A chip heat sink with high efficiency heat dissipation performance

Abstract

The present invention discloses a chip heat sink with high-efficiency heat dissipation performance, comprising: a device body, a fluid groove and a fluid inlet are provided on the device body, a fluid outlet is provided in the fluid groove, the fluid groove is connected to a fluid outflow channel, and the fluid outflow channel is connected to the upper heat dissipation layer of the chip embedded concave surface. A flow velocity baffle and an injection micro-channel are provided on the chip embedded concave surface, and the injection micro-channel is connected to the fluid inflow layer of the lower layer of the chip embedded concave surface. The chip is embedded in the chip embedded concave surface. The fluid groove is a rectangular groove, the chip embedded concave surface is square, the fluid outlet and the fluid inlet are both cylindrical, and the injection micro-channel is cylindrical. The corrosion-resistant metal material used in the device body is copper Cu, silver Ag or gold Au. The chip heat sink with high-efficiency heat dissipation performance provided by the present invention is cooled by liquid, has high heat dissipation efficiency, large heat transfer coefficient, good working stability, and a wide range of applications.

Description

Technical Field

[0001] The invention belongs to the field of power chip radiators, and in particular relates to a chip radiator with high-efficiency heat dissipation performance. Background Art

[0002] With the development of microelectronics technology, the integration of chips is getting higher and higher. The development trend of high power, miniaturization and high density packaging has led to an increase in the heat flux density of electronic devices. The effect of temperature on the operating life of the chip is roughly estimated as follows: within the normal operating temperature range of the chip, the operating life of the chip is halved for every 10°C increase in chip temperature (Arrhenius equation). Therefore, the heat dissipation of the chip is particularly important.

[0003] The main methods of heat dissipation or cooling include air cooling, liquid cooling, heat pipe heat transfer, etc. The traditional thermal cooling mode contains a large amount of intermediate materials such as solder, epoxy ceramic, copper-molybdenum heat conductor, cold plate metal and coolant film between the chip and the heat sink. Each material exhibits a series of thermal resistances, increasing the overall heat rise from the coolant to the device structure. This results in a small heat transfer coefficient of the heat sink and low heat dissipation efficiency. Summary of the invention

[0004] The present invention aims to provide a chip heat sink with high-efficiency heat dissipation performance to solve the technical problems of low heat transfer coefficient and low heat dissipation efficiency of existing heat sinks.

[0005] In order to solve the above technical problems, the specific technical solutions of the present invention are as follows:

[0006] A chip heat sink with high-efficiency heat dissipation performance comprises a device body, on which a fluid groove, a chip embedding concave surface, a fluid outflow channel and a fluid inlet are arranged;

[0007] The chip embedding concave surface comprises an upper chip heat dissipation layer and a lower fluid inflow layer;

[0008] A fluid outlet is provided in the fluid groove, the fluid groove is connected to a fluid outflow channel, and the fluid outflow channel is connected to the upper chip heat dissipation layer of the chip embedding concave surface;

[0009] A flow velocity baffle and a jet micro-channel are provided on the upper chip heat dissipation layer of the chip embedding concave surface, and the jet micro-channel is connected to the fluid inflow layer of the lower layer of the chip embedding concave surface;

[0010] The lower fluid inflow layer of the chip embedded in the concave surface is connected with the fluid inlet.

[0011] Furthermore, the chip heat dissipation layer is a concave structure.

[0012] Furthermore, the chip heat dissipation layer has two fluid outflow channels on the left and right sides respectively, and the fluid flows into the fluid grooves on the left and right sides through the channels.

[0013] Furthermore, the chip is embedded in the chip embedding concave layer.

[0014] Furthermore, the material used for the device body is a corrosion-resistant metal material.

[0015] Furthermore, the fluid groove is a rectangular groove, the chip embedding concave surface is a square, the fluid outlet and the fluid inlet are both cylindrical, and the injection microchannel is cylindrical.

[0016] Furthermore, the corrosion-resistant metal material is copper Cu, silver Ag or gold Au.

[0017] The chip heat sink with high-efficiency heat dissipation performance of the present invention has the following advantages:

[0018] 1. The chip heat sink with high-efficiency heat dissipation performance described in the present invention reduces the operating junction temperature of the power chip.

[0019] In traditional chip heat sinks, there are a lot of intermediate materials between the chip and the heat sink, such as solder, epoxy ceramic, copper-molybdenum heat conductor, cold plate metal and coolant film. Each material exhibits a series of thermal resistances, resulting in a low heat transfer coefficient of the heat sink. Figure 4 and Figure 5 As shown in the comparison, the chip heat sink with efficient heat dissipation performance described in the present invention embeds the chip in the heat dissipation body, reduces a large amount of thermal resistance between the chip and the heat sink, effectively improves the heat transfer coefficient, and efficiently reduces the working junction temperature of the power chip.

