examples can be implemented in combination with each other within the range that there is no technical contradiction.

[0157] Three or more inductor wirings may be provided inside the body BD.

[0158] exist Fig.21In the example shown, in addition to the first inductor wiring 20R and the second inductor wiring 20L, a third inductor wiring 20X and a fourth inductor wiring 20Y are provided. The third wiring body 21X of the third inductor wiring 20X extends in parallel with the first wiring body 21R of the first inductor wiring 20R. The third wiring body 21X is arranged between the long straight line portion 31 of the first wiring body 21R and the second wiring body 21L. The first end of the third wiring body 21X is connected to the short straight line portion 32 of the second wiring body 21L. That is, the third inductor wiring 20X and the second inductor wiring 20L share a part of the wiring. The first pad 22X is connected to the second end of the third wiring body 21X.

[0159] The fourth wiring body 21Y of the fourth inductor wiring 20Y extends in parallel with the first wiring body 21R of the first inductor wiring 20R. The fourth wiring body 21Y is arranged between the first wiring body 21R and the third wiring body 21X. The first end of the fourth wiring body 21Y is connected to the short straight line portion 32 of the second wiring body 21L. That is, the fourth inductor wiring 20Y and the second inductor wiring 20L share a portion of the wiring. The first pad 22Y is connected to the second end of the fourth wiring body 21Y.

[0160] In addition, the first wiring body 21R of the first inductor wiring 20R extends parallel to one side of the outer edge of the blank BD. The second pad 23R of the first inductor wiring 20R and the second pad 23R of the second inductor wiring 20L are the same pad. The first pad 22L and the second pad 23R of the second inductor wiring 20L are arranged at symmetrical positions sandwiching the geometric center G. That is, the first inductor wiring 20R and the second inductor wiring 20L are arranged along three sides of the quadrilateral shape of the blank BD and extend over a wide range of the blank BD. Therefore, it is easy to ensure a large acquisition range of the inductance of the inductor component.

[0161] exist Fig.21In the example shown, the third wiring body 21X of the third inductor wiring 20X and the fourth wiring body 21Y of the fourth inductor wiring 20Y are parallel parts extending in parallel with the first wiring body 21R. The distance from the center axis C1 of the first wiring body 21R of the parallel part to the center axis C4 of the fourth wiring body 21Y in the direction perpendicular to the extending direction of the parallel part is set as pitch X1. The distance from the center axis C2 of the second wiring body 21L of the parallel part to the center axis C3 of the third wiring body 21X in the direction perpendicular to the extending direction of the parallel part is set as pitch X2. In addition, the distance from the center axis C3 of the third wiring body 21X to the center axis C4 of the fourth wiring body 21Y in the direction perpendicular to the extending direction of the parallel part is set as pitch X3. In this case, the pitch X1 is equal to the pitch X2, and the pitch X3 is larger than the pitches X1 and X2.

[0162] As in this modification, adjacent parallel portions may be arranged at different intervals. That is, each wiring main body may be arranged at unequal intervals. When the intervals between wiring main bodies of the inductor wiring are different, it is easy to set the size of the inductance value that can be obtained from each inductor wiring, and it is easy to design so that the inductance value suitable for the use conditions of the inductor component 10 can be obtained.

[0163] When there are three or more inductor wirings and these inductor wirings have parallel portions extending parallel to each other, if there is a large difference in the pitches, the inductor wirings are unevenly arranged in the body. As a result, the arrangement of the external terminals is biased and the weight balance of the inductor component is biased. Therefore, it is preferred that the ratio of the pitches in the short-side direction Wd of the adjacent parallel portions to the average value of the pitches is 85% or more and 115% or less.

[0164] In addition, Fig.21 In the example shown, the pitch X1 can be set to "250 microns", the pitch X2 can be set to "250 microns", and the pitch X3 can be set to "310 microns". Therefore, the average value of the above pitches is approximately "270 microns". Moreover, the ratio of each pitch to the average value of the pitch is approximately "93%" for the pitch X1, approximately "93%" for the pitch X2, and approximately "115%" for the pitch X3. Therefore, in Fig.21 In the example shown, for all the pitches, the ratio of each pitch to the average value of the pitches is 85% or more and 115% or less.

[0165] ·exist Fig.21 In the example shown, the ratio of each pitch to the average value of the pitch may be less than 85% or greater than 115%.

