Wafer material separation detection device

Abstract

The present invention relates to a wafer sorting and detection device, which is arranged between a first wafer conveying line and a second wafer conveying line, and comprises: a first sorting mechanism, which is used to sort and position wafers conveyed by the first wafer conveying line. At least one second sorting mechanism, which comprises at least one first conveying mechanism and at least one transfer mechanism for grabbing wafers. At least two second conveying mechanisms, and each second sorting mechanism corresponds to at least two second conveying mechanisms. At least two detection mechanisms, which correspond one to one with the second conveying mechanisms, are used to detect surface defects of wafers. A controller. The first sorting mechanism, the second sorting mechanism and the second conveying mechanism cooperate to move the wafer located on the first sorting mechanism to the detection mechanism for detection, and the second sorting mechanism and the second conveying mechanism cooperate to move the wafer after detection to the second wafer conveying line. The present invention is particularly suitable for large-scale wafer detection, and has high detection efficiency and high degree of automation.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer material separation detection device. Background Art

[0002] During the production process of wafers, affected by factors such as process conditions, a small amount of wafers prepared will have defects such as stains, bubbles, and holes. Therefore, surface defect detection is required before the wafers leave the factory to remove defective products. Existing wafer surface defect detection devices mostly use manual loading and unloading, and use industrial cameras to take pictures and detect. When large quantities of wafers need to be inspected, this single-station detection method cannot meet the needs. If multiple stations are added for detection, if it is still a single-person operation, the error rate will increase as the operation time goes by, which may cause defective products to be mixed with qualified products, or qualified products to be treated as defective products. If the number of operators is increased, labor waste is serious, and in the long run, the labor cost is high. Summary of the invention

[0003] The object of the present invention is to provide a wafer sorting and detection device, which can be applicable to large-scale detection of wafers and has high detection efficiency and high degree of automation.

[0004] To achieve the above object, the present invention discloses a wafer material separation detection device, which is arranged between a first wafer conveying line and a second wafer conveying line, and comprises:

[0005] The first material sorting mechanism is placed at the end of the first wafer conveying line and is used to sort and position the wafers conveyed by the first wafer conveying line.

[0006] At least one second material dividing mechanism is placed between the first material dividing mechanism and the second wafer conveying line; the second material dividing mechanism includes at least one first transporting mechanism and at least one transfer mechanism for grabbing wafers, and the first transporting mechanism drives the transfer mechanism to move back and forth between the first material dividing mechanism and the second wafer conveying line.

[0007] At least two second conveying mechanisms, and each of the second material dividing mechanisms corresponds to at least two second conveying mechanisms; the second conveying mechanisms are arranged beside the second material dividing mechanisms and are arranged at intervals along the moving direction of the transfer mechanism.

[0008] At least two detection mechanisms correspond one to one with the second transport mechanism and are used to detect surface defects of the wafer.

[0009] The controller is connected to the first material distribution mechanism, the transfer mechanism, the first conveying mechanism, the second conveying mechanism and the detection mechanism.

[0010] The first material dividing mechanism, the second material dividing mechanism and the second conveying mechanism cooperate to move the wafer on the first material dividing mechanism to the detection mechanism for detection, and the second material dividing mechanism and the second conveying mechanism cooperate to move the wafer after detection to the second wafer conveying line.

[0011] Preferably, it also includes at least one third material dividing mechanism, which is placed between the second material dividing mechanism and the second wafer conveying line, and the second material dividing mechanism and the third material dividing mechanism cooperate to move the wafer on the second material dividing mechanism to the second wafer conveying line.

[0012] Preferably, the first material distribution mechanism and the third material distribution mechanism each include a first linear motion module and at least one transmission component, and the transmission component corresponds to the second material distribution mechanism one by one.

[0013] The first linear motion module includes a first mounting frame, a first drive motor, a first guide rail, a first slider and a first screw. The first drive motor and the first guide rail are fixed on the first mounting frame, the first slider is slidably connected to the first guide rail, the first screw is drivingly connected to the output shaft of the first drive motor, and the first screw is threadedly connected to the first slider.