[0020] 2. The chip heat sink with high heat dissipation performance described in the present invention makes the temperature distribution of the power chip more uniform. Figure 1 and Figure 2 As shown, the chip heat sink with high-efficiency heat dissipation performance described in the present invention is designed with an array distribution of spray microchannels for the parts of the chip with larger heat dissipation power, thereby increasing the heat dissipation coefficient of the main heating area, reducing the temperature difference between other areas of the power chip and the highest temperature point, and making the overall temperature more uniform.

[0021] 3. The chip heat sink with high heat dissipation performance described in the present invention has low stress and good stability during operation. Figure 1 and Figure 6 As shown, the chip heat sink with high-efficiency heat dissipation performance described in the present invention adopts a metal material with good corrosion resistance and rigidity. During operation, the thermal stress and pressure are both within the normal range and are not prone to deformation and damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a structural schematic diagram of a chip heat sink with high heat dissipation performance of the present invention;

[0023] Figure 2 A top view of a chip heat sink with high heat dissipation performance according to the present invention;

[0024] Figure 3 It is a front view of a chip heat sink with high heat dissipation performance of the present invention;

[0025] Figure 4 A chip temperature distribution diagram of a conventional chip heat sink of the present invention;

[0026] Figure 5 A chip temperature distribution diagram of a chip heat sink with high heat dissipation performance according to the present invention;

[0027] Figure 6 This is a thermal stress distribution diagram of a chip heat sink with high heat dissipation performance according to the present invention.

[0028] Explanation of the markings in the figure: 100, chip heat sink; 1, device body; 2, chip embedded concave surface; 3, flow rate baffle; 4, fluid outflow channel; 5, fluid groove; 6, fluid outlet; 7, fluid inlet. DETAILED DESCRIPTION

[0029] In order to better understand the purpose, structure and function of the present invention, a chip heat sink with high-efficiency heat dissipation performance of the present invention is further described in detail below in conjunction with the accompanying drawings.

[0030] The present invention is a chip heat sink 100 with high-efficiency heat dissipation performance, comprising a device body 1. The device body (1) is provided with a fluid groove (5), a chip embedding concave surface (2), a fluid outflow channel (4) and a fluid inlet (7).

[0031] The chip embedding concave surface 2 comprises an upper chip heat dissipation layer and a lower fluid inflow layer.

[0032] The fluid groove 5 is provided with a fluid outlet 6 , and the fluid groove 5 is connected to the fluid outflow channel 4 , and the fluid outflow channel 4 is connected to the heat dissipation layer on the chip embedding concave surface 2 .

[0033] The fluid outlet 6 is a cylinder with a radius of 1 mm.

[0034] The chip embedding concave surface 2 is provided with four flow velocity baffles 3 and a row of injection micro-channels 8, the injection micro-channels 8 connect the upper chip heat dissipation layer of the chip embedding concave surface 2 and the lower fluid inflow layer of the chip embedding concave surface 2, and the channel shape is a cylinder with a radius of 0.15mm. The lower fluid inflow layer of the chip embedding concave surface 2 is connected to the fluid inlet 7, and the fluid inlet 7 is a cylinder with a radius of 1.5mm.

[0035] The material used for the device body 1 is copper Cu, and the fluid used is water H 2 O. The device body 1 is connected with an external water tank to form a water circulation passage.

[0036] The fluid flows into the lower fluid inflow layer of the chip embedded concave surface 2 through the fluid inlet 7 at a certain speed, and is sprayed into the upper chip heat dissipation layer of the chip embedded concave surface 2 through the injection channel, acts on the epoxy ceramic heat dissipation plate at the bottom of the chip, and is dispersed and drained through the fluid outflow channel 4 through the flow velocity baffle 3, and flows out of the device body 1 through the fluid outlet 6.

[0037] Combination Figure 1 The technical idea of ​​the present invention is to use liquid convection to dissipate heat and design an embedded microfluidic heat sink. The technical structure of the present invention is: from top to bottom, it is a chip heat dissipation layer, a fluid inflow layer, and a fluid inlet 7. The overall thermal path of the present invention is: heat source - chip heat dissipation layer - fluid outflow layer - the outflowing fluid takes away the heat.