[0166] ·exist Fig. 22 In the example shown, the second wiring body 21L of the second inductor wiring 20L extends linearly. The first end of the second wiring body 21L of the second inductor wiring 20L is connected to the second pad 23R of the first inductor wiring 20R, and the second end is connected to the first pad 22L. The first pad 22R, the second pad 23R, and the first pad 22L are arranged in the extending direction of the first wiring body 21R and the second wiring body 21L. That is, the second wiring body 21L extends in the same direction as the first wiring body 21R on the opposite side to the first wiring body 21R with the second pad 23R sandwiched therebetween. In addition, the wiring length of the second wiring body 21L is 1.2 times the wiring length of the first wiring body 21R.

[0167] In addition, if Fig. 22 As in the example shown in FIG. 1 , the two pads of the second inductor wiring 20L may not be arranged at positions symmetrical with respect to the geometric center G of the body BD. Fig. 22 When the first inductor wiring 20R and the second inductor wiring 20L are arranged in a row and the pads are also arranged in a row, the inductor component is long in one direction. The positions of the pads in the above-mentioned embodiment may be changed to obtain a shape of the inductor component suitable for mounting.

[0168] In the above embodiment, the shape of the blank BD when viewed from the thickness direction Td is not limited to the example in the above embodiment. For example, it may be a square or a circle.

[0169] In the above embodiment, the central axis A1 of the first support wiring 41 and the central axis A2 of the second support wiring 42 may not be located on the same straight line. The arrangement of the support wirings 41 and 42 may be appropriately changed according to the shapes of the first pads 22R, 22L and the second pad 23R.

[0170] The shape of the wiring main body 21R, 21L in the first inductor wiring 20R and the second inductor wiring 20L is not limited to a shape extending in a straight line as long as the number of turns is 0.5 turns or less. For example, the wiring main body 21R, 21L may be wavy or curved. In addition, when the wiring main body 21R, 21L is curved, the distance between the portions extending in a straight line from the first pad 22R, 22L in two different wiring main bodies 21R, 21L is the distance between the first inductor wiring 20R and the second inductor wiring 20L.

[0171] In the above embodiment, the connection portion 33 of the second inductor wiring 20L may not be bent in an arc shape. For example, the long straight portion 31 and the short straight portion 32 may be directly connected, and the second wiring body 21L may be connected in a shape bent at a right angle.

[0172] Depending on the cutting method and the post-cutting treatment, the area of ​​the exposed surface 41A of the first support wiring 41 can also be equal to the cross-sectional area of ​​the first support wiring 41 inside the blank BD. For example, if the first side surface 91 including the exposed surface 41A is polished after cutting, the shape of the exposed surface 41A becomes the same as the cross-sectional shape of the first support wiring 41 inside the blank BD, so the cross-sectional areas of the two are also the same. This is also the same for the second support wiring 42.

[0173] In the above embodiment, the cross-sectional area may be different between the first wiring main body 21R and the second wiring main body 21L, and the wiring width and the dimension in the thickness direction Td may be different between the first wiring main body 21R and the second wiring main body 21L. If the cross-sectional area is different between the first wiring main body 21R and the second wiring main body 21L, the inductance value can be different even if the wiring lengths of both are the same.

[0174] In the above embodiment, the inductance values ​​of the first wiring body 21R and the second wiring body 21L are not limited to the examples in the above embodiment. For example, the wiring lengths of the first wiring body 21R and the second wiring body 21L may be further increased to make the inductance values ​​greater than 10 nH. In addition, the inductance values ​​of the inductor wirings 20R and 20L may be smaller than 1 nH.

[0175] In the above embodiment, the position of the first support wiring 41 is not limited to the example of the above embodiment. For example, the position of the central axis A1 of the first support wiring 41 in the short-side direction Wd may be the same as the position of the central axis of the connected wiring body in the short-side direction Wd. In addition, in the case of a portion connected to the wiring body, if the end of the wiring body on the pad side is linear, the central axis A1 of the first support wiring 41 may be offset relative to the central axis of the linear portion.

[0176] In the above embodiment, the number of supporting wirings exposed on the first side surface 91 and the second side surface 92 may be three or more depending on the number of inductor wirings, or may be omitted altogether.

[0177] In the above embodiment, the average particle size of the metal magnetic powder contained in the magnetic layer 50 is not limited to the example in the above embodiment. However, in order to ensure the specific magnetic permeability, the average particle size of the metal magnetic powder is preferably 1 micrometer or more and 10 micrometers or less.