[0014] The conveying assembly includes a fixed frame, a conveying motor and two groups of conveying belt groups. The fixed frame is fixed on the first slider. The conveying belt group and the conveying motor are arranged on the fixed frame. The conveying motor is transmission-connected to the conveying belt group. The two groups of conveying belt groups are arranged parallel to each other. The conveying assembly cooperates with the first wafer conveying line to transfer the wafers on the first wafer conveying line to the conveying belt group.

[0015] The first material distribution mechanism further includes at least one positioning baffle for positioning the wafer, and the positioning baffle is arranged at the end position of the conveyor belt group corresponding to the first material distribution mechanism.

[0016] Preferably, each conveying component corresponding to the third material dividing mechanism is also matched with two baffles for preventing wafers from falling off, and the baffles correspond to a group of conveyor belt groups and are placed on the outside of the conveyor belt groups; the fixed frame is provided with at least two adjustment rails cooperating with the baffles, and the baffles are slidably connected to the adjustment rails.

[0017] Preferably, the second material distribution mechanism further comprises a guide rail, and the guide rails of all the second material distribution mechanisms are arranged parallel to each other; and a rack extending in the axial direction is provided on the guide rail.

[0018] The first transporting mechanism corresponds to the transfer mechanism one by one. The first transporting mechanism includes a transporting motor and a slide plate. The slide plate is slidably connected to the guide rail, and the slide plate only moves along the length direction of the guide rail. The seat of the transporting motor is fixed on the slide plate, and a traveling gear is fixed on the output shaft of the transporting motor, and the traveling gear is meshed with the rack. The transfer mechanism is arranged on the slide plate.

[0019] Preferably, the transfer mechanism comprises a rotary drive member, a linear cylinder and at least one grabbing member, the rotary drive member drives the linear cylinder to rotate, and the linear cylinder drives the grabbing member to move up and down.

[0020] Preferably, the rotary driving member is a motor or a rotary cylinder; the grabbing member comprises a mounting plate and at least one suction cup, and the suction cup is arranged on the upper surface of the mounting plate.

[0021] Preferably, the second transport mechanism includes a second linear motion module, a third linear motion module and a wafer placement table.

[0022] The second linear motion module and the third linear motion module both include a second mounting frame, a second drive motor, a second guide rail, a second slider and a second screw. The second drive motor and the second guide rail are fixed on the second mounting frame, the second slider is slidably connected to the second guide rail, the second screw is drivingly connected to the output shaft of the second drive motor, and the second screw is threadedly connected to the second slider.

[0023] The second mounting frame of the third linear motion module is fixedly connected to the second sliding block of the second linear motion module, and the wafer placement platform is fixedly connected to the second sliding block of the third linear motion module.

[0024] The wafer placement table includes a carrier plate and at least three carrier columns, one end of the carrier column is detachably connected to the carrier plate, and the other end is provided with a placement groove, and the placement grooves on all the carrier columns cooperate to form a placement space for placing wafers.

[0025] Preferably, the detection mechanism includes a mounting platform and at least one detection camera, the mounting platform includes a base plate, a stud, a crank, a sliding block and at least one sliding column, the sliding column is fixed on the base plate, the stud is rotatably connected to the base plate, the sliding block is slidably connected to the sliding column, and the sliding block is threadedly connected to the stud, and the crank is fixedly connected to one end of the stud; the base plate is also provided with scale lines, and the sliding block is provided with indicator lines matching the scale lines.

[0026] The detection camera is arranged on the sliding block.

[0027] Preferably, the mounting table also includes an adjustment table group corresponding to the detection cameras one by one, the adjustment table group includes at least one angle adjustment table, and the angle adjustment tables of the same adjustment table group are stacked and connected in sequence, the angle adjustment table located at the bottom is fixedly connected to the sliding block, and the detection camera is fixedly connected to the angle adjustment table located at the top.