[0038] Combination Figure 2 and Figure 3 The device body 1 is 18mm long, 18mm wide and 1mm high. The chip heat dissipation layer is a concave structure with a length and width of 12mm and a concave depth of 0.2mm. It is equipped with a four-way flow rate baffle 3 with a length of 5mm, a height of 0.2mm and a width of 1mm. The chip heat dissipation layer is a fluid outflow layer. There are two fluid outflow channels 4 on the left and right sides, which are 3mm long and 0.5mm wide. The fluid flows into the fluid grooves 5 on the left and right sides through the channels. A fluid outlet 6 is opened in the middle of the groove, which is a cylinder with a radius of 1mm. The fluid flows out from here and then flows out of the device body 1. The chip heat dissipation layer is connected to the fluid inflow layer through the injection microchannel. The injection microchannel is a cylindrical structure with a radius of 0.15mm and a height of 0.1mm. The fluid inflow layer is 14mm long, 14mm wide and 0.5mm high. The bottom is connected to the fluid inlet 7, which is a cylinder with a radius of 1.5mm.

[0039] Combination Figure 4 and Figure 5 By comparing the chip heat sink with high heat dissipation performance provided by the present invention with the traditional chip heat sink, it can be seen from the temperature distribution diagram that the maximum junction temperature of the chip is reduced from 98.6°C (371.75K) to 36.0°C (309.15K), and the temperature distribution is between 20°C (293.15K) and 36.0°C (309.15K), and the temperature distribution is more uniform.

[0040] Combination Figure 6The present invention provides a chip heat sink with high heat dissipation performance. Under working conditions, the maximum thermal stress is 0.7μN. Under the combined effect of external force load and temperature change, the thermal stress in the mold can be almost ignored, and its working properties are stable.

[0041] Embodiment 1:

[0042] For high-power chip or device packaging such as LED lamp chips and IGBT tubes. The thermal power distribution on these high-power chips or devices has certain characteristics, and there are one or more parts with high thermal power. The chip heat sink with high heat dissipation performance provided by the present invention has a spray micro-channel array designed for the chip heat dissipation power distribution, which can maximize the heat dissipation efficiency and accurately dissipate heat for parts with high thermal power, so it is very suitable for high-power chip heat dissipation.

[0043] Embodiment 2:

[0044] For chips with large surfaces, such as server CPUs or PC CPUs, it can be assumed that the chip size is 40mm×40mm and the power is 160W. Generally, the overall size of the heat sink of the present invention depends on the size of the chip embedded in the concave heat dissipation layer, and the size of the chip embedded in the concave heat dissipation layer is designed according to the chip size. For power chips with different surfaces, chips with different design sizes should be embedded in the concave heat dissipation layer, and then corresponding heat sinks of different sizes should be used. The chip heat sink with high-efficiency heat dissipation performance of the present invention has no sound-generating components, so it is very suitable for server and PC chip heat dissipation.

[0045] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A chip heat sink with high heat dissipation performance, characterized in that: The device comprises a device body (1), on which a fluid groove (5), a chip embedding concave surface (2), a fluid outflow channel (4) and a fluid inlet (7) are provided; The chip embedding concave surface (2) comprises an upper chip heat dissipation layer and a lower fluid inflow layer; A fluid outlet (6) is provided in the fluid groove (5), the fluid groove (5) is connected to the fluid outflow channel (4), and the fluid outflow channel (4) is connected to the chip heat dissipation layer on the upper chip embedding concave surface (2); A flow velocity baffle (3) and an injection micro-channel (8) are provided on the upper chip heat dissipation layer of the chip embedded concave surface (2), and the injection micro-channel (8) is connected to the lower fluid inflow layer of the chip embedded concave surface (2); The lower fluid inflow layer of the chip embedded in the concave surface (2) is connected to the fluid inlet (7); The chip heat dissipation layer is a concave structure; The chip heat dissipation layer has two fluid outflow channels (4) on the left and right sides, respectively, through which the fluid flows into the fluid grooves (5) on the left and right sides; The fluid groove is a rectangular groove, the chip embedding concave surface (2) is square, the fluid outlet (6) and the fluid inlet (7) are both cylindrical, and the injection microchannel (8) is cylindrical.

2. The chip heat sink with high heat dissipation performance according to claim 1, characterized in that: The chip is embedded in the chip embedding concave layer (2).

3. The chip heat sink with high heat dissipation performance according to claim 1, characterized in that: The material used for the device body (1) is a corrosion-resistant metal material.

4. The chip heat sink with high heat dissipation performance according to claim 3, characterized in that: The corrosion-resistant metal material is copper (Cu), silver (Ag) or gold (Au).

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