[0178] In the above embodiment, the metal magnetic powder contained in the first magnetic layer 54 and the second magnetic layer 55 may not be the metal magnetic powder containing Fe, but may be, for example, the metal magnetic powder containing FeNi or the metal magnetic powder containing FeSiCr.

[0179] In the above embodiment, from the viewpoint of suppressing the interference of magnetic flux generated between wirings, the interval between parallel parts is preferably 50 microns or more. If it is less than 50 microns, from the above viewpoint, it is preferable to place insulating resin or insulating inorganic material between inductor wirings.

[0180] In the above embodiment, the pitch X1, the first distance Y1, and the second distance Y2 may be equal, or the first distance Y1 and the second distance Y2 may be greater than the pitch X1. In addition, the first distance Y1 and the second distance Y2 may be different.

[0181] In the above embodiment, the ratio of each pitch, the first distance Y1 and the second distance to the average value of each pitch, the first distance Y1 and the second distance Y2 may be smaller than 50% or larger than 150%.

[0182] In the above embodiment, the material of a portion of the first support wiring 41 including the exposed surface 41A and a portion of the second support wiring 42 including the exposed surface 42A may not be Cu oxide. When a Cu alloy is used as the first support wiring 41 and the second support wiring 42, it is preferable to use a Cu alloy oxide as the material of a portion including each exposed surface. In addition, an insulating layer made of resin may be laminated on the exposed surface 41A of the first support wiring 41 and the exposed surface 42A of the second support wiring 42.

[0183] In the above-described embodiment, the material constituting the first support wiring 41 and the second support wiring 42 may be directly exposed on each exposed surface 41A.

[0184] In the above embodiment, the dimension Td of the green body BD in the thickness direction is not limited to the example of the above embodiment. However, as described above, the smaller the dimension Td of the green body BD in the thickness direction is, the smaller the dimension protruding from the substrate is when the inductor component 10 is mounted on the substrate, which is preferable. Specifically, it can be 0.25 mm or less.

[0185] In the above embodiment, the dimension of the first layer L1, that is, the first inductor wiring 20R and the second inductor wiring 20L in the thickness direction Td is not limited to the above embodiment, but is preferably one tenth or more and one third or less of the dimension of the thickness direction Td of the base body BD as described above.

[0186] In the above embodiment, the pitch P1 from the central axis A1 of the first support wiring 41 extending from the first inductor wiring 20R to the central axis A1 of the first support wiring 41 extending from the second inductor wiring 20L is not limited to the above embodiment. For example, the pitch P1, the distance Q1, and the distance Q2 may be arranged to be equal.

[0187] In the above embodiment, the composition of the first inductor wiring 20R and the second inductor wiring 20L is not limited to the example of the above embodiment. For example, they may be made of silver or gold.

[0188] In the above embodiment, the composition of the magnetic layer 50 is not limited to the example of the above embodiment. For example, the material of the magnetic layer 50 may be ferrite powder or a mixture of ferrite powder and metal magnetic powder.

[0189] In the above-described embodiment, another layer may be interposed between each of the support wirings 41 and 42 and the magnetic layer 50 . For example, an insulating layer may be interposed between each of the support wirings 41 and 42 and the magnetic layer 50 .

[0190] In the above embodiment, the first inductor wiring 20R may not be linear. In order to obtain an appropriate inductance value when used, a connection portion may be provided. In addition, a plurality of connection portions may be provided in the first inductor wiring 20R and the second inductor wiring 20L.

[0191] In the above embodiment, the inductor wiring may be any wiring that can generate magnetic flux in the magnetic layer when current flows, thereby providing inductance to the inductor component 10. In the above embodiment, each inductor wiring may not necessarily have a lower DC resistance than a spiral inductor wiring of the same wiring length.

[0192] In the above embodiment, the first vertical wiring 71 and the second vertical wiring 72 do not have to extend only in the direction perpendicular to the main surface MF. For example, the first vertical wiring 71 and the second vertical wiring 72 may be inclined with respect to the thickness direction Td as long as they penetrate the second magnetic layer 55 .

[0193] In the above embodiment, when viewed from the thickness direction Td, the areas of the first pads 22R, 22L and the second pads 23R may be equal to the areas of the first vertical wiring 71 and the second vertical wiring 72. In addition, the length dimensions of the first pads 22R, 22L and the second pads 23R in the direction orthogonal to the extending direction of the wiring bodies 21R, 21L may be the same as those of the wiring bodies 21R, 21L.