[0028] The present invention has the following beneficial effects:

[0029] The present invention sorts and positions the wafers through the first material distribution mechanism, which can facilitate the grabbing of the second material distribution mechanism. The second material distribution mechanism distributes the grabbed wafers to each second transport mechanism. The second transport mechanism transports the wafers to the corresponding detection mechanism for detection. After the detection is completed, the second transport mechanism cooperates with the second material distribution mechanism again to move the detected wafers to the second wafer conveyor line. The present invention can simultaneously perform detection of multiple wafers independently and without interference, and can basically achieve the goal of leaving after wafer detection. It is particularly suitable for large-scale wafer detection, with high detection efficiency and high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the present invention.

[0031] Figure 2 It is a schematic diagram of another viewing angle of the present invention.

[0032] Figure 3 It is a schematic diagram of the first material distribution mechanism.

[0033] Figure 4 It is a schematic diagram of the third material distribution mechanism.

[0034] Figure 5 This is a schematic diagram of the transfer mechanism.

[0035] Figure 6 It is a schematic diagram of the second transport mechanism.

[0036] Figure 7 Schematic diagram of the detection mechanism.

[0037] Main component symbols:

[0038] A first wafer conveying line 11 and a second wafer conveying line 12;

[0039] Wafer 20;

[0040] A first material distributing mechanism 30, a first mounting frame 311, a first guide rail 312, a first slide block 313, a fixing frame 321, a conveying motor 322, and a positioning baffle 323;

[0041] A third material distribution mechanism 40, a stop bar 41, and an adjustment track 42;

[0042] The second material distributing mechanism 50, the guide rail 51, the slide plate 521, the transfer mechanism 53, the rotary driving member 531, the linear cylinder 532, the grabbing member 533, the mounting plate 5331, and the suction cup 5332;

[0043] A second transport mechanism 60, a second linear motion module 61, a third linear motion module 62, a wafer placement table 63, a carrier plate 631, a carrier column 632, and a placement slot 6321;

[0044] Detection mechanism 70 , bottom plate 711 , scale line 7111 , stud 712 , crank handle 713 , sliding block 714 , indicator line 7141 , slide column 715 , adjustment platform assembly 716 , detection camera 72 . DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0046] like Figures 1 to 7 As shown, the present invention discloses a wafer material distribution detection device, which is arranged between the first wafer conveying line 11 and the second wafer conveying line 12. The wafer material distribution detection device includes: a controller, a first material distribution mechanism 30, two sets of second material distribution mechanisms 50, a third material distribution mechanism 40, eight sets of second conveying mechanisms 60 and eight sets of detection mechanisms 70. The first material distribution mechanism 30 is arranged at the end of the first wafer conveying line 11, the third material distribution mechanism 40 is arranged at the front end of the second wafer conveying line 12, and the two sets of second material distribution mechanisms 50 are placed between the first material distribution mechanism 30 and the third material distribution mechanism 40, and the two sets of second material distribution mechanisms 50 are arranged side by side along the conveying direction perpendicular to the first wafer conveying line 11. Each second material distribution mechanism 50 can cooperate with the first material distribution mechanism 30 and the third material distribution mechanism 40. Among them, every four sets of second transport mechanisms 60 correspond to one set of second material dividing mechanisms 50, and the second transport mechanisms 60 are arranged next to the second material dividing mechanisms 50, and the second transport mechanisms 60 are arranged at equal intervals in the direction of the connection between the first wafer conveying line 11 and the second wafer conveying line 12. The eight sets of detection mechanisms 70 correspond one to one with the eight sets of second transport mechanisms 60. Of course, when the second wafer conveying line 12 is wide enough or the second wafer conveying line 12 is provided with a bifurcated section corresponding to the second material dividing mechanism 50, the third material dividing mechanism 40 can be cancelled.

[0047] The first material sorting mechanism 30 is used to sort and transport the wafers 20 transported by the first wafer conveying line 11 to a designated position for positioning. The third material sorting mechanism 40 is used to collect and transport the wafers 20 on the second material sorting mechanism 50 to the second wafer conveying line 12. The first material sorting mechanism 30 and the third material sorting mechanism 40 both include a first linear motion module and two sets of conveying components, and the conveying components correspond to the second material sorting mechanism 50 one by one.

[0048] The first linear motion module includes a first mounting frame 311, a first driving motor, a first guide rail 312, a first slider 313 and a first screw. The first driving motor and the first guide rail 312 are fixed on the first mounting frame 311, the first slider 313 is slidably connected to the first guide rail 312, and the first slider 313 can only move along the length direction of the first guide rail 312. The first screw is transmission-connected to the output shaft of the first driving motor, and the first screw is threadedly connected to the first slider 313. The first slider 313 is restricted by the first guide rail 312 and cannot rotate. When the first driving motor is running, the first screw rotates, thereby driving the first slider 313 to move along the length direction of the first guide rail 312. The first driving motor is connected to the controller.

[0049] The transmission assembly includes a fixed frame 321, a transmission motor 322 and two transmission belt groups. The fixed frame 321 is fixed on the first slider 313, and the transmission belt group and the transmission motor 322 are arranged on the fixed frame 321. The transmission belt group includes a belt and a plurality of pulleys, and the belt is wound around each pulley at the same time, and the pulley supports, limits and tightens the belt. The transmission motor 322 is connected to one of the pulleys of the transmission belt group. The two transmission belt groups are arranged parallel to each other, and the transmission assembly cooperates with the first wafer conveying line 11 to transfer the wafer 20 on the first wafer conveying line 11 to the transmission belt group. The transmission motor 322 is connected to the controller.

[0050] In the first material distribution mechanism 30, two positioning baffles 323 for positioning the wafer 20 are also fixed on the fixed frame 321, and the two positioning baffles 323 are arranged at the end position of the conveyor belt group. The wafer 20 is driven by the conveyor assembly and then blocked and positioned by the positioning baffles 323 at the end position of the conveyor belt group.

[0051] In the third material distribution mechanism 40, each conveying assembly is also matched with two baffles 41 for preventing the wafer 20 from falling off. The baffles 41 correspond to a group of conveying belts and are placed on the outside of the conveying belts. At least two adjustment rails 42 that cooperate with the baffles 41 are provided on the fixed frame 321. The baffles 41 are slidably connected to the adjustment rails 42. The baffles 41 are made of rubber strips, which have friction with the adjustment rails 42 and will not move easily. By adjusting the position of the baffles 41 on the adjustment rails 42, wafers 20 of different specifications can be limited, avoiding the problem of wafers 20 falling when the second material distribution mechanism 50 and the third material distribution mechanism 40 cooperate with the transition wafer 20.

[0052] The second material distribution mechanism 50 includes a guide rail 51, a first conveying mechanism and a transfer mechanism 53 for grabbing the wafer 20. Of course, when one set of the second material distribution mechanism 50 corresponds to more second conveying mechanisms 60, two or more first conveying mechanisms can be set, and the transfer mechanism 53 corresponds to the first conveying mechanism one by one. The first conveying mechanism is movably arranged on the guide rail 51 and drives the transfer mechanism 53 to move back and forth between the first material distribution mechanism 30 and the third material distribution mechanism 40.

[0053] The first transport mechanism includes a transport motor and a slide plate 521. The transport motor is connected to the controller. The slide plate 521 is slidably connected to the guide rail 51, and the slide plate 521 only moves along the length direction of the guide rail 51. The seat of the transport motor is fixed on the slide plate 521, a travel gear is fixed on the output shaft of the transport motor, and a rack extending in the axial direction is provided on the guide rail 51. The travel gear meshes with the rack. When the transport motor is running, the slide plate 521 moves along the length direction of the guide rail 51.

[0054] The transfer mechanism 53 is arranged on the slide 521, including a rotary drive member 531, a linear cylinder 532 and two to four sets of grabbing members 533. When the diameter of the wafer 20 to be grabbed is small, more grabbing members 533 can be arranged. The rotary drive member 531 and the linear cylinder 532 are both connected to the controller. The rotary drive member 531 can be a motor or a rotary cylinder. The seat of the rotary drive member 531 is fixed on the slide 521, and the output shaft of the rotary drive member 531 is connected to the seat of the linear cylinder 532. The rotary drive member 531 drives the linear cylinder 532 to rotate. The push rod of the linear cylinder 532 is fixedly connected to the grabbing member 533. A mounting platform can be arranged on the push rod of the linear cylinder 532 to fix the grabbing member 533. The linear cylinder 532 drives the grabbing member 533 to move up and down.