[0194] In the above embodiment, the first external terminal 81 and the second external terminal 82 may be omitted. If the first vertical wiring 71 and the second vertical wiring 72 are exposed on the main surface MF, current can flow directly from the first vertical wiring 71 and the second vertical wiring 72 to the first inductor wiring 20R and the second inductor wiring 20L. In this case, the portion of the first vertical wiring 71 exposed on the main surface MF and the portion of the second vertical wiring 72 exposed on the main surface MF function as external terminals.

[0195] In the above embodiment, the metal layer of the terminal portion 80 is not limited to the material of the above embodiment. In addition, a catalyst layer may be provided as required. For example, the metal layer of the external terminals 81 and 82 may be appropriately set according to each function, such as gold and tin to ensure the wettability of the solder and nickel to suppress electromigration.

[0196] In the above embodiment, the outer surfaces of the first external terminal 81 and the second external terminal 82 may be covered with an insulating layer. In this case, when the inductor component 10 is stored before being mounted on a substrate or the like, it is possible to suppress the current from unintentionally flowing into the inside of the inductor component 10 via each external terminal. In addition, in the case of this modification, before the inductor component 10 is mounted on a substrate or the like, the insulating layer covering the first external terminal 81 and the second external terminal 82 may be removed by cleaning or the like.

[0197] In the above embodiment, the dummy portion 83 may not have the same laminated structure as the first external terminal 81 and the second external terminal 82. For example, the dummy portion 83 may not be a conductive material. In addition, for example, the dummy portion 83 may be a portion of the second magnetic layer 55 exposed in the insulating layer 90.

[0198] In the above-described embodiment, the area of ​​the dummy portion 83 when viewed in the thickness direction Td may be different from the areas of the first external terminal 81 and the second external terminal 82 .

[0199] In the above-described embodiment, the dummy portion 83 may have the same shape as that of the external terminals 81 and 82 , or the dummy portion 83 may not be provided.

[0200] In the above embodiment, the manufacturing method of the inductor component 10 is not limited to the example of the above embodiment. For example, in the embodiment, the process of forming the first inductor wiring 20R and the second inductor wiring 20L and the process of forming the first support wiring 41 and the second support wiring may be different processes. For example, after forming the first inductor wiring 20R and the second inductor wiring 20L, each support wiring 41, 42 may be formed using a material different from that of the first inductor wiring 20R.

Claims

1. An inductor component, wherein: have: A body having a main surface; A plurality of inductor wirings are arranged on the same plane in the body and extend parallel to the main surface; as well as A first vertical wiring and a second vertical wiring extend from the inductor wiring in a thickness direction toward the main surface and are exposed on the main surface. The inductor wiring includes: a wiring main body, the number of turns of the wiring main body is 0.5 turns or less, and the wiring main body extends linearly; a first pad provided at a first end of the wiring main body and connected to the first vertical wiring; and a second pad provided at a second end of the wiring main body and connected to the second vertical wiring. When one of the plurality of inductor wirings is a first inductor wiring and another of the inductor wirings is a second inductor wiring, a wiring length of the wiring main body in the second inductor wiring is 1.2 times or more of a wiring length of the wiring main body in the first inductor wiring, One of the first pad and the second pad in the first inductor wiring and one of the first pad and the second pad in the second inductor wiring are the same pad.

2. The inductor component according to claim 1, wherein The inductance value of the second inductor wiring is 1.1 times or more the inductance value of the first inductor wiring.

3. The inductor component according to claim 1, wherein A cross-sectional area of ​​the wiring main body in a cross section perpendicular to a central axis of the wiring main body is equal in the plurality of inductor wirings.

4. The inductor component according to claim 1, wherein When viewed from the thickness direction, The main surface of the blank is a quadrilateral. The wiring main body of the first inductor wiring extends along one side of the outer edge of the quadrilateral in the base body. The first pad and the second pad of the second inductor wiring are arranged at positions symmetrical with respect to a geometric center of the quadrilateral.

5. The inductor component according to claim 1, wherein The wiring main body of the first inductor wiring extends linearly. The wiring body of the other inductor wirings except the first inductor wiring among the plurality of inductor wirings includes two straight line portions extending in different directions from each other and a connection portion connecting the straight line portions.