[0055] The gripping member 533 includes a mounting plate 5331 and a plurality of suction cups 5332, and the suction cups 5332 are arranged on the upper surface of the mounting plate 5331. The suction cups 5332 are generally rubber suction cups 5332. When the suction cups 5332 contact the wafer 20, the edge of the suction cups 5332 can fit with the wafer 20, and have a certain friction force, which can prevent the wafer 20 from falling off during movement. At the same time, the suction cups 5332 can also play a buffering role. Of course, the suction cups 5332 can also be connected to the air source, and the wafer 20 can be grasped by negative pressure air adsorption. At this time, an air valve should be configured to control the on and off of the air source, and the air valve needs to be connected to the controller. The gripping member 533 can extend into the gap between the two conveyor belt assemblies, and the linear cylinder 532 can lift up to grab the wafer 20 from the conveyor belt assembly.

[0056] The second transport mechanism 60 includes a second linear motion module 61 , a third linear motion module 62 and a wafer placement table 63 .

[0057] The second linear motion module 61 and the third linear motion module 62 are the same as the first linear motion module, and both the second linear motion module 61 and the third linear motion module 62 include a second mounting frame, a second drive motor, a second guide rail, a second slider and a second screw. The second drive motor and the second guide rail are fixed on the second mounting frame, the second slider is slidably connected to the second guide rail, the second screw is drivingly connected to the output shaft of the second drive motor, and the second screw is threadedly connected to the second slider. The second mounting frame of the third linear motion module 62 is fixedly connected to the second slider of the second linear motion module 61, and the wafer placement table 63 is fixedly connected to the second slider of the third linear motion module 62. The second drive motor is connected to the controller.

[0058] The wafer placement table 63 includes a carrier plate 631 and four carrier columns 632. One end of the carrier column 632 is detachably connected to the carrier plate 631 (such as plug-in or threaded connection), and the other end is provided with a placement groove 6321. The placement grooves 6321 on all the carrier columns 632 cooperate to form a placement space for placing the wafer 20. The placement space can limit the position of the wafer 20 during the movement. In order to adapt to wafers 20 of different specifications, multiple groups of sockets or threaded holes can be set on the carrier plate 631. Different groups of sockets or threaded holes cooperate with the carrier columns 632 to form placement spaces of different sizes.

[0059] The detection mechanism 70 is used to detect surface defects of the wafer 20, including a mounting table and at least one detection camera 72. The detection camera 72 is connected to the controller. The detection camera 72 takes photos of the wafer 20 for detection and feeds back the detection results to the controller. The photo detection technology of the detection camera 72 is an existing mature technology and will not be repeated. The mounting table includes a base plate 711, a stud 712, a crank 713, a sliding block 714 and two sliding columns 715. The sliding column 715 is fixed on the base plate 711, the stud 712 is rotatably connected to the base plate 711, the sliding block 714 is slidably connected to the sliding column 715, and the sliding block 714 is threadedly connected to the stud 712, and the crank 713 is fixedly connected to one end of the stud 712. Shake the crank 713, and the sliding block 714 moves along the length direction (vertical direction) of the sliding column 715. An adjustment table group 716 corresponding to the detection camera 72 is provided on the sliding block 714, and the adjustment table group 716 includes at least one angle adjustment table, and the angle adjustment tables of the same adjustment table group 716 are stacked and connected in sequence, the angle adjustment table located at the bottom is fixedly connected to the sliding block 714, and the detection camera 72 is fixedly connected to the angle adjustment table located at the top. By setting the adjustment table group 716, the horizontal position of the detection camera 72 can be adjusted to a certain extent to adapt to different wafer 20 detections. In addition, a scale line 7111 is also provided on the bottom plate 711, and an indicator line 7141 matched with the scale line 7111 is provided on the sliding block 714. Through the coordination of the scale line 7111 and the indicator line 7141, and the setting of the angle adjustment table, the position of the detection camera 72 can be accurately located. In this case, each inspection mechanism 70 is configured with three inspection cameras 72, and the three inspection cameras 72 are respectively used to detect different types of surface defects, such as one for detecting bubbles, one for detecting stains, and one for detecting pits. Through the above method, the inspection efficiency of a single wafer 20 can be greatly improved.

[0060] The working principle of the present invention is as follows: the wafer 20 is transported to one of the conveying components of the first material sorting mechanism 30 through the first wafer conveying line 11. At this time, the other conveying component can just dock with the second material sorting mechanism 50 close to it. Within one action cycle of the first moving module, the two conveying components also complete the sorting of the wafer 20 once. The working principle of the third material sorting mechanism 40 is similar to that of the first material sorting mechanism 30, which will not be repeated. The first conveying mechanism drives the transfer mechanism 53 to grab the wafer 20 from the conveying component. The transfer mechanism 53 can grab multiple wafers at a time. Generally, a grabbing member 533 is left vacant to replace the wafer 20 that has been inspected. When the first conveying mechanism sends the transfer mechanism 53 to the position corresponding to the second conveying mechanism 60, the transfer mechanism 53 and the second conveying mechanism 60 cooperate to grab the wafer 20 that has been inspected and replace it with a wafer 20 to be inspected, and then the second conveying mechanism 60 sends the wafer 20 to be inspected to the bottom of the inspection mechanism 70 for inspection. When all the wafers 20 to be inspected on the second material-dividing mechanism 50 are used up or the second material-dividing mechanism 50 does not need to load the second transport mechanism 60, the second material-dividing mechanism 50 sends the inspected wafers 20 to the third material-dividing mechanism 40 for output, and after unloading, returns to the first material-dividing mechanism 30 to grab another batch of wafers 20 to be inspected. The wafer 20 holding capacity of the conveyor belt group on the first material-dividing mechanism 30 and the third material-dividing mechanism 40 is generally not less than the number of the grabbing members 533.

[0061] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A wafer material separation detection device, characterized in that: It is arranged between the first wafer conveying line and the second wafer conveying line, and includes: A first material sorting mechanism is disposed at the end of the first wafer conveying line and is used to sort and position the wafers conveyed by the first wafer conveying line; At least one second material distribution mechanism is placed between the first material distribution mechanism and the second wafer conveying line; the second material distribution mechanism includes at least one first conveying mechanism and at least one transfer mechanism for grabbing wafers, and the first conveying mechanism drives the transfer mechanism to move back and forth between the first material distribution mechanism and the second wafer conveying line; At least two second conveying mechanisms, and each second material distribution mechanism corresponds to at least two second conveying mechanisms; the second conveying mechanisms are arranged beside the second material distribution mechanism and spaced apart along the moving direction of the transfer mechanism; At least two detection mechanisms, corresponding one to one with the second transport mechanism, for detecting surface defects of the wafer; A controller, connected to the first material distribution mechanism, the transfer mechanism, the first conveying mechanism, the second conveying mechanism and the detection mechanism; The first material dividing mechanism, the second material dividing mechanism and the second conveying mechanism cooperate to move the wafer located on the first material dividing mechanism to the detection mechanism for detection, and the second material dividing mechanism and the second conveying mechanism cooperate to move the wafer after detection to the second wafer conveying line; At least one third material dividing mechanism, the third material dividing mechanism is placed between the second material dividing mechanism and the second wafer conveying line, the second material dividing mechanism and the third material dividing mechanism cooperate to move the wafer on the second material dividing mechanism to the second wafer conveying line; The first material distribution mechanism and the third material distribution mechanism both include a first linear motion module and at least one transmission component, and the transmission component corresponds to the second material distribution mechanism one by one; the first linear motion module includes a first mounting frame, a first driving motor, a first guide rail, a first slider and a first screw, the first driving motor and the first guide rail are fixed on the first mounting frame, the first slider is slidably connected to the first guide rail, the first screw is transmission-connected to the output shaft of the first driving motor, and the first screw is threadedly connected to the first slider; the transmission component includes a fixed frame, a transmission motor and two groups of transmission belt groups, the fixed frame is fixed on the first slider, the transmission belt group and the transmission motor are arranged on the fixed frame, and the transmission motor is transmission-connected to the transmission belt group, and the two groups of transmission belt groups are arranged parallel to each other; the transmission component cooperates with the first wafer conveyor line to transfer the wafers on the first wafer conveyor line to the transmission belt group; The first material distribution mechanism further includes at least one positioning baffle for positioning the wafer, and the positioning baffle is arranged at the end position of the conveyor belt group corresponding to the first material distribution mechanism.