6. The inductor component according to claim 1, wherein The wiring bodies of the plurality of inductor wirings have parallel portions extending parallel to the wiring bodies of adjacent inductor wirings. A direction perpendicular to the direction in which the parallel portions extend and in which the parallel portions are arranged side by side is defined as a first direction, A distance from the central axis of the parallel portion located on the first end side in the first direction to the end of the blank in the first direction closest to the parallel portion located on the first end side in the first direction is set as a first distance, When the distance from the central axis of the parallel portion located on the second end side of the first direction to the end of the blank in the first direction closest to the parallel portion located on the second end side of the first direction is set as the second distance, In the first direction, the size of the interval between the parallel parts is different from the size of the first distance and the size of the second distance.

7. The inductor component according to claim 1, wherein Three or more of the above-mentioned inductor wirings are provided, The wiring main bodies of the plurality of inductor wirings have parallel portions extending parallel to the wiring main bodies of adjacent inductor wirings.

8. The inductor component according to claim 7, wherein: The intervals between adjacent parallel portions are different.

9. The inductor component according to claim 1, wherein: Three or more of the above-mentioned inductor wirings are provided, The wiring bodies of the plurality of inductor wirings have parallel portions extending parallel to the wiring bodies of adjacent inductor wirings. When a direction perpendicular to the direction in which the parallel portions extend and in which the parallel portions are arranged side by side is defined as a first direction, A ratio of each pitch between adjacent parallel portions in the first direction to an average value of the pitches is greater than or equal to 85% and less than or equal to 115%.

10. The inductor component according to claim 1, wherein The wiring bodies of the plurality of inductor wirings have parallel portions extending parallel to the wiring bodies of adjacent inductor wirings. A direction perpendicular to the direction in which the parallel portions extend and in which the parallel portions are arranged side by side is defined as a first direction, A distance from the central axis of the parallel portion located on the first end side in the first direction to the end of the blank in the first direction closest to the parallel portion located on the first end side in the first direction is set as a first distance, When the distance from the central axis of the parallel portion located on the second end side of the first direction to the end of the blank in the first direction closest to the parallel portion located on the second end side of the first direction is set as the second distance, The ratio of each spacing in the first direction of the adjacent parallel parts to the average of the spacing, the first distance and the second distance, the ratio of the first distance to the average value, and the ratio of the second distance to the average value are all greater than 50% and less than 150%.

11. The inductor component according to claim 1, wherein The plurality of wiring bodies have parallel portions extending parallel to each other. The minimum interval between adjacent wiring bodies in the parallel portion is 50 micrometers or more.

12. The inductor component according to claim 1, wherein The inductance value of the first inductor wiring is greater than or equal to 1 nH and less than or equal to 10 nH.

13. The inductor component according to claim 1, wherein The dimension of the above-mentioned blank in the above-mentioned thickness direction is less than 0.25 mm.

14. The inductor component according to claim 1, wherein When viewed from the thickness direction, The areas of the first pad and the second pad are larger than the areas of the first vertical wiring and the second vertical wiring at the connection positions with the first pad and the second pad.

15. The inductor component according to claim 1, wherein The above-mentioned green body has a magnetic layer, The magnetic layer is an organic resin containing metal magnetic powder. The metal magnetic powder is Fe-based metal powder, and the average particle size of the metal magnetic powder is not less than 1 micrometer and not more than 10 micrometers.

16. The inductor component according to claim 1, wherein The green body has a side surface perpendicular to the main surface. The inductor component includes a supporting wiring connected to the inductor wiring and having an end portion exposed at the side surface.

17. The inductor component according to claim 16, wherein: An area of ​​an exposed surface of the support wiring exposed at the side surface is larger than a cross-sectional area of ​​the support wiring located in the body in a cross section perpendicular to a central axis of the support wiring.

18. The inductor component according to claim 16, wherein: The above-mentioned green body has a magnetic layer, The supporting wiring is in direct contact with the magnetic layer.

19. The inductor component according to claim 16, wherein: A portion of the supporting wiring is Cu oxide or Cu alloy oxide, and the portion includes an exposed surface exposed at the side surface.

20. The inductor component according to any one of claims 1 to 19, wherein: The inductor component includes a plurality of terminal portions exposed on the main surface. A part of the terminal portion is an external terminal electrically connected to the inductor wiring. The terminal portions other than the external terminal are dummy portions that are not electrically connected to the inductor wiring.

21. The inductor component according to claim 20, wherein The shape of the dummy portion is different from the shape of the external terminal.

22. The inductor component according to claim 20, wherein When viewed from a direction perpendicular to the main surface, The area of ​​the dummy portion is the same as the area of ​​the external terminal.

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