2. The wafer material separation detection device according to claim 1, characterized in that: Each conveying component corresponding to the third material dividing mechanism is also matched with two baffles for preventing wafers from falling off, and the baffles correspond to a group of conveyor belt groups and are placed on the outside of the conveyor belt groups; the fixed frame is provided with at least two adjustment rails cooperating with the baffles, and the baffles are slidably connected to the adjustment rails.

3. The wafer material separation detection device according to claim 1, characterized in that: The second material distribution mechanism further comprises a guide rail, and the guide rails of all the second material distribution mechanisms are arranged parallel to each other; a rack extending in the axial direction is provided on the guide rail; The first transporting mechanism corresponds to the transfer mechanism one by one. The first transporting mechanism includes a transporting motor and a slide plate. The slide plate is slidably connected to the guide rail, and the slide plate only moves along the length direction of the guide rail. The seat of the transporting motor is fixed on the slide plate, and a traveling gear is fixed on the output shaft of the transporting motor, and the traveling gear is meshed with the rack. The transfer mechanism is arranged on the slide plate.

4. The wafer material separation detection device according to claim 1, characterized in that: The transfer mechanism includes a rotary drive member, a linear cylinder and at least one grabbing member. The rotary drive member drives the linear cylinder to rotate, and the linear cylinder drives the grabbing member to move up and down.

5. The wafer material separation detection device according to claim 4, characterized in that: The rotary driving member is a motor or a rotary cylinder; the grabbing member comprises a mounting plate and at least one suction cup, and the suction cup is arranged on the upper surface of the mounting plate.

6. The wafer material separation detection device according to claim 1, characterized in that: The second transport mechanism includes a second linear motion module, a third linear motion module and a wafer placement table; The second linear motion module and the third linear motion module both include a second mounting frame, a second drive motor, a second guide rail, a second slider and a second screw, wherein the second drive motor and the second guide rail are fixed to the second mounting frame, the second slider is slidably connected to the second guide rail, the second screw is drivingly connected to the output shaft of the second drive motor, and the second screw is threadedly connected to the second slider; The second mounting frame of the third linear motion module is fixedly connected to the second slider of the second linear motion module, and the wafer placement table is fixedly connected to the second slider of the third linear motion module; The wafer placement table includes a carrier plate and at least three carrier columns, one end of the carrier column is detachably connected to the carrier plate, and the other end is provided with a placement groove, and the placement grooves on all the carrier columns cooperate to form a placement space for placing wafers.

7. The wafer material separation detection device according to claim 1, characterized in that: The detection mechanism includes a mounting platform and at least one detection camera, the mounting platform includes a base plate, a stud, a crank, a sliding block and at least one sliding column, the sliding column is fixed to the base plate, the stud is rotatably connected to the base plate, the sliding block is slidably connected to the sliding column, and the sliding block is threadedly connected to the stud, and the crank is fixedly connected to one end of the stud; the base plate is also provided with scale lines, and the sliding block is provided with indicator lines that match the scale lines; The detection camera is arranged on the sliding block.

8. The wafer material separation detection device according to claim 7, characterized in that: The mounting platform also includes an adjustment platform group corresponding to the detection cameras one by one, the adjustment platform group includes at least one angle adjustment platform, and the angle adjustment platforms of the same adjustment platform group are stacked and connected in sequence, the angle adjustment platform located at the bottom is fixedly connected to the sliding block, and the detection camera is fixedly connected to the angle adjustment platform located at the top.